EP2A70B724I-7 - 70k LE APEX II FPGA, BGA-724, Industrial | Intel
部品番号: EP2A70B724I-7 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $425 | $4,250.00 |
| 100 | $365 | $36,500.00 |
| 500 | $295 | $147,500.00 |
| 1,000 | $245 | $245,000.00 |
EP2A70B724I-7 概要
The APEX II family occupies the programmable logic device category in the broader semiconductor hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. APEX II FPGAs are fabricated on a sub-micron CMOS process and offer multi-voltage I/O standards including LVTTL, LVCMOS, PCI, SSTL, and GTL+, enabling direct interfacing with a wide range of memory and bus standards without external translators. Each embedded system block provides dual-port RAM, ROM, product-term logic, and dedicated arithmetic chains, allowing the same silicon to implement FIFOs, CAMs, multipliers, and registered memories.
Key features of the EP2A70B724I-7 include approximately 70,000 logic elements (per family marketing), 156,000 to 220,000 typical system gates depending on configuration, multiple embedded system blocks, multi-standard I/O support, and in-system programmability through the IEEE 1149.1 (JTAG) interface or passive/active serial configuration. The "I-7" suffix denotes the industrial temperature grade and a speed grade of -7. The BGA-724 package provides the pin density required to expose the full I/O and supply the power-distribution network needed for the device's logic capacity.
Typical applications include high-speed telecommunications line cards, network switches and routers, RAID controllers, channel cards for storage area networks, DSP co-processing, and glue logic for complex processor subsystems. The 724-ball BGA package supports high pin-count board layouts where the large logic and memory resources of the device are fully utilized.
When designing with this device, ensure the PCB has a minimum of six PCB layers with dedicated power and ground planes to maintain signal integrity for the LVTTL/LVCMOS and SSTL I/O. Provide a JTAG header for in-system programming and boundary-scan test, and follow the Altera configuration device datasheet for selecting compatible EPC4, EPC8, or EPC16 configuration memories when using passive or active serial modes.
This page synthesizes distributor pricing, FPGA family alternatives, and APEX II design considerations not found in the original datasheet, giving engineers an integrated view of availability, footprint compatibility, and supply-chain options for legacy Altera FPGA designs.
ドロップイン代替品: EP2A70B724I-7 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2A70B724I-7 （同一形状・フットプリント） — 相違点: Process Technology, Package, Speed Grade, System Gates, Configuration Method.
クイック比較ツール — 並列比較する代替部品を選択:
EP2A70B724C9N
✅ ドロップイン✓ 在庫あり
$195 / 個
データシートを見る →EP2A70B724C9ES
✅ ドロップイン✓ 在庫あり
$1250 / 個
データシートを見る →EP2A70B724C9
✅ ドロップイン✓ 在庫あり
$998.27 / 個
データシートを見る →EP2A70B724C8N
✅ ドロップイン✓ 在庫あり
$240 / 個
データシートを見る →EP2A70B724C8
✅ ドロップイン✓ 在庫あり
$1250 / 個
データシートを見る →EP2A70B724C7N
✅ ドロップイン✓ 在庫あり
$188 / 個
データシートを見る →EP2A70B724C7ES
✅ ドロップイン✓ 在庫あり
$2190 / 個
データシートを見る →EP2A70B724C7
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP2A70B724I-7 最大定格＆電気的特性
| Family | APEX II |
| Logic Elements | 70,000 (EP2A70 family variant) |
| パッケージ | BGA-724 |
| Temperature Grade | Industrial |
| Speed Grade | -7 |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL, GTL+ |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial, Active Serial |
| Process Technology | CMOS |
| 実装タイプ | Surface Mount (BGA) |
| Peak Reflow Temperature | 220 C |
EP2A70B724I-7 bga-724 ピン配置ガイド
EP2A70B724I-7 (bga-724 パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2A70B724I-7.
詳細は データシート をご参照ください。
主な用途
EP2A70B724I-7 の用途: 7 件s: Telecommunications Line Card, Network Switch / Router Datapath, RAID / Storage Channel Card, DSP Co-Processor / Accelerator, Glue Logic for Processor Subsystems, Industrial Test & Measurement Instrumentation, Legacy Avionics / Defense Backplane.
Telecommunications Line Card
The EP2A70B724I-7 fits legacy telecommunications line cards because its 70,000 logic elements and embedded system blocks (ESBs) implement ATM segmentation-and-reassembly, packet classification, and HDLC framing on a single device. Multi-standard I/O (LVTTL, LVCMOS, SSTL, GTL+) connects directly to UTOPIA, POS-PHY and standard bus interfaces without external translators, eliminating level shifters and reducing BOM. The BGA-724 footprint allows the full I/O count required for parallel bus interfaces to network processors. Industrial temperature grading supports outside-plant and central-office environments where ambient can swing across the -40C to +85C industrial window.
おすすめ
Network Switch / Router Datapath
In network switches and routers the EP2A70B724I-7 implements Layer-2/Layer-3 forwarding tables, queue managers and ACL engines with deterministic throughput because the ESBs provide dual-port RAM at chip frequency. The 70,000 logic elements accommodate full IPv4/IPv6 longest-prefix-match pipelines and traffic-shaping policers in a single device. Multi-bank I/O standards allow direct connection to external TCAMs, RLDRAM and network PHYs without glue logic, lowering latency. Industrial temperature grading suits enterprise switching products where chassis intake temperatures approach the upper commercial limit.
おすすめ
RAID / Storage Channel Card
The EP2A70B724I-7 is well suited to RAID controllers and storage channel cards because its ESBs implement dual-port FIFOs between Fibre Channel or SAS front ends and the host PCI/X bus. Embedded arithmetic chains accelerate XOR/parity generation across multiple drives for RAID-5/6, replacing dedicated parity ASICs. The large user-I/O count available in the BGA-724 footprint exposes enough channels to manage 8-16 drives per FPGA. Industrial temperature grading supports dense storage chassis that recirculate warm exhaust back across the board.
おすすめ
DSP Co-Processor / Accelerator
The EP2A70B724I-7 accelerates DSP functions by mapping multiplications and accumulations into ESB arithmetic chains, freeing the host CPU from FFT, FIR, and convolutional-coding workloads. With 70,000 logic elements, multiple parallel datapaths fit simultaneously for baseband processing in software-defined radio and imaging pipelines. LVCMOS and SSTL I/O standards allow connection to high-bandwidth ADC/DAC devices directly. Industrial temperature grading supports embedded compute platforms and outdoor base-station enclosures.
おすすめ
Glue Logic for Processor Subsystems
The EP2A70B724I-7 serves as the central glue-logic device in complex processor subsystems, consolidating address decoding, bus arbitration, interrupt controllers, and peripheral bridges that would otherwise span multiple CPLDs. Its large logic capacity allows bridging between PCI, local-bus and memory interfaces with deterministic timing. Multi-standard I/O banks support mixed-voltage signals (LVTTL + GTL+ + SSTL) on the same die. The BGA-724 footprint supports the high pin count required for full 64-bit bus bridges.
おすすめ
Industrial Test & Measurement Instrumentation
The EP2A70B724I-7 is used in industrial test and measurement instrumentation because its logic density supports timing generators, pattern sequencers and protocol-decoder state machines in a single chip. ESBs implement deep capture buffers and dual-port RAM for waveform storage, and multi-standard I/O standards connect directly to ADC front ends and LVDS probe interfaces. The industrial -40C to +85C temperature grading supports factory-floor and outdoor measurement applications where cooling is limited. JTAG-based in-system programming allows firmware updates without removing the board.
おすすめ
Legacy Avionics / Defense Backplane
The EP2A70B724I-7 remains in service on legacy avionics and defense backplanes because the APEX II family was qualified for those programs and qualified-boards cannot easily be redesigned. The 70,000 logic elements and ESBs implement MIL-STD-1553, ARINC 429 and custom backplane protocols on a single device. The industrial temperature grade satisfies cockpit and equipment-bay thermal envelopes. Long-term availability through brokers and independent distributors supports sustainment programs that cannot redesign the FPGA each redesign cycle.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2A70B724I-7 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2A70B724C9N | EP2A70B724C9ES | EP2A70B724C9 | EP2A70B724C8N | EP2A70B724C7N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | BGA-724 | BGA-724 - same | BGA-724 - same | BGA-724 - same | BGA-724 - same | BGA-724 - same |
| Family | APEX II | APEX II - same | APEX II - same | APEX II - same | APEX II - same | APEX II - same |
| Logic Elements | 70,000 | 70,000 | 70,000 | 70,000 | 70,000 | 70,000 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial |
| Speed Grade | -7 | -9 (faster) | -9 (faster) | -9 (faster) | -8 (faster) | -7 (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete (ES) | Obsolete | Obsolete | Obsolete |
| Approx. qty-1 Unit Price (USD) | $485.00 | $420.00 | $395.00 | $410.00 | $440.00 | $470.00 |
| Configuration Interface | JTAG, Passive/Active Serial | JTAG, Passive/Active Serial - same | JTAG, Passive/Active Serial - same | JTAG, Passive/Active Serial - same | JTAG, Passive/Active Serial - same | JTAG, Passive/Active Serial - same |
主な差別化要因
- Industrial temperature grade at -7 speed （vs EP2A70B724C9N)
- Same die and footprint across all C7-C9 variants （vs EP2A40B724I-7)
- BGA-724 highest I/O count of APEX II （vs EP2A70F672 series)
設計ノート
The BGA-724 package requires a minimum six-layer PCB with dedicated power and ground planes to maintain signal integrity across LVTTL, LVCMOS, SSTL and GTL+ I/O standards. Use a 1.0 mm or finer BGA pitch land pattern per JEDEC MO-192, with micro-solder paste apertures. Provide at least four stitching vias around the BGA-724 perimeter to suppress ground bounce, and route all differential pairs with matched length to avoid setup/hold violations on the APEX II ESBs.
Estimated: an EP2A70 device toggling 60 percent of 70k logic elements at 100 MHz can dissipate up to ~5 W of dynamic power; design the PCB with a copper-pour heat-spreader under the BGA-724 thermal balls and at least 8 thermal vias to the inner ground plane. Insufficient thermal relief causes junction temperature rise above the 125 C limit. Provide a JTAG header pinout compatible with the Altera ByteBlaster/USB-Blaster download cables for in-system programming and boundary-scan test.
The EPC4, EPC8 and EPC16 Enhanced Configuration Devices each store different bitstream sizes; use the EPC16 for the EP2A70 because smaller EPCs will overflow during configuration. Selecting passive serial vs active serial mode changes the board-level footprint of the configuration memory - confirm against the Altera Configuration Handbook. Do not substitute the EP2A40 die for the EP2A70 unless the design has been re-synthesized for the smaller device; the same bitstream will not fit on the smaller ESB array.
コンプライアンス情報
Compliance fields not present in the verified distributor data provided. 220 C peak-reflow temperature published by Altera is consistent with Pb-free assembly, but a definitive RoHS / REACH statement should be confirmed against the Intel MDDS documentation. AEC-Q100 not applicable - FPGAs are not qualified automotive ICs under that standard; consult the AEC-Q100 family equivalents separately if required.
