EP2AGX45DF25C6G - Arria II GX FPGA 42K LE 572-FCBGA | Intel
部品番号: EP2AGX45DF25C6G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $172.5 | $1,725.00 |
| 100 | $158 | $15,800.00 |
| 500 | $142 | $71,000.00 |
| 1,000 | $128 | $128,000.00 |
EP2AGX45DF25C6G 概要
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), dedicated DSP slices, embedded memory blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit at the top of the digital logic hierarchy between fixed-function ASICs and software-driven processors, occupying the niche where parallel hardware acceleration, deterministic latency, and post-deployment reconfigurability are required. The Arria II GX family targets cost-sensitive mid-range applications that need transceiver and DSP resources without migrating to higher-cost Stratix or Agilex families.
Key features of the EP2AGX45DF25C6G include up to 252 user I/O pins, embedded transceiver channels supporting common serial protocols such as PCIe Gen1/Gen2, Serial RapidIO, and CPRI, and on-chip DSP blocks optimized for fixed- and floating-point multiplication. The device supports configuration through active serial, passive serial, JTAG, and fast passive parallel modes. The 572-ball FC-FBGA package offers high I/O density and excellent signal integrity for multi-gigabit interfaces.
From an architectural perspective, the EP2AGX45DF25C6G uses an adaptive logic module (ALM) structure that improves logic utilization versus 4-input LUT-based architectures, and the transceiver tiles support multiple data rates with on-chip PLLs. Designers can instantiate soft memory controllers, video processing pipelines, and protocol bridges in the fabric while dedicating DSP slices to filtering or FFT workloads.
Typical applications include wireless baseband processing, radio network controllers, video broadcast infrastructure, industrial imaging, and PCIe-based data acquisition cards. The device is also deployed in military and aerospace subsystems requiring moderate logic density and serial connectivity. Its combination of DSP and transceiver resources makes it well suited for LTE and WiMAX baseband designs where deterministic latency is required.
When designing with the EP2AGX45DF25C6G, pay close attention to power-rail sequencing (core 0.9 V must precede I/O rails), transceiver reference-clock jitter, and PCB routing for the FC-FBGA package. Use Altera Quartus II (or the corresponding Intel Quartus Prime release) for synthesis, place-and-route, and timing closure, and follow Altera's high-speed board design guidelines for the FC-BGA escape routing.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: EP2AGX45DF25C6G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2AGX45DF25C6G （同一形状・フットプリント） — 相違点: Package, Speed Grade, Family, Logic Elements, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP2AGX45DF25C5N
✅ ドロップイン✓ 在庫あり
$258.2 / 個
データシートを見る →EP2AGX45DF25C5G
✅ ドロップイン✓ 在庫あり
$118 / 個
データシートを見る →EP2AGX45DF25C4N
✅ ドロップイン✓ 在庫あり
$460 / 個
データシートを見る →EP2AGX45DF25C4G
✅ ドロップイン✓ 在庫あり
$205 / 個
データシートを見る →EP2AGX45DF25C6
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP2AGX45DF25C6G 最大定格＆電気的特性
| Family | Arria II GX |
| Logic Elements | 42,959 |
| User I/O Pins | 252 |
| Embedded Memory Bits | 3,517,440 |
| Transceiver Data Rate (max) | 3.75 Gbps |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| パッケージ | 572-ball FC-FBGA |
| 実装タイプ | Surface Mount |
| 動作温度 | 0 C to +85 C (Commercial) |
| Configuration Method | Active Serial / Passive Serial / JTAG / FPP |
| RoHS ステータス | Compliant |
| Speed Grade | C6 |
EP2AGX45DF25C6G 572-ball fc-fbga ピン配置ガイド
EP2AGX45DF25C6G (572-ball fc-fbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2AGX45DF25C6G.
詳細は データシート をご参照ください。
主な用途
EP2AGX45DF25C6G の用途: 6 件s: Wireless Baseband Processing, Video Broadcast Infrastructure, Industrial Imaging and Machine Vision, PCIe-Based Data Acquisition, Military and Aerospace Subsystems, Test and Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX45DF25C6G is well suited for wireless baseband DSP because its Arria II GX fabric combines 42,959 logic elements, dedicated DSP slices, and transceiver channels operating up to 3.75 Gbps. According to Altera's CPRI and OBSAI reference designs, the device supports the CPRI line rates used between baseband units and remote radio heads. The 572-ball FC-FBGA package provides the signal integrity required for multi-gigabit CPRI links, while the embedded transceivers eliminate the need for external PHY chips. Designers typically instantiate FFT/iFFT pipelines, channel filters, and crest factor reduction (CFR) blocks in the DSP slices, freeing logic for MAC-layer processing.
おすすめ
Video Broadcast Infrastructure
Broadcast video routers, format converters, and SDI/HDMI bridges benefit from the EP2AGX45DF25C6G's combination of parallel logic fabric and 3.75 Gbps transceivers. According to the Arria II GX device handbook, the device's 252 user I/O and 3.517 Mbit embedded memory enable multi-channel SDI (SMPTE 259M/292M/424M) aggregation or H.264 encode assist. The 40 nm process keeps power dissipation manageable for rack-mounted broadcast gear, while the FC-FBGA package supports the controlled-impedance routing required for SDI at 3 Gbps. Quartus Prime IP cores for SDI, HDMI, and DisplayPort accelerate integration.
おすすめ
Industrial Imaging and Machine Vision
In machine-vision systems, the EP2AGX45DF25C6G bridges high-speed Camera Link, CoaXPress, or GigE Vision sensors to host processors while running pre-processing in fabric. The 42,959 LE fabric is sufficient for Bayer demosaic, color correction, and basic defect detection pipelines. According to Altera's industrial imaging reference designs, the device's transceiver channels support CoaXPress up to 3.125 Gbps, while parallel I/O handle Camera Link Full. The 0 C to +85 C commercial temperature range suits factory-floor enclosures with filtered air cooling, and the 572-ball FC-FBGA package allows dense layout next to high-pin-count image sensors.
おすすめ
PCIe-Based Data Acquisition
The EP2AGX45DF25C6G's integrated PCIe Gen1/Gen2 hard IP block enables cost-effective data acquisition cards that stream ADC samples directly into host memory. According to the Arria II GX PCIe user guide, the hard PCIe IP supports x1/x4 lane configurations at 2.5 or 5 Gbps, eliminating soft IP timing closure challenges. Designers pair the FPGA with high-speed ADCs (such as the AD9467 family) on the local bus, then forward packets to the host via DMA. The 572-ball FC-FBGA package supports the controlled-impedance PCIe lane routing required for Gen2 compliance at 5 Gbps.
おすすめ
Military and Aerospace Subsystems
Defense subsystems use the EP2AGX45DF25C6G for signal intelligence, secure communications, and electronic warfare front-ends where mid-range FPGA density and ruggedized packaging are required. The Arria II GX architecture provides the DSP throughput needed for digital down-conversion and pulse compression, while the transceiver channels support tactical datalinks up to 3.75 Gbps. Designers leverage Altera's wider-temperature screened variants (where available) and the FC-FBGA package's mechanical robustness for vibration-prone platforms. Quartus Prime supports the design-flow extensions used for DO-254 and similar compliance work.
おすすめ
Test and Measurement Instrumentation
The EP2AGX45DF25C6G is a common DSP engine in mid-range oscilloscopes, logic analyzers, and protocol testers because it offers enough logic for triggering, decoders, and on-screen display generation while integrating 3.75 Gbps transceivers for serial bus analysis. The embedded memory bandwidth (3.517 Mbit) supports deep acquisition memory buffers at full sample rate. According to Altera's instrumentation reference designs, the device pairs well with high-speed DDR2/DDR3 external memory through its user I/O. Quartus Prime's TimeQuest timing analyzer closes timing on multi-channel T&M designs within hours rather than days.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2AGX45DF25C6G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2AGX45DF25C5N | EP2AGX45DF25C5G | EP2AGX45DF25C4N | EP2AGX45DF25C4G | EP2AGX45DF25C6 |
|---|---|---|---|---|---|---|
| Package | 572-ball FC-FBGA (DF25, 1.0 mm pitch) | 572-ball FC-FBGA (DF25) - same | 572-ball FC-FBGA (DF25) - same | 572-ball FC-FBGA (DF25) - same | 572-ball FC-FBGA (DF25) - same | 572-ball FC-FBGA (DF25) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | C6 | C5 | C5 | C4 | C4 | C6 |
| Operating Temperature | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 |
| User I/O | 252 | 252 | 252 | 252 | 252 | 252 |
| Transceiver Max Data Rate | 3.75 Gbps | 3.125 Gbps (C5 limit) | 3.125 Gbps (C5 limit) | 2.5 Gbps (C4 limit) | 2.5 Gbps (C4 limit) | 3.75 Gbps |
| Lead-Free / RoHS | Yes (G suffix) | Yes (G suffix, Industrial) | Yes (G suffix) | Yes (G suffix, Industrial) | Yes (G suffix) | No G suffix (non-RoHS variant) |
主な差別化要因
- Fastest speed grade in the 572-ball FC-FBGA Arria II GX family （vs EP2AGX45DF25C5N)
- Same silicon die as lower-cost siblings, lower risk than cross-family migration （vs EP2AGX125DF25C6G)
- RoHS-compliant with lead-free G suffix （vs EP2AGX45DF25C6)
設計ノート
The EP2AGX45DF25C6G requires multiple power rails: a 0.9 V core, 1.1 V PLL analog, and 1.5 V/1.8 V/2.5 V/3.3 V I/O supplies. According to the Arria II GX device handbook, the core supply must ramp monotonically and reach regulation before any I/O supply exceeds 1.1 V to avoid latch-up. Use a dedicated power-management IC with sequence control (such as the LTM4677 or similar) rather than discrete LDOs. Estimated: total power budget for a 70% utilization design with four active transceivers at 3.75 Gbps is approximately 8-12 W, requiring forced-air cooling in enclosed chassis.
The 572-ball FC-FBGA package uses 1.0 mm ball pitch, demanding 0.5 mm-pitch escape vias and a high-layer-count PCB (at least 10 layers). Per Altera's AN 548: Design Recommendations for High-Speed FPGA Boards, place a continuous GND reference plane under the BGA and stitch vias around the perimeter for signal-integrity compliance. Use microstrip or stripline routing with 50 ohm single-ended / 100 ohm differential impedance for transceiver channels. The thermal pad must be connected to GND through a via array (typically 0.3 mm drilled, 0.5 mm pitch) to keep junction temperature within spec.
Estimated: a common mistake is configuring the device with the wrong MSEL pins - the EP2AGX45DF25C6G uses FPP x8 or AS x4 by default but designers occasionally leave MSEL floating, causing configuration failures that look like bitstream corruption. Tie MSEL[3:0] to defined logic levels per Table 7-1 of the Arria II GX configuration handbook. Another frequent pitfall is using the wrong configuration clock source: the 100 MHz internal oscillator is too inaccurate for some protocols, so provide an external reference clock on CLKUSR. Always validate the bitstream checksum on first prototype boards using the Quartus Programmer's Verify operation.
コンプライアンス情報
RoHS compliance indicated by the G suffix in the MPN per Intel/Altera ordering information. AEC-Q100 is not applicable for FPGAs (automotive-grade equivalent is the -A suffix offered by some Intel families). Conflict-minerals statement available from Intel's corporate responsibility page.
