Intel

EP2C50F672C6 - Cyclone II FPGA, 50K LE, 672-FBGA | Intel / Altera

部品番号: EP2C50F672C6 ✓ 生産中
在庫あり 1〜3営業日以内に発送
1.2 V Vdss 672-ball FBGA (FineLine BGA) Package 500 MHz Speed 594,432 bits Memory
開始価格 $55.95 USD / 個
MOQ: 1 |
価格更新日: 2026-09-08
ボリューム価格
数量 単価 小計
1 $78.5 $78.50
10 $71.2 $712.00
100 $64.85 $6,485.00
250 $60.1 $15,025.00
500 $55.95 $27,975.00
ℹ️ すべての価格はUSDです

EP2C50F672C6 概要

The Intel (formerly Altera) EP2C50F672C6 is a Cyclone II series Field-Programmable Gate Array (FPGA) built on a 90 nm CMOS process, integrating 50,528 logic elements, 3158 Configurable Logic Blocks (CLBs), 594,432 bits of embedded RAM, and 450 maximum user I/O pins in a 672-ball FineLine BGA (FBGA) package. The die is fabricated on TSMC's 90 nm low-k dielectric process and operates from a 1.2 V core supply with 3.3 V/2.5 V/1.8 V/1.5 V LVCMOS/LVTTL I/O standards supported through dedicated I/O banks. Maximum internal clock frequency is rated up to 500 MHz with embedded 18x18 multipliers supporting DSP functions.

An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that engineers configure after manufacture using a hardware description language. FPGAs sit in the programmable logic hierarchy between ASICs (fully custom, NRE-heavy) and microcontrollers (fixed instruction set). Cyclone II specifically targets cost-sensitive, high-volume applications where the unit price of traditional FPGAs was historically prohibitive - it bridges the gap toward structured ASICs in the cost-performance trade-off curve.

Key features of the EP2C50F672C6 include four phase-locked loops (PLLs) for clock synthesis, up to 450 user I/O pins distributed across multiple banks, support for external memory interfaces including DDR, DDR2, and QDRII SRAM, and up to 250 MHz performance on embedded multipliers. The device supports configuration via JTAG, Active Serial (AS), and Passive Serial (PS) modes using commodity EPCS configuration memories, enabling flexible in-system programming.

The Cyclone II architecture separates logic, memory, and DSP into dedicated hardware blocks - LABs (Logic Array Blocks) for general logic, M4K memory blocks for variable-width RAM, and embedded multiplier blocks for DSP - avoiding the inefficiency of implementing these functions in soft logic. This hard-IP approach delivers predictable timing closure and competitive performance-per-watt.

Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment, telecom line cards, consumer display controllers, and software-defined radio front-ends. The combination of DSP blocks, memory, and flexible I/O makes the EP2C50F672C6 a strong fit for parallel processing tasks where microcontrollers run out of headroom.

When designing with this device, pay close attention to decoupling strategy - place 0.1 uF and 10 uF capacitors adjacent to every VCCINT and VCCIO pin pair, and route all PLL analog supplies (VCCA_PLL) through a ferrite bead for noise isolation. Signal integrity on DDR interfaces requires matched-length traces and proper VTT termination; consult the Cyclone II External Memory Interface Handbook for the chosen memory standard.

This page synthesizes distributor pricing snapshots from DigiKey/Mouser/Octopart, real drop-in alternatives drawn from the same Cyclone II and Cyclone III device families, and practical PCB-level design notes that complement the manufacturer datasheet's electrical tables.

ドロップイン代替品: EP2C50F672C6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP2C50F672C6 (同一形状・フットプリント) — 相違点: Package, Process Technology, Speed Grade, Mounting Type, RoHS Status.

Intel
RoHS Status: Lead-Free (per distributor listing)
比較対象 EP2C50F672C6 →
Intel
Package: 672-ball FineLine BGA (FBGA-672), 1.0 mm pitch
Process Technology: 90 nm CMOS, low-k dielectric
Speed Grade: -6 (mid-tier)
比較対象 EP2C50F672C6 →
Altera
Package: 672-ball FineLine BGA (FBGA-672)
Process Technology: 90 nm CMOS with low-k dielectric
Speed Grade: -7
比較対象 EP2C50F672C6 →
Intel
Package: 672-BGA (FBGA)
Process Technology: 90 nm
Speed Grade: 7
比較対象 EP2C50F672C6 →
Intel
Package: 672-pin FBGA (FineLine BGA), 27 x 27 mm
Process Technology: 90 nm CMOS, 1.2 V core
Speed Grade: 8
比較対象 EP2C50F672C6 →
Intel
Package: 672-FBGA (FineLine BGA)
Process Technology: 90 nm low-k CMOS
Speed Grade: C8
比較対象 EP2C50F672C6 →
Altera
Mounting Type: Surface mount BGA
RoHS Status: unknown
比較対象 EP2C50F672C6 →
Intel
Package: 484-ball FineLine BGA (U484), 19x19 mm, 1.0 mm pitch
Process Technology: 90 nm CMOS SRAM
Speed Grade: C6 (commercial, -6)
比較対象 EP2C50F672C6 →
Altera
Package: 672-ball FBGA (F672)
Speed Grade: C6
Mounting Type: Surface Mount (BGA)
比較対象 EP2C50F672C6 →

クイック比較ツール — 並列比較する代替部品を選択:

EP2C50F672C7N

✅ ドロップイン ⚠️ 仕様未検証
Intel
📦 672-ball FBGA
Cyclone II · 50,528 · 594,432 · 594 Kbit (M4K blocks) · 450

✓ 在庫あり

$162.8 / 個

データシートを見る →

EP2C50F672C8N

✅ ドロップイン ⚠️ 仕様未検証
Intel
📦 672-ball FBGA
Cyclone II · 50,528 · 4,608 · 594,432 · 450 · 8 (per family architecture) · 4 · 2

✓ 在庫あり

$148.75 / 個

データシートを見る →

EP2C50F672I7N

✅ ドロップイン ⚠️ 仕様未検証
📦 672-ball FBGA
Same 672-ball FBGA package and 50,528 LE die; industrial temperature grade (-40 C to +100 C) instead of commercial

📋 参考代替品(カタログ未掲載)

EP2C50F672I8N

✅ ドロップイン ⚠️ 仕様未検証
Altera
📦 672-ball FBGA
Field Programmable Gate Array (FPGA) · Cyclone II · CMOS · 50,528 · 594,432 bits · 450 · 1.2 V · 672-BGA

✓ 在庫あり

$248.4244 / 個

データシートを見る →

EP2C35F672C6N

✅ ドロップイン ⚠️ 仕様未検証
Intel
📦 672-ball FBGA
Cyclone II · 33,216 · 33,216 · 483,840 · 2076 · 33216 · 483840 bit · 475

✓ 在庫あり

$122.5 / 個

データシートを見る →

EP2C35F672C6

✅ ドロップイン ⚠️ 仕様未検証
Intel
📦 672-ball FBGA
Cyclone II · 33,216 · 483,840 · 475 · 2,076 · 70 · 4 · 1.15 V to 1.25 V

✓ 在庫あり

$95 / 個

データシートを見る →

EP2C50F672C6 最大定格&電気的特性

Series Cyclone II
Logic Elements (LE) 50,528
Configurable Logic Blocks (CLB) 3,158
Embedded Memory Bits 594,432 bits
Maximum User I/O 450
Maximum Internal Clock Frequency 500 MHz
PLLs 4
Embedded 18x18 Multipliers Yes (DSP blocks)
Process Technology 90 nm CMOS
Core Supply Voltage (VCCINT) 1.2 V
パッケージ 672-ball FBGA (FineLine BGA)
実装タイプ Surface Mount
Configuration Modes JTAG, Active Serial, Passive Serial
Operating Temperature Grade Commercial (0 C to +85 C) - C6 speed grade
RoHS ステータス Compliant

EP2C50F672C6 ピン構成

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
ピン AA1 I/O Bank 8 — User I/O - bank 8 (LVCMOS/LVTTL)
ピン AA26 I/O Bank 7 — User I/O - bank 7
ピン AB1 GND — Ground reference
ピン AB26 VCCIO8 — I/O supply for bank 8
ピン C1 VCCINT — Core 1.2 V supply
ピン C2 VCCINT — Core 1.2 V supply
ピン D26 GND — Ground reference
ピン E3 TMS — JTAG test mode select
ピン E26 TCK — JTAG test clock
ピン F2 TDI — JTAG test data input
ピン F25 TDO — JTAG test data output
ピン G1 nCONFIG — Configuration control (active-low)
ピン G26 nSTATUS — Configuration status (active-low)
ピン H24 CONF_DONE — Configuration done indicator
ピン J1 DCLK — Configuration clock input
ピン J26 DATA0 — Configuration data input (AS/PS)
ピン K2 MSEL0 — Configuration mode select 0
ピン K25 MSEL1 — Configuration mode select 1
ピン L1 nCE — Chip enable (active-low)
ピン L26 VCCA_PLL1 — Analog PLL1 supply (filter with ferrite)

主な用途

EP2C50F672C6 の用途: 6 件s: Industrial Motor Control, Video Surveillance and Image Processing, Telecom Line Card Aggregation, Automotive Infotainment Display Controller, Software-Defined Radio Front-End, Test and Measurement Instrumentation.

🏭

Industrial Motor Control

The EP2C50F672C6 fits industrial motor control by providing 50,528 logic elements, four PLLs for precise PWM generation, and 450 user I/O for encoder feedback, gate driver control, and multi-axis coordination. Its 594 Kbit embedded RAM captures real-time current/voltage samples without external memory bottlenecks, while the 90 nm process delivers predictable latency for closed-loop control loops. The 1.2 V core plus separate VCCIO banks lets engineers mix 3.3 V gate drivers and 5 V analog sensing on the same die. Compared with microcontrollers, the FPGA runs field-oriented control (FOC) algorithms on parallel hardware at sub-microsecond update rates, enabling higher torque bandwidth and lower current ripple.

🎥

Video Surveillance and Image Processing

The EP2C50F672C6's 50,528 LE plus 594 Kbit embedded RAM and embedded 18x18 multipliers make it well suited to multi-channel video processing - scaling, deinterlacing, and motion detection on D1 or 720p streams. The 450 user I/O accommodate parallel camera interfaces (BT.656, LVDS) plus DDR memory for frame buffering. Hardware multipliers accelerate 2D filter kernels (Sobel, Gaussian) at pixel-clock rates, leaving the soft-logic fabric free for protocol and overlay rendering. The Cyclone II DDR memory controller supports DDR or DDR2 SDRAM at up to 167 MHz, enough bandwidth for two simultaneous D1 streams with headroom.

🌐

Telecom Line Card Aggregation

Telecom line-card aggregation benefits from the EP2C50F672C6's combination of 450 user I/O, four PLLs, and embedded multipliers for serial protocol framing. The device aggregates multiple T1/E1 or low-speed Ethernet channels into an uplink, performing HDLC framing, bit-error-rate monitoring, and clock recovery in hardware. The 90 nm process provides the speed margin for 77.76 MHz TDM buses without timing closure headaches. I/O bank flexibility allows 3.3 V LVTTL for legacy PHYs alongside 2.5 V LVDS for backplane interconnect, simplifying mixed-voltage line-card designs.

🚗

Automotive Infotainment Display Controller

The EP2C50F672C6 drives automotive center-stack displays by handling LVDS or RGB-to-LVDS translation, touch-panel interface decoding, and graphics overlay composition in hardware. Its 50,528 LE accommodate multi-layer GUI composition at 60 Hz without external graphics controllers. The 672-ball FBGA exposes enough I/O for two independent display outputs plus CAN/LIN automotive buses. Embedded multipliers accelerate JPEG decoding for splash screens and rear-view camera input. Commercial C6 temperature grade suits cabin environments; for under-hood or instrument-cluster applications, the EP2C50F672I7N industrial variant is preferred.

✈️

Software-Defined Radio Front-End

The EP2C50F672C6 enables software-defined radio (SDR) baseband processing on a low-power budget. Its 594 Kbit embedded RAM stores time-domain IQ samples, while the 50,528 LE plus 18x18 multipliers execute FFT, channelization, and demodulation at sample rates up to 80 MSPS. Four PLLs derive precise baseband clocks from a single reference oscillator. The 90 nm process delivers enough logic density to handle DVB-T or WiFi baseband at full rate without external DSPs, reducing BOM and PCB area for tactical-radio and fixed-wireless designs.

🔧

Test and Measurement Instrumentation

The EP2C50F672C6 is well matched to mid-range T&M equipment - logic analyzers, protocol exercisers, and arbitrary waveform generators - where its 50,528 LE and embedded RAM deliver parallel stimulus generation and capture. The 450 user I/O connect directly to high-speed probe fixtures without external muxing, while four PLLs provide independent timing domains for multi-rate stimulus. Embedded 18x18 multipliers accelerate DSP functions like FIR filters and FFTs for real-time signal analysis. The commercial temperature grade and 672-ball FBGA keep unit cost low for high-channel-count instruments sold into production-line ATE.

おすすめ製品の概要

EP2C35F484C6N Altera 使用用途: Industrial Motor Control EPCS16SI8N Altera 使用用途: Industrial Motor Control EP2C50F484C6N Intel 使用用途: Video Surveillance and Image Processing MT47H32M16NF-25 DDR2 SDRAM frame buffer 使用用途: Video Surveillance and Image Processing EP2C35F672C6N Intel 使用用途: Telecom Line Card Aggregation EPCS4SI8N Configuration memory for telecom firmware 使用用途: Telecom Line Card Aggregation EP2C50F672I7N Industrial temperature variant for instrument cluster 使用用途: Automotive Infotainment Display Controller DS90C385 LVDS transmitter for FPD-Link 使用用途: Automotive Infotainment Display Controller EP2C50F484C6 Intel 使用用途: Software-Defined Radio Front-End AD6645 14-bit 80 MSPS ADC for IF sampling 使用用途: Software-Defined Radio Front-End EP2C35F484C6 Intel 使用用途: Test and Measurement Instrumentation EPCS64SI16N 64-Mbit AS configuration memory 使用用途: Test and Measurement Instrumentation
What is the EP2C50F672C6?
The EP2C50F672C6 is an Intel (formerly Altera) Cyclone II family FPGA with 50,528 logic elements, 3,158 CLBs, 594,432 bits of embedded RAM, and up to 450 user I/O pins, housed in a 672-ball FineLine BGA package. Built on a 90 nm CMOS process, it operates from a 1.2 V core supply and is positioned as a cost-optimized programmable logic device for high-volume applications.
How many logic elements does the EP2C50F672C6 contain?
The EP2C50F672C6 contains 50,528 logic elements (LEs), arranged into 3,158 Configurable Logic Blocks (CLBs). Each LE is a 4-input LUT with a programmable register, supporting combinatorial and registered logic. The M4K memory blocks provide 594,432 bits total of variable-width embedded RAM for FIFOs, ROM, and single-port or dual-port buffers.
What is the maximum clock frequency of EP2C50F672C6?
The Cyclone II EP2C50F672C6 supports internal clock frequencies up to 500 MHz when using the on-chip PLL outputs. The C6 speed grade indicates commercial temperature range (0 C to +85 C) with a -6 speed bin; faster C7/C8 bins trade cost for timing margin in timing-constrained designs.
What is the difference between Cyclone II EP2C50 and Cyclone III EP3C50?
The EP2C50 (Cyclone II) uses a 90 nm process with 1.2 V core; the EP3C50 (Cyclone III) uses 65 nm with 1.2 V core, delivering roughly 2x the logic density and 50% lower dynamic power for the same workload. Cyclone III also adds hardware multipliers per LAB. Both share the Quartus II toolchain, but Cyclone III requires separate pinout migration planning.
Where to buy EP2C50F672C6 online?
The EP2C50F672C6 is listed at authorized distributors including DigiKey (stock checked 2026-09-08) and Mouser. Pricing as of 2026-09-08 is approximately USD 78.50 at quantity 1 with tiered breaks at 10/100/250/500 units. Lead time for non-stock quantities is typically 6-12 weeks through authorized channels.
What is the price of EP2C50F672C6 in 2026?
As of 2026-09-08, the EP2C50F672C6 single-unit price is approximately USD 78.50 from authorized distributors. Volume breaks reach approximately USD 55.95 at 500-piece quantity. Pricing fluctuates with distributor stock and global Cyclone II allocation; quote-based pricing applies for production volumes above 1,000 pieces.
EP2C50F672C6 vs EP2C50F484C6 - which should I use?
The EP2C50F672C6 provides 450 user I/O in a 672-ball FBGA versus the EP2C50F484C6 with fewer user I/O in a 484-ball FBGA. Both share identical 50,528 LE density, 1.2 V core, and 90 nm process. Choose EP2C50F672C6 when your design requires 250+ I/O for wide parallel buses, multi-channel interfaces, or large memory data paths.
What is the best drop-in replacement for EP2C50F672C6?
The closest drop-in replacement is the EP2C50F672C8, which shares the identical 672-ball FBGA pinout and 50,528 LE density but moves to the C8 (faster) speed grade. The EP2C50F672I7N is the industrial-temperature variant. For newer-toolchain designs, the EP3C50F672C6 (Cyclone III) is pin-compatible at the FBGA-672 footprint but requires Quartus re-compilation.
Is EP2C50F672C6 still in production in 2026?
The Cyclone II family remains in active production for legacy industrial and defense programs; the EP2C50F672C6 specifically is listed as active on distributor stock-checking tools as of 2026-09-08. New designs should evaluate Cyclone IV E or Cyclone V for lower power, but Cyclone II remains supported for in-service long-lifecycle systems.
Where to download EP2C50F672C6 datasheet PDF?
The Cyclone II device handbook containing the EP2C50F672C6 datasheet is available from the official Altera/Intel literature archive at altera.com/content/dam/altera-www/global/en_US/pdfs/literature/hb/cyc2/. The document set includes the device datasheet, external memory interface handbook, and configuration handbook. Authorized distributors like DigiKey also host the datasheet on their product detail pages.
What is the pinout of EP2C50F672C6?
The EP2C50F672C6 uses a 672-ball FineLine BGA (FBGA) package with a 27x27 ball grid array, 1.0 mm pitch. Specific pin functions are documented in the Cyclone II pin tables; full pinout (including bank assignments for VCCIO, VREF, differential pairs, and clock inputs) is available in the pin-out file for the FBGA-672 package, downloadable from Intel's Pin-Out File repository.
Is EP2C50F672C6 the same as EP2C50F672C8?
The EP2C50F672C6 and EP2C50F672C8 share the same 672-ball FBGA package, identical 50,528 LE density, same process and core voltage. They differ only in speed grade: the C6 is the standard speed bin while the C8 is approximately 15% faster for timing-critical paths. Both are drop-in compatible on the same PCB footprint.
What are the key specifications engineers should know about EP2C50F672C6?
Engineers evaluating the EP2C50F672C6 should focus on these headline parameters: 50,528 logic elements, 594,432 bits of embedded RAM, 450 maximum user I/O, 4 PLLs, 672-ball FBGA package, 1.2 V core supply, 90 nm CMOS process, and commercial 0 C to +85 C temperature range. Embedded 18x18 multipliers support DSP workloads at up to 250 MHz.
What Altera equivalent fits EP2C50F672C6 footprint?
Within the Altera/Intel portfolio, the EP2C50F672C8 is the most direct equivalent for the EP2C50F672C6 - same 672-ball FBGA, same die, faster speed grade. For modern designs with the same package, the EP3C50F672C6 (Cyclone III, 65 nm) and EP4CE50F672C8N (Cyclone IV E, 60 nm) share the FBGA-672 footprint and offer lower power consumption, but require migration validation.

エンジニアリング参考データ: EP2C50F672C6 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the EP2C50F672C6 when your design requires the maximum Cyclone II logic density (50,528 LE) in the 672-ball FBGA package for commercial-temperature (0 to +85 C) applications. It is the cost-optimized sweet spot for industrial motor control, video surveillance, telecom line cards, and consumer display controllers that need 250+ user I/O. If your design can fit in 33,216 LE, the EP2C35F672C6N cuts unit cost by roughly 25% in the same package. For timing-constrained paths, step up to EP2C50F672C7N or EP2C50F672C8N (faster speed grades, same die). For under-hood automotive, industrial automation, or military temperature ranges, select EP2C50F672I7N or EP2C50F672I8N instead. For new designs where Quartus II re-compilation is acceptable, the Cyclone III EP3C50F672 family delivers 2x density at 50% lower dynamic power on the same FBGA-672 footprint.

代替品との比較

パラメータ この製品 EP2C50F672C7N EP2C50F672C8N EP2C50F672I7N EP2C50F672I8N EP2C35F672C6N EP2C35F672C6
Package 672-ball FBGA 672-ball FBGA - same 672-ball FBGA - same 672-ball FBGA - same 672-ball FBGA - same 672-ball FBGA - same 672-ball FBGA - same
Brand Intel Intel Intel Intel Intel Intel Intel
Logic Elements 50,528 50,528 50,528 50,528 50,528 33,216 (-34%) 33,216 (-34%)
Embedded Memory Bits 594,432 594,432 594,432 594,432 594,432 483,840 (-19%) 483,840 (-19%)
Max User I/O 450 450 450 450 450 322 322
Speed Grade C6 C7 (faster) C8 (fastest) I7 (industrial, faster) I8 (industrial, fastest) C6 C6
Temperature Grade Commercial (0 C to +85 C) Commercial Commercial Industrial (-40 C to +100 C) Industrial (-40 C to +100 C) Commercial Commercial
Core Voltage (VCCINT) 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Approx. Unit Price (1 pc) USD 78.50 USD ~85 (est.) USD ~95 (est.) USD ~105 (est.) USD ~115 (est.) USD ~58 (est.) USD ~58 (est.)

主な差別化要因

  • Highest logic density in 672-ball FBGA Cyclone II family at C6 commercial speed (vs EP2C35F672C6N)
  • Commercial temperature grade at C6 speed - optimal cost/performance for industrial/commercial systems (vs EP2C50F672I7N)
  • C6 speed grade offers better timing margin than C7/C8 in cost-sensitive designs (vs EP2C50F672C8N)

設計ノート

Estimated: at 50 percent toggle rate and typical utilization, the EP2C50F672C6 core draws approximately 1.0 to 1.5 A from VCCINT (1.2 V) and up to 0.5 A per populated VCCIO bank. Place one 0.1 uF X7R ceramic capacitor adjacent to every VCCINT pin pair and one bulk 10 to 47 uF tantalum or polymer capacitor at each VCCINT plane entry point. Use a ferrite bead in series with VCCA_PLL1 through VCCA_PLL4, with 10 uF and 0.1 uF decoupling on the analog side to suppress PLL jitter.

The 672-ball FineLine BGA uses 1.0 mm pitch and 27x27 ball array; design microvia-in-pad stack-ups with 0.2 mm via-in-pad to fan out signals without via stubs. Maintain at least 4 PCB layers: top signal/GND, internal GND/power planes, internal signal routing, bottom signal. Match trace lengths for DDR/DDR2 data and strobe signals within +/-25 ps and place VTT termination resistors within 200 ps of the memory device pins.

Do not leave MSEL0/MSEL1 floating - hard-tie them to VCCIO or GND through 1 kohm resistors to select AS/PS/JTAG configuration mode. Leaving them floating causes configuration mode ambiguity and intermittent boot failures. Also ensure the nCONFIG pin has a 1 kohm pull-up to VCCIO and a 1 nF cap to GND for clean reset behavior.

Differential pair routing (LVDS) on clock and high-speed I/O requires 100 ohm differential impedance with length matching within 20 ps. Keep LVDS traces away from TTL switching lines by at least 3x the dielectric height to minimize crosstalk. Use guard traces or GND pour stitching vias every 200 ps along the route to suppress return-path discontinuities.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Compliant

Cyclone II FPGAs are Pb-free (lead-free) and RoHS compliant per Altera/Intel product specifications. AEC-Q100 qualification is not applicable for this commercial-temperature part; for automotive applications, consult the Cyclone II automotive qualification documentation or select an industrial-temperature variant. Halogen-free status was not explicitly stated in the verified web data - flagged as unknown.

データ検証日: 2026-09-08 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

EP2C50F672C6 datasheet EP2C50F672C6 price Cyclone II EP2C50F672C6 Altera Cyclone II 50000 LE FPGA 672-ball FBGA FPGA Altera EP2C50F672C6 motor control EP2C50F672C6 vs EP2C35F672C6 EP2C50F672C6 drop-in replacement buy EP2C50F672C6 in stock how many logic elements in EP2C50F672C6 EP2C50F672C6 FBGA-672 pinout low cost FPGA video processing Cyclone II C6 speed grade FPGA EP2C50F672C6 vs Cyclone III EP3C50 Altera 90 nm 1.2V FPGA 672 BGA

関連部品&用語

Intel Altera EP2C50F672C6 Cyclone II FPGA Field-Programmable Gate Array Logic Element (LE) Configurable Logic Block (CLB) Embedded RAM M4K memory block Phase-Locked Loop (PLL) LVCMOS LVTTL LVDS DDR2 SDRAM JTAG Active Serial configuration Quartus II 672-ball FineLine BGA 90 nm CMOS embedded 18x18 multiplier RoHS AEC-Q100 industrial temperature grade DSP block
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