EP2A70B724I7 - APEX II FPGA 3M Gates 67200 Cells 420MHz 1.5V 724-FCBGA | Intel
部品番号: EP2A70B724I7 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $222 | $111,000.00 |
| 1,000 | $198.5 | $198,500.00 |
EP2A70B724I7 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, all of which can be re-programmed after manufacture. APEX II belongs to the broader hierarchy of programmable logic devices (PLDs), sitting between traditional CPLDs (Complex Programmable Logic Devices) and modern SoC FPGAs. The 3 M-gate class places EP2A70B724I7 in the high-density tier, alongside DSP and embedded-processor cores, typically used for data-path and bus-interface glue logic.
Key features include 67200 logic elements, approximately 429 Kbits of embedded system memory (ESBs), 4 PLLs, 8 True-LVDS channels, multi-voltage I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) on a per-bank basis, and JTAG-based in-system programmability via IEEE 1149.1 (Boundary-Scan) and IEEE 1532 (ISP). The 724-pin FCBGA package exposes the maximum I/O count of the family, enabling wide parallel buses and high-pin-count ASIC replacement designs.
The architecture combines a MultiCore array, look-up-table-based logic elements, fast row/column interconnect, and embedded memory blocks. The 0.15 um process and 1.5 V VCCINT minimize dynamic power, while the True-LVDS interface delivers source-synchronous signaling for video, telecom, and backplane applications up to 840 Mbps per channel.
Typical applications include high-speed communications backplanes, ASIC prototyping, video broadcast equipment, military and aerospace signal processing, and industrial control systems. The wide I/O count also makes it a frequent choice for legacy PCI, RapidIO, and custom parallel bus bridges. The industrial temperature grade (-40 C to +100 C case) supports deployment in harsher environments than commercial-grade FPGAs.
When designing with EP2A70B724I7, follow Intel/Altera APEX II layout guidelines: provide solid VCCINT and VCCIO planes with low-ESR decoupling placed within 5 mm of every supply pin, and respect the simultaneous-switching-output (SSO) limits in the family datasheet. This device is mature (introduced circa 2002) and is now typically sourced through distributors stocking obsolete or last-time-buy inventory; design teams should plan a long-term supply path or pin-compatible migration to APEX 20K/Stratix families.
This page synthesizes distributor availability, parametric equivalents, and APEX II design guidance not bundled in the legacy datasheet, helping engineers evaluate lifecycle risk and migration options in a single view.
ドロップイン代替品: EP2A70B724I7 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2A70B724I7 （同一形状・フットプリント） — 相違点: System Gates, Package, Process Technology, Operating Temperature, Maximum Internal Frequency.
クイック比較ツール — 並列比較する代替部品を選択:
EP2A70B724I-8
✅ ドロップイン✓ 在庫あり
$119 / 個
データシートを見る →EP2A70B724I-9
✅ ドロップイン✓ 在庫あり
$925 / 個
データシートを見る →EP2A70B724C9N
✅ ドロップイン✓ 在庫あり
$195 / 個
データシートを見る →EP2A70B724C8N
✅ ドロップイン✓ 在庫あり
$240 / 個
データシートを見る →EP2A70B724C7N
✅ ドロップイン✓ 在庫あり
$188 / 個
データシートを見る →EP2A40B724I7
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$215 / 個
データシートを見る →EP2A70B724I7 最大定格＆電気的特性
| Family | APEX II |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 67200 |
| Maximum System Gates | 3 M |
| Maximum User I/O Pins | approximately 422 (724-pin FCBGA) |
| Process Technology | 0.15 um CMOS |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltages Supported | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| PLL Blocks | 4 |
| True-LVDS Channels | 8 |
| Maximum Internal Frequency | 420 MHz |
| パッケージ | 724-pin FCBGA (FineLine BGA) |
| Operating Temperature Grade | Industrial (-40 C to +100 C case) |
| Configuration Interface | JTAG (IEEE 1149.1) / IEEE 1532 ISP |
EP2A70B724I7 724-pin fcbga (fineline bga) ピン配置ガイド
EP2A70B724I7 (724-pin fcbga (fineline bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2A70B724I7.
詳細は データシート をご参照ください。
主な用途
EP2A70B724I7 の用途: 6 件s: Telecom Backplane Aggregation, ASIC Prototyping and Emulation, Video Broadcast Processing, Military and Aerospace Signal Processing, Industrial Control and Factory Automation, Legacy PCI and Parallel Bus Bridging.
Telecom Backplane Aggregation
The EP2A70B724I7 fits telecom backplane aggregation because its 3M system gates and 8 True-LVDS channels deliver 840 Mbps source-synchronous signaling across 4+ parallel lanes, while the 724-pin FCBGA exposes enough user I/O for OC-48/STM-16 framers. Industrial temperature grade ensures reliable operation in central-office environments. Used between a TDM framer and a network processor, it can perform rate adaptation, channelization, and clock-domain crossing using its 4 PLLs. Compared to a discrete ASIC, the FPGA allows late-stage protocol changes without respin.
おすすめ
ASIC Prototyping and Emulation
The EP2A70B724I7 is widely used for ASIC prototyping because its 3M gate capacity and 67200 logic elements map directly to mid-complexity ASIC RTL. The Quartus II toolchain supports incremental compile and partition-based synthesis, allowing engineering teams to validate multi-million-gate ASICs before tape-out. Industrial temperature grade also enables validation of automotive/industrial ASICs under thermal stress. The 724-pin FCBGA footprint provides sufficient I/O for memory buses and transactor interfaces. Migrating the prototype to APEX 20K is straightforward for forward compatibility.
おすすめ
Video Broadcast Processing
The EP2A70B724I7 fits HD-SDI and DVB-ASI video processing because its 8 True-LVDS channels and 420 MHz fabric handle 1.485 Gbps SDI streams with embedded audio and ancillary data. The 3M-gate capacity supports real-time de-interlacing, scaling, and frame-rate conversion. Industrial temperature grade covers broadcast-equipment racks and outdoor enclosures. The 724-pin FCBGA exposes enough I/O for multi-stream ingest plus downstream ASI outputs. Power consumption is modest at 1.5 V VCCINT even at full fabric utilization.
おすすめ
Military and Aerospace Signal Processing
The EP2A70B724I7 is used in defense signal-processing subsystems where mature silicon, long-term data retention, and industrial temperature range are valued. The 3M-gate fabric supports radar pre-processing, EW channelization, and secure-comm modem functions. Its 724-pin FCBGA package with controlled-impedance interconnect is well suited to ruggedized PCB stack-ups. Combined with rad-tolerant memory and ADC companions, it forms the core of legacy radar and EW designs. Long-term support programs often stock this device for sustainment through 2030.
おすすめ
Industrial Control and Factory Automation
The EP2A70B724I7 fits industrial control systems because its 1.5 V core and industrial temperature grade deliver reliable operation in factory environments with -40 C to +85 C ambient swings. Its 3M gates support real-time EtherCAT, PROFINET, or custom field-bus MAC implementations alongside motor-control loops. The 8 True-LVDS channels can drive high-speed encoders and resolvers directly. Quartus II and Qsys streamline development of multi-axis motion controllers. Legacy PLC platforms continue to use APEX II for backward compatibility.
おすすめ
Legacy PCI and Parallel Bus Bridging
The EP2A70B724I7 is a popular choice for legacy PCI, PCI-X, and VME bus bridges because the 724-pin FCBGA package exposes sufficient user I/O for 32- and 64-bit parallel buses plus sideband signals. The 3M gates accommodate the full PCI target/master state machine plus scatter-gather DMA and address translation. Industrial temperature grade supports long-life embedded computing platforms. Quartus II reference designs for PCI 33/66 are still maintained. Migration to Cyclone IV/IV GX for new designs is recommended but requires PCB rework.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2A70B724I7 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2A70B724I-8 | EP2A70B724I-9 | EP2A70B724C9N | EP2A70B724C8N | EP2A40B724I7 |
|---|---|---|---|---|---|---|
| Package | 724-pin FCBGA | 724-pin FCBGA - same | 724-pin FCBGA - same | 724-pin FCBGA - same | 724-pin FCBGA - same | 724-pin FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| Speed Grade | -7 | -8 (faster) | -9 (fastest) | -9 | -8 | -7 |
| Temperature Grade | Industrial (-40 C to +100 C) | Industrial | Industrial | Commercial (0 to +85 C) | Commercial | Industrial |
| Logic Elements | 67200 | 67200 | 67200 | 67200 | 67200 | approximately 40000 (-40%) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- Drop-in speed grade upgrade available in same FCBGA-724 footprint （vs EP2A70B724I-8)
- Higher-density migration path within same family and package （vs EP2A70B724I-9)
- Industrial temperature grade vs commercial equivalents （vs EP2A70B724C9N)
- Same package across speed and temperature grades （vs EP2A40B724I7)
設計ノート
EP2A70B724I7 requires a 1.5 V VCCINT rail capable of delivering up to 2-3 A during full-fabric utilization with high toggle rates. Use a buck converter with at least 30% headroom above worst-case ICCINT and place low-ESR ceramic decoupling within 5 mm of every supply pin. VCCIO banks must ramp monotonically and within 100 ms of VCCINT to prevent I/O latch-up. A reset controller such as the LTC2923 should hold nCONFIG low until both rails are stable.
Estimated: at 1.5 V VCCINT and 100% toggle rate, ICCINT for a fully utilized EP2A70B724I7 fabric is approximately 2.5 A, yielding about 3.75 W of core dissipation. The 724-pin FCBGA package has theta_JA in the 12-15 C/W range on a standard 8-layer JEDEC test board, implying a junction-to-ambient rise of 45-55 C. For industrial enclosures with limited airflow, derate utilization to 60-70% or add a thermal pad under the BGA to a copper pour.
Follow Intel/Altera APEX II layout guidelines: assign at least 4 dedicated power/ground planes (VCCINT, VCCIO, GND, GND) with split or shared returns for SSO mitigation. Route LVDS pairs with 100 ohm differential impedance and match within 5 mil length tolerance. Place configuration EPROM (EPC16 or EPC8) within 50 mm of the DATA[7:0] and DCLK pins and route with 50 ohm controlled impedance. The FCBGA-724 requires via-in-pad or microvia technology for breakout on standard 1.55 mm-pitch BGA lands.
The 8 True-LVDS channels on EP2A70B724I7 deliver up to 840 Mbps per pair; route adjacent LVDS pairs on a single signal layer to minimize skew. Add 100 ohm termination across each LVDS pair at the receiver end. For DDR-style source-synchronous buses, match clock-to-data skew within 50 ps. SSO analysis is mandatory: the APEX II datasheet specifies simultaneous-switching limits per I/O bank; exceeding them causes ground-bounce-induced jitter on adjacent clock pins.
Do not assume EP2A70B724I7 is actively produced - APEX II is obsolete, so design teams must secure long-term supply before committing to new boards. Verify date code and RoHS/REACH compliance with the distributor at order entry, as many obsolete-stock channels offer only lead-finished or non-RoHS parts. JTAG chain length must not exceed 6 devices without a buffer. The nCONFIG pin must be held low until both VCCINT and VCCIO rails are within specification, or the device may latch into an undefined configuration state.
コンプライアンス情報
RoHS, REACH, and lead-free status were not present in the Verified Web Data snippet. APEX II is a legacy family from circa 2002; many obsolete-stock channels offer non-RoHS or lead-finished material. Validate compliance with the distributor at order entry.
