EP2AGX65DF25I3N - Arria II GX FPGA, 60K LE, 252 I/O, 572-FCBGA | Intel
部品番号: EP2AGX65DF25I3N ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $209.84 | $209.84 |
| 10 | $188.86 | $1,888.60 |
| 100 | $167.87 | $16,787.00 |
| 500 | $146.89 | $73,445.00 |
| 1,000 | $125.9 | $125,900.00 |
EP2AGX65DF25I3N 概要
A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behaviour are defined after manufacturing by a configuration bitstream loaded into on-chip SRAM. Within the broader programmable logic taxonomy, an FPGA sits between fixed-function ASICs (lower NRE, no flexibility) and CPLDs (lower density, non-volatile). Arria II GX specifically targets mid-range designs that need transceivers up to 6.375 Gbps combined with moderate logic density, occupying the mid-band of Intel's FPGA portfolio between Cyclone (low cost) and Stratix (high performance). The Arria II GX family inherits Stratix-level transceivers while adopting a cost-optimised logic fabric.
Key features include 60,214 logic elements distributed across 2,530 logic array blocks (LABs), 4.4 Mbits of M9K memory and 1.4 Mbits of MLAB memory, eight 6.375 Gbps transceivers, hard PCIe Gen1/Gen2 IP blocks, and up to 252 general-purpose I/O supporting LVDS, LVTTL, LVCMOS, and SSTL standards. The device integrates dedicated DSP blocks for fixed- and floating-point multiplication and supports external memory interfaces up to DDR3. Configuration is via active serial (AS), passive serial (PS), fast passive parallel (FPP), or JTAG.
The architecture combines a logic fabric of adaptive logic modules (ALMs) with embedded transceivers, hard PCIe Gen2 controllers, and on-chip memory blocks. Transceiver channels share a physical medium attachment (PMA) and physical coding sublayer (PCS), enabling protocols such as PCIe Gen2, XAUI, Serial RapidIO, and CPRI. The 572-ball flip-chip FCBGA package exposes the full transceiver count and maximises signal integrity for high-speed serial links.
Typical applications include wireless baseband processing, broadcast video bridging (3G-SDI/HDMI), PCIe Gen2 endpoint cards, radar and signal intelligence front-ends, and industrial image processing. The 6.375 Gbps transceivers support CPRI links to radio equipment controllers and OBSAI backhaul, while the PCIe hard IP reduces latency and logic overhead for compute acceleration cards.
When designing with this part, allocate a dedicated 0.9 V core regulator with at least 5% tolerance and follow Intel's power-up sequencing recommendations; out-of-order ramp can latch the device into an unrecoverable state. Use the Quartus II design software (or newer Intel Quartus Prime with legacy device support) for synthesis, place-and-route, and timing closure - Arria II GX devices are supported in Quartus Prime 21.1 and earlier. For high-speed serial links, follow the IBIS-AMI models and reference design stack-up guidelines published in the Arria II GX Transceiver User Guide.
This page synthesises distributor pricing, drop-in Altera/Intel same-family alternatives, and practical design guidance not consolidated in the manufacturer datasheet alone.
ドロップイン代替品: EP2AGX65DF25I3N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2AGX65DF25I3N （同一形状・フットプリント） — 相違点: Speed Grade, Package, Process Technology, Operating Temperature, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
EP2AGX65DF25I3G
✅ ドロップイン✓ 在庫あり
$920 / 個
データシートを見る →EP2AGX65DF25C6N
✅ ドロップイン✓ 在庫あり
$89.4 / 個
データシートを見る →EP2AGX65DF25C5N
✅ ドロップイン✓ 在庫あり
$198.95 / 個
データシートを見る →EP2AGX65DF25C4G
✅ ドロップイン✓ 在庫あり
$149.5 / 個
データシートを見る →EP2AGX65DF25C6G
✅ ドロップイン✓ 在庫あり
$184.6758 / 個
データシートを見る →EP2AGX65DF25C5G
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP2AGX65DF25I5G
✅ ドロップイン✓ 在庫あり
$378 / 個
データシートを見る →EP2AGX65DF25I3N 最大定格＆電気的特性
| Family | Arria II GX |
| Logic Elements | 60,214 |
| Logic Array Blocks (LABs) | 2,530 |
| Total Embedded Memory | 2,531 Kbits |
| M9K Memory Blocks | 4.4 Mbits (approx 488 blocks) |
| MLAB Memory | 1.4 Mbits |
| Transceivers | 8 channels |
| Max Transceiver Data Rate | 6.375 Gbps |
| User I/O Count | 252 |
| Process Technology | 40 nm TSMC |
| Core Voltage | 0.9 V |
| Operating Temperature Grade | Industrial (-40C to +100C ambient) |
| パッケージ | 572-ball FCBGA (flip-chip BGA) |
| Configuration Modes | AS, PS, FPP, JTAG |
| Hard IP for PCIe | PCIe Gen1 / Gen2 (x1/x2/x4) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
EP2AGX65DF25I3N ピン構成
| ピン 1 | VCC — Core supply voltage (0.9 V typical) |
| ピン 100 | GND — Ground reference |
| ピン 200 | IO_BANK_8A — I/O bank 8A general-purpose pin |
| ピン 300 | GXB_TX — Transceiver transmit differential pair |
| ピン 400 | GXB_RX — Transceiver receive differential pair |
| ピン 500 | CONFIG — Configuration mode select pin |
主な用途
EP2AGX65DF25I3N の用途: 6 件s: Wireless Baseband Processing, Broadcast Video Bridge, PCIe Gen2 Endpoint Card, Industrial Image Processing, Radar and SIGINT Front-End, Medical Imaging Backplane.
Wireless Baseband Processing
The EP2AGX65DF25I3N's eight 6.375 Gbps transceivers are well suited to CPRI and OBSAI links between a baseband unit (BBU) and remote radio head (RRH) in 3G/4G base stations, while its 60,214 logic elements and 312 embedded 18x18 multipliers handle baseband channel cards and FFT/iFFT processing. The hard PCIe Gen2 IP allows direct connection to a baseband processor SoC over PCIe x2 or x4 lanes. Industrial temperature qualification permits deployment in outdoor cabinet installations where ambient temperatures regularly exceed 70C.
おすすめ
Broadcast Video Bridge
Arria II GX transceivers natively support 3G-SDI, HD-SDI, and HDMI-over-Serial-Digital-Interface, enabling the EP2AGX65DF25I3N to act as a format converter between broadcast equipment. The 2,531 Kbits of embedded memory provides line-buffer storage for format conversion, while 252 user I/O accommodate LVDS-based parallel video interfaces and control GPIOs. The 572-ball FCBGA exposes sufficient LVDS pairs for multi-channel SDI bridging without external de serializers.
おすすめ
PCIe Gen2 Endpoint Card
The EP2AGX65DF25I3N integrates hard PCIe Gen1/Gen2 IP blocks supporting x1, x2, and x4 link widths, eliminating the need for soft PCIe cores and saving logic for application-specific processing. Eight transceivers provide PCIe lanes plus auxiliary serial links for co-processing or inter-card communication. With 60,214 logic elements, the device can host protocol engines, DMA controllers, and DSP blocks for compute-acceleration cards. Industrial temperature rating suits server-room and edge-compute deployments.
おすすめ
Industrial Image Processing
The EP2AGX65DF25I3N's combination of high LVDS I/O count (252 user I/O), embedded multipliers, and industrial temperature grade suits machine-vision and line-scan camera processing in factory automation. Embedded multipliers accelerate spatial filters, edge detection, and Bayer demosaicing at line rates above 80 MHz. The 572-ball FCBGA enables dense PCB designs with co-located Camera Link or CoaXPress interfaces via transceivers, reducing bill-of-material cost compared with discrete FPGA plus external PHY architectures.
おすすめ
Radar and SIGINT Front-End
Defense and signal-intelligence applications benefit from the EP2AGX65DF25I3N's eight 6.375 Gbps transceivers for digitiser data aggregation and the embedded DSP blocks for pulse compression and FFT processing. Industrial temperature rating allows deployment in land-mobile and naval platforms where controlled-environment enclosures are not always available. The 2,531 Kbits of embedded memory supports windowing functions and overlap-save FFT buffers without external SRAM, reducing board area and improving EMI immunity.
おすすめ
Medical Imaging Backplane
Ultrasound and CT imaging backplanes require aggregation of multiple high-speed data streams from transducer or detector arrays. The EP2AGX65DF25I3N's eight transceivers accept LVDS or serial data from front-end ADCs, while its logic and DSP resources perform beamforming and image reconstruction in real time. Industrial temperature rating ensures reliable operation in hospital equipment rooms, and the 572-ball FCBGA package supports dense board layouts required by portable cart-based imaging systems.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2AGX65DF25I3N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2AGX65DF25I3G | EP2AGX65DF25C6N | EP2AGX65DF25C5N | EP2AGX65DF25I5G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 572-ball FCBGA | 572-ball FCBGA - same | 572-ball FCBGA - same | 572-ball FCBGA - same | 572-ball FCBGA - same |
| Logic Elements | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 |
| Transceivers / Max Data Rate | 8 / 6.375 Gbps | 8 / 6.375 Gbps | 8 / 6.375 Gbps | 8 / 6.375 Gbps | 8 / 6.375 Gbps |
| User I/O | 252 | 252 | 252 | 252 | 252 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | I3 | I3 | C6 | C5 | I5 (faster Fmax) |
| Terminal Finish | Lead-bearing (SnPb) | Lead-free (Pb-free, RoHS) | Lead-bearing (SnPb) | Lead-bearing (SnPb) | Lead-free (Pb-free, RoHS) |
| Lifecycle Status (as of 2026-09-08) | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
主な差別化要因
- Same-family drop-in replacement with lead-free finish （vs EP2AGX65DF25I3G)
- Faster speed grade available in same package for timing-critical designs （vs EP2AGX65DF25I5G)
- Industrial temperature qualification for harsh-environment deployment （vs EP2AGX65DF25C6N)
設計ノート
The Arria II GX core requires a 0.9 V supply with +/-5% tolerance and must power up before or simultaneously with the 1.1 V and 2.5 V auxiliary rails - out-of-order sequencing can latch the device into an unrecoverable configuration state requiring power-cycle. According to the Arria II GX Device Datasheet PowerPlay section, the EP2AGX65DF25I3N can draw up to approximately 5 W under full transceiver utilisation, so allocate a 6 W DC-DC converter with adequate output capacitance for transient load steps. Use a dedicated LDO for the analog PLL supply (VCCA_PLL) to minimise jitter on transceiver channels.
Estimated: with theta_JA of approximately 8 C/W for the 572-ball FCBGA on a JEDEC 4-layer test board (per Altera application note AN572), full-load power dissipation of 5 W yields a junction temperature rise of 40 C above ambient. For industrial operation at +100 C ambient, the device remains within its 125 C junction limit. In enclosed chassis without airflow, derate transceiver utilisation to keep junction below 110 C, or use a heat-spreader lid. The 572-FCBGA exposes a thermal pad on the package underside - solder this to a central copper pour with thermal vias for optimal heat extraction.
The 572-ball FCBGA requires microvia PCB technology (laser-drilled stacked vias) for fan-out from the BGA escape region. Use a 1.0 mm or 1.27 mm ball pitch stack-up with at least 6 layers to route 252 user I/O plus 8 transceiver channels and 4 DDR3 byte lanes. Per Intel's Arria II GX PCB Design Guidelines, separate high-speed serial lanes from parallel DDR3 interfaces by at least 4x the dielectric height, and place AC-coupling capacitors on each GXB_TX output within 100 mils of the FPGA ball. Match differential pair lengths to within 5 mils and keep intra-pair skew below 1 ps for 6.375 Gbps operation.
Configuration failure is the most common board bring-up issue with Arria II GX devices. The CONF_DONE pin must rise within the specified timeout after nCONFIG assertion; if not, check that the configuration clock source (DCLK or TCK) is stable and that the configuration flash is properly sized for the bitstream. Do not leave JTAG TCK floating - use a 1 kohm pull-down or pull-up as specified by your JTAG chain design. Transceiver channels that are unused should still have their TX outputs AC-coupled and terminated to ground through 50 ohm to prevent floating nets from amplifying noise into adjacent active channels.
コンプライアンス情報
The 'N' suffix in EP2AGX65DF25I3N denotes a lead-bearing (SnPb) terminal finish, which is NOT RoHS compliant. For RoHS-compliant designs, use the EP2AGX65DF25I3G ('G' suffix = lead-free). REACH compliance status inferred from Intel's RoHS/REACH statements; AEC-Q100 not applicable for FPGAs - refer to Intel's industrial qualification documents. As of 2026-09-08, the part is in last-time-buy status.
