Altera

EP2C8F256I8K - Cyclone II FPGA, 8K LEs, FBGA-256 | Altera / Intel

部品番号: EP2C8F256I8K ✗ 生産終了
在庫あり 1〜3営業日以内に発送
1.2 V Vdss 256-ball FBGA (FineLine BGA) Package 16 Speed
開始価格 $18.95 USD / 個
MOQ: 1 |
価格更新日: 2026-09-08
ボリューム価格
数量 単価 小計
1 $32.5 $32.50
10 $28.75 $287.50
100 $24.2 $2,420.00
500 $21.4 $10,700.00
1,000 $18.95 $18,950.00
ℹ️ すべての価格はUSDです

EP2C8F256I8K 概要

The Intel (formerly Altera) Cyclone II EP2C8F256I8K is a low-cost, low-power Field-Programmable Gate Array (FPGA) from the Cyclone II family, fabricated on a 90 nm CMOS process and housed in a 256-ball FineLine BGA (FBGA-256) package. It contains 8,256 logic elements, 182 user I/O pins, 36 embedded 18x18 multipliers, and 165,888 bits of embedded RAM, providing a balanced resource mix for cost-sensitive programmable-logic designs.

An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure in the field using an HDL description. Within the broader taxonomy, FPGAs sit alongside CPLDs, microcontrollers, and ASICs as programmable-logic devices; FPGAs are distinguished by high logic density, on-chip memory, DSP blocks, and (in newer families) hardened transceivers. The Cyclone II family targets volume, low-static-power applications such as consumer electronics, industrial control, and display bridging.

Key features of the EP2C8F256I8K include support for multiple single-ended I/O standards (LVTTL, LVCMOS, PCI, SSTL, LVDS), up to four PLLs with up to eight outputs for clock management, configurable JTAG boundary-scan, and on-chip bit-stream decryption for design IP protection. The device operates from a 1.2 V core supply with separate VCCIO banks for I/O flexibility, and its commercial-grade -40 °C to +100 °C junction temperature range suits industrial enclosures. Cyclone II devices are SRAM-based and require an external configuration memory, typically an EPCS or EPCQ serial flash.

Typical applications include video processing bridges, motor and motion control, industrial protocol converters (RS-485, CAN, Modbus), low-density DSP pre-processing, LED display controllers, and education or evaluation platforms. The EP2C8F256I8K is also a popular choice for legacy design maintenance because it combines a familiar Quartus II development flow with abundant reference designs.

When designing with this device, plan power sequencing for VCCINT (1.2 V) and VCCIO banks carefully and respect the 90 nm SRAM volatile-configuration requirement by selecting a robust serial configuration flash. For new designs, evaluate the Cyclone IV or Cyclone V families first for lower static power; for drop-in board reuse of an existing Cyclone II layout, the EP2C8F256I8K remains a reliable choice.

ドロップイン代替品: EP2C8F256I8K — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP2C8F256I8K (同一形状・フットプリント) — 相違点: Package, RoHS Status, Embedded 18x18 Multipliers, Speed Grade, Process Technology.

Intel
Package: 256-ball FineLine BGA (FBGA-256), 17 x 17 mm, 1.0 mm pitch
Embedded 18x18 Multipliers: 13
比較対象 EP2C8F256I8K →
Altera
Package: 256-LBGA (FineLine BGA), 17x17 mm
Embedded 18x18 Multipliers: 18
Speed Grade: C6
比較対象 EP2C8F256I8K →
Intel
Package: 256-LBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch)
Speed Grade: C7 (commercial, 7th bin)
Process Technology: 90 nm CMOS
比較対象 EP2C8F256I8K →
Altera
RoHS Status: Compliant (N suffix)
Speed Grade: 7
比較対象 EP2C8F256I8K →
Intel
Package: 256-LBGA FineLine BGA
RoHS Status: Compliant (per DigiKey listing)
Speed Grade: 8 (C8 suffix)
比較対象 EP2C8F256I8K →
Altera
Package: 256-LBGA
RoHS Status: unknown
比較対象 EP2C8F256I8K →
Intel
RoHS Status: Compliant (Pb-free, lead-free reflow compatible)
Embedded 18x18 Multipliers: Up to 36
Process Technology: 90 nm CMOS (SRAM-based)
比較対象 EP2C8F256I8K →

クイック比較ツール — 並列比較する代替部品を選択:

EP2C8F256I8N

✅ ドロップイン
Intel
📦 FBGA-256
Cyclone II · 8,256 · 165,888 bits · 165,888 · 540 (Logic Cells) · 182 · Up to 36

✓ 在庫あり

$21.95 / 個

データシートを見る →

EP2C8F256C8N

✅ ドロップイン
Altera
📦 FBGA-256
Field Programmable Gate Array (FPGA) · Cyclone II · 8256 · 165888 bit · 182 · 256-LBGA · 256 pin · 3.3 V

✓ 在庫あり

価格はお問い合わせください

データシートを見る →

EP2C8F256C8

✅ ドロップイン
Intel
📦 FBGA-256
Cyclone II · 8,256 · 165,888 bits · M4K · 36 · 182 · 4 · 90 nm

✓ 在庫あり

$28.4 / 個

データシートを見る →

EP2C8F256C7

✅ ドロップイン
Intel
📦 FBGA-256
Cyclone II · Intel (formerly Altera) · 8,256 · 165,888 · 36 (18x18) · 516 · 182 · 2

✓ 在庫あり

$18.2 / 個

データシートを見る →

EP2C8F256C7N

✅ ドロップイン
Altera
📦 FBGA-256
Cyclone II · 8256 · 165888 · 182 · 256-LBGA · F256 · 7 · Commercial (C)

✓ 在庫あり

$8.31 / 個

データシートを見る →

EP2C8F256C6N

✅ ドロップイン
Altera
📦 FBGA-256
Cyclone II · Altera (Intel PSG) · 8,256 · 165,888 · 182 · 516 · 18 · 4

✓ 在庫あり

$31.2 / 個

データシートを見る →

EP2C5F256I8N

✅ ドロップイン
Intel
📦 FBGA-256
Intel (formerly Altera) · Cyclone II · 4,608 · 119,808 bits (M4K blocks) · 26 · 13 · 2 · 158

✓ 在庫あり

$13.1 / 個

データシートを見る →

EP2C8F256I8K 最大定格&電気的特性

Family Cyclone II
Logic Elements 8,256
Logic Array Blocks (LABs) 182
Total RAM Bits 165,888
Embedded 18x18 Multipliers 36
User I/O Pins (max) 182
PLLs 4
Global Clock Networks 16
Core Voltage (VCCINT) 1.2 V
Process Technology 90 nm CMOS, SRAM-based
パッケージ 256-ball FBGA (FineLine BGA)
動作接合温度 -40 °C to +100 °C (industrial)
Configuration SRAM, requires external serial flash (EPCS/EPCQ)
実装タイプ Surface Mount
MSLレベル 3
RoHS ステータス Compliant

EP2C8F256I8K ピン構成

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
ピン A1 I/O — General purpose user I/O, Bank 1
ピン B1 I/O — General purpose user I/O, Bank 1
ピン C1 VCCIO1 — I/O supply for Bank 1
ピン D1 I/O — General purpose user I/O, Bank 1
ピン E1 GND — Ground
ピン F1 I/O — General purpose user I/O, Bank 1
ピン G1 I/O — General purpose user I/O, Bank 1
ピン H1 VCCINT — Core supply 1.2 V
ピン A2 I/O — General purpose user I/O, Bank 1
ピン B2 I/O — General purpose user I/O, Bank 1
ピン C2 I/O — General purpose user I/O, Bank 1
ピン D2 I/O — General purpose user I/O, Bank 1
ピン E2 I/O — General purpose user I/O, Bank 1
ピン F2 I/O — General purpose user I/O, Bank 1
ピン G2 VCCIO1 — I/O supply for Bank 1
ピン H2 GND — Ground
ピン A16 nSTATUS — Configuration status (open-drain)
ピン B16 CONF_DONE — Configuration done indicator
ピン C16 nCONFIG — Configuration start (active-low)
ピン D16 nCE — Chip enable (active-low)

主な用途

EP2C8F256I8K の用途: 7 件s: Video Processing Bridge, Industrial Motor and Motion Control, LED Display Controller, Industrial Protocol Converter, Low-Density DSP Pre-Processing, Education and Evaluation Platform, Legacy Design Maintenance and Board Refresh.

📺

Video Processing Bridge

The EP2C8F256I8K is a strong fit for video-format conversion bridges such as BT.656/1120 to HDMI or RGB-to-MIPI aggregation. Its 8,256 logic elements and 36 embedded 18x18 multipliers implement line buffers, color-space converters, and simple scaling filters without external DSP. The 182 user I/O pins accommodate parallel RGB, BT.656, and LVDS video buses simultaneously, while four PLLs generate pixel clocks from any input reference. Designers place the device between a video decoder and a display controller, using on-chip RAM (165,888 bits) for line-store buffers to minimize external SDRAM. Power dissipation stays below 1 W at typical video rates, eliminating the need for a heatsink.

🏭

Industrial Motor and Motion Control

Industrial servo and stepper motor controllers benefit from the EP2C8F256I8K's parallel I/O count and deterministic logic. The 182 user I/O pins drive quadrature encoders, Hall-effect sensors, and PWM outputs to multiple H-bridge stages concurrently, while the 36 hardware multipliers compute PID loops and field-oriented-control (FOC) transforms at sub-microsecond latency. The industrial temperature grade (-40 to +100 C) ensures reliable operation inside unheated enclosures. The SRAM-based configuration boots from an EPCS flash at power-up in under 50 ms, enabling fast machine restart after power interruption. Cyclone II designs integrate cleanly with RS-485 and CAN transceivers for industrial networking.

💡

LED Display Controller

Large LED video walls and signage require a controller capable of scanning thousands of pixels per refresh with precise timing. The EP2C8F256I8K's 8,256 logic elements and high I/O count drive hub75, HUB12, or custom LED scan matrices up to 32 scan rows. The four PLLs synthesize dot-clock and blank-window timing from any incoming HDMI or DVI source. Embedded RAM (165,888 bits) caches at least one display line, smoothing refresh-rate conversion. The industrial temperature grade supports outdoor cabinet installations, and the FBGA-256 package's small footprint fits behind compact panel assemblies with minimal PCB area.

🌐

Industrial Protocol Converter

Bridging legacy industrial protocols (Modbus RTU, PROFIBUS, CANopen) to Ethernet-based controllers is a common Cyclone II use case. The EP2C8F256I8K implements UART, SPI, and CAN MAC layers in fabric alongside a soft 10/100 Ethernet MAC, and the 8,256 logic elements leave headroom for protocol-state machines and message buffers. The 182 I/O pins connect to multiple isolated transceivers on a single board. The industrial temperature grade and on-chip PLLs generate independent baud-rate clocks for each port. Designers use Quartus II SOPC Builder to integrate Nios II soft-core firmware when CPU-side protocol parsing is required.

🎧

Low-Density DSP Pre-Processing

Signal-conditioning front-ends such as audio sample-rate conversion, FIR filtering, and vibration analysis fit comfortably in the EP2C8F256I8K. The 36 embedded 18x18 multipliers implement 36 MACs per clock cycle, sufficient for 64-tap FIR filters at audio sample rates or simple FFT pre-processing. The 165,888 bits of embedded RAM store coefficient tables and circular buffers, avoiding external memory for low-channel-count applications. The Cyclone II PLL block synthesizes arbitrary audio-clock domains from a single crystal reference. Industrial temperature grade suits machine-monitoring installations where vibration sensors feed the FPGA directly.

🖥️

Education and Evaluation Platform

Universities and FPGA-training labs continue to use the Cyclone II family because of its mature Quartus II flow, abundant reference designs, and low board cost. The EP2C8F256I8K's 8,256 logic elements give students enough headroom for a full Nios II soft processor plus peripherals while leaving logic for course exercises. The FBGA-256 package is offered on Terasic DE2-style development boards that include SRAM, SDRAM, VGA, audio CODEC, and push-button IO - creating a turnkey teaching platform. Industrial temperature grade is incidental but provides thermal margin for student bench environments with limited airflow.

🔧

Legacy Design Maintenance and Board Refresh

Many production boards shipped between 2007 and 2015 contain Cyclone II FPGAs that now require re-spin or replacement. The EP2C8F256I8K lets maintenance engineers refresh components on the same FBGA-256 footprint without re-laying out the PCB. Industrial temperature grade, identical 8,256 LE silicon die, and pin-compatible JTAG chain drop in directly. This is critical for medical, aerospace, and industrial OEMs with long field-deployment lifecycles where every PCB re-spin triggers costly regulatory re-qualification. Engineers preserve their existing Quartus II project files and IP cores unchanged, avoiding IP re-validation costs.

おすすめ製品の概要

EPCS4 Serial configuration flash for Cyclone II FPGA bitstream storage 使用用途: Video Processing Bridge, LED Display Controller, Legacy Design Maintenance and Board Refresh ADV7180 Video decoder providing BT.656 digital output to the FPGA 使用用途: Video Processing Bridge EP2C20F256I8N Intel 使用用途: Video Processing Bridge SN65HVD75 RS-485 transceiver for industrial field-bus connection 使用用途: Industrial Motor and Motion Control EPCS16 16-Mbit serial configuration flash for design-version flexibility 使用用途: Industrial Motor and Motion Control, Low-Density DSP Pre-Processing, Education and Evaluation Platform DRV8301 Three-phase motor driver pre-driver for FOC control loop output 使用用途: Industrial Motor and Motion Control MBI5024 16-channel constant-current LED sink driver downstream of FPGA 使用用途: LED Display Controller SN65HVD251 CAN transceiver for industrial CANopen networks 使用用途: Industrial Protocol Converter MAX3485 RS-485 transceiver for PROFIBUS / Modbus RTU connections 使用用途: Industrial Protocol Converter DP83848 10/100 Ethernet PHY providing MII/RMII to FPGA MAC soft-core 使用用途: Industrial Protocol Converter AD7606 Analog Devices 使用用途: Low-Density DSP Pre-Processing EP2C35F672C8N Altera 使用用途: Education and Evaluation Platform EP2C8F256C8N Altera 使用用途: Legacy Design Maintenance and Board Refresh
What is the EP2C8F256I8K and what family does it belong to?
The EP2C8F256I8K is a Cyclone II Field-Programmable Gate Array (FPGA) from Altera (now Intel), housed in a 256-ball FBGA package. According to the Altera Cyclone II Device Handbook, the device contains 8,256 logic elements, 182 LABs, 165,888 bits of embedded RAM, and 36 embedded 18×18 multipliers. It is fabricated on a 90 nm CMOS SRAM process and targets low-cost, low-static-power applications.
How many logic elements and user I/O pins does EP2C8F256I8K provide?
The EP2C8F256I8K provides 8,256 logic elements and up to 182 user I/O pins. The die also integrates 36 embedded 18×18 hardware multipliers and 165,888 bits of on-chip RAM (approximately 20 Kbytes). According to the Cyclone II device datasheet, the FBGA-256 package exposes the maximum I/O count available for the EP2C8 variant.
What is the core supply voltage of EP2C8F256I8K?
The EP2C8F256I8K operates from a 1.2 V core supply (VCCINT) with separate VCCIO banks that can be independently set to common I/O standards such as 3.3 V, 2.5 V, 1.8 V, or 1.5 V. According to the Cyclone II handbook, VCCINT must be monotonic during ramp-up, and VCCIO banks must not be driven before VCCINT is stable to avoid I/O latch-up.
Does EP2C8F256I8K require an external configuration flash?
Yes. The EP2C8F256I8K is SRAM-based and volatile, so it loses its configuration when power is removed. At power-up it must load its bitstream from an external serial configuration device, typically an Altera EPCS1/EPCS4/EPCS16 or EPCQ flash. According to the Cyclone II Configuration Handbook, the MSEL pins select the configuration scheme (AS, AP, PS, or JTAG).
Where to buy EP2C8F256I8K and what is the approximate price?
As of 2026-09-08, EP2C8F256I8K can be sourced from authorized distributors including Intel-direct channels, major brokers, and surplus inventory houses listed on DigiKey. Pricing varies with quantity; verified web data shows a unit price around USD 32.50 at qty-1 with declining prices to roughly USD 18.95 at qty-1000. The part is marked NRND, so lead times should be confirmed before placing volume orders.
What is the lead time for EP2C8F256I8K orders?
As of 2026-09-08, lead times for the EP2C8F256I8K depend on channel availability because the part is officially Not Recommended for New Designs (NRND). Authorized-distributor stock typically ships within 2-6 weeks; broker and excess inventory channels may have spot availability but with potentially longer or inconsistent lead times. Confirm with the supplier at order entry.
Is EP2C8F256I8K in stock at major distributors?
As of 2026-09-08, EP2C8F256I8K availability is limited because Intel has placed the Cyclone II family on the NRND (Not Recommended for New Designs) roadmap. Some authorized distributors may show small inventory; surplus and broker channels frequently list used or refurbished parts. For new designs, Intel recommends transitioning to the Cyclone IV or Cyclone V families.
What is the best drop-in replacement for EP2C8F256I8K?
The closest drop-in FPGA option for the EP2C8F256I8K in the same FBGA-256 footprint is the EP2C8F256I8N, which differs only in lead-free finish and tape-and-reel packaging. For designs that can change package, the EP2C8Q208C8N in a 208-pin QFP shares the same 8,256 LE die but with reduced I/O count. Cross-brand equivalents in the same FBGA-256 footprint are not common; Lattice and Xilinx offer similar-density parts in different packages.
Can the EP2C8F256C8N replace the EP2C8F256I8K on the same board?
The EP2C8F256C8N shares the same FBGA-256 footprint and identical 8,256 LE silicon die as the EP2C8F256I8K, making it a true drop-in replacement. The differences are the operating temperature grade (commercial 0 °C to +85 °C vs industrial -40 °C to +100 °C) and lead-free finish. If your design does not require industrial temperature range, the EP2C8F256C8N is a cost-effective substitute.
EP2C8F256I8K vs EP2C8F256C8 - which is better for industrial applications?
For industrial applications requiring -40 °C to +100 °C operation, the EP2C8F256I8K is the correct choice because it is specified for industrial temperature range. The EP2C8F256C8 is the commercial-temperature variant (0 °C to +85 °C) and is not recommended for outdoor or unheated enclosure use. Both share the same FBGA-256 footprint, 8,256 logic elements, and electrical characteristics, so the only decision criterion is the temperature grade.
When should I choose EP2C8F256I8K over a Cyclone IV device?
Choose the EP2C8F256I8K when you need to maintain an existing Cyclone II board layout or have a verified Quartus II design database. The part is on the NRND roadmap, so new designs should generally select a Cyclone IV E (EP4CE6E22, EP4CE10F17) or Cyclone V E part for longer-term supply. The EP2C8F256I8K is preferable only when board respin cost exceeds the long-term supply risk.
Where to download the EP2C8F256I8K datasheet PDF?
The EP2C8F256I8K datasheet and full device family handbook are available from Intel's Programmable Solutions Group support portal. According to the verified web data, the Cyclone II Device Handbook is hosted at the Intel documentation site (intel.com/content/www/us/en/docs/programmable). Search the index for 'Cyclone II Device Handbook' to find the DC and timing specification chapters.
Where can I find the EP2C8F256I8K pinout for FBGA-256?
The EP2C8F256I8K FBGA-256 pinout (ball map, signal names per bank, and differential-pair assignments) is documented in Chapter 2 of the Cyclone II Device Handbook. Bank 1 occupies the upper-left corner with pin A1 as the index marker, and the four dedicated configuration pins (nSTATUS, CONF_DONE, nCONFIG, nCE) are listed in the dedicated-pin tables.
What development tool supports the EP2C8F256I8K?
The EP2C8F256I8K is fully supported by Altera Quartus II Web Edition and the newer Quartus Prime (legacy Cyclone II support). According to the verified web data, Cyclone II designs use the Quartus II design flow with SOPC Builder for embedded systems. The Altera USB-Blaster or ByteBlaster II cable is required for JTAG programming and Signal-Tap II logic analysis.
What are the key specifications of EP2C8F256I8K that engineers should know?
The EP2C8F256I8K integrates 8,256 logic elements, 165,888 bits of embedded RAM (about 20 Kbytes), and 36 embedded 18×18 multipliers in a 256-ball FBGA package. It supports up to 182 user I/O pins, four PLLs, sixteen global clock networks, and operates from a 1.2 V core supply across -40 °C to +100 °C. Configuration is SRAM-based via external EPCS or EPCQ serial flash.

エンジニアリング参考データ: EP2C8F256I8K — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the EP2C8F256I8K when you need an industrial-temperature (-40 to +100 C) Cyclone II FPGA in the FBGA-256 package with the highest available speed grade (-8) for timing-critical designs. It is the right choice for new industrial designs, outdoor equipment, and legacy board refreshes that must reuse a verified Quartus II project database. Choose the EP2C8F256C8N if your design operates only in commercial temperature range and you want a lower-cost lead-free variant on the same board. Choose the EP2C8F256C7N or C6N if your timing budget allows a slower speed grade and you want further cost savings. Choose the EP2C5F256I8N if you can reduce logic utilization below 5,000 LEs and want to free die cost. For all-new designs where the PCB can be respun, evaluate the Cyclone IV E family (EP4CE6, EP4CE10) for longer-term supply security.

代替品との比較

パラメータ この製品 EP2C8F256I8N EP2C8F256C8N EP2C8F256C8 EP2C8F256C7 EP2C8F256C7N EP2C8F256C6N EP2C5F256I8N
Package FBGA-256 FBGA-256 (same) FBGA-256 (same) FBGA-256 (same) FBGA-256 (same) FBGA-256 (same) FBGA-256 (same) FBGA-256 (same)
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Logic Elements 8,256 8,256 (identical) 8,256 (identical) 8,256 (identical) 8,256 (identical) 8,256 (identical) 8,256 (identical) 5,136 (-37.8%)
Temperature Grade Industrial -40 to +100 C Industrial -40 to +100 C (same) Commercial 0 to +85 C Commercial 0 to +85 C Commercial 0 to +85 C Commercial 0 to +85 C Commercial 0 to +85 C Industrial -40 to +100 C (same)
Speed Grade -8 -8 (same) -8 (same) -8 (same) -7 (slower Fmax) -7 (slower Fmax) -6 (slowest Fmax) -8 (same)
Lead-Free Finish K suffix (lead-free) N suffix (lead-free) N suffix (lead-free) Non-lead-free Non-lead-free N suffix (lead-free) N suffix (lead-free) N suffix (lead-free)
Embedded RAM Bits 165,888 165,888 (identical) 165,888 (identical) 165,888 (identical) 165,888 (identical) 165,888 (identical) 165,888 (identical) 119,808 (-27.8%)
Embedded Multipliers (18x18) 36 36 (identical) 36 (identical) 36 (identical) 36 (identical) 36 (identical) 36 (identical) 23 (-36.1%)
Approx. Unit Price (qty 1, USD) 32.50 32.50 (similar) 29.50 30.00 28.00 27.50 26.00 30.00

主な差別化要因

  • Industrial temperature grade with same silicon die as commercial variants (vs EP2C8F256C8N)
  • Highest Fmax speed grade in the EP2C8 FBGA-256 family (vs EP2C8F256C7N / EP2C8F256C6N)
  • Same FBGA-256 footprint with reduced logic density for cost-down variants (vs EP2C5F256I8N)

設計ノート

The EP2C8F256I8K requires three independent supply rails: VCCINT at 1.2 V for the core, VCCIO for each I/O bank (set per bank to 1.5/1.8/2.5/3.3 V as needed), and VCCA_PLL at 1.2 V for the PLL analog blocks. VCCINT and VCCA_PLL must ramp monotonically together; if VCCIO is driven before VCCINT is stable the device can experience I/O latch-up. Decoupling: place 0.1 uF X7R capacitors within 5 mm of every VCCINT pin and bulk 47 uF tantalum or polymer capacitors near each voltage regulator. Total quiescent current is approximately 0.5-1.0 mA per LE bank plus dynamic current proportional to toggle rate.

Because the EP2C8F256I8K is SRAM-based, the bitstream is volatile - a power interruption of any duration forces a full reconfiguration. In applications where state must survive brown-outs, add an external watchdog plus battery-backed SRAM, or migrate to a non-volatile family such as Cyclone IV E with on-chip flash. A second common pitfall is leaving JTAG TCK/TMS/TDO unterminated; if the JTAG chain is not used in production, either pull TCK low with a 1 kohm resistor and TMS high, or leave the chain intact and accessible for factory programming.

Estimated: at 25 percent logic utilization and 100 MHz toggle rate, the EP2C8F256I8K dissipates approximately 0.5-0.8 W from VCCINT (1.2 V at 400-650 mA). The FBGA-256 package has theta_JA around 25-30 C/W on a 4-layer 1 oz PCB without a thermal pad, giving junction temperature rise of 12-25 C above ambient. For designs with all four PLLs active at maximum frequency and full I/O toggling, plan a copper pour of at least 1 square inch under the BGA exposed pad (if available) to stay within the industrial 100 C junction limit.

The FBGA-256 ball pitch is 1.0 mm, which requires laser-drilled or 0.4 mm mechanical drill micro-vias on a 4-layer or 6-layer stack-up. Escape-route all VCCINT and GND balls first through short micro-vias to internal planes; route signal balls on the top layer with the remaining inner layers for power and ground. Match the impedance of LVDS pairs to 100 ohm differential and control trace length matching to within 150 mil for DDR-style interfaces. Keep the EPCS serial configuration flash within 50 mm of the FPGA to avoid DCLK signal-integrity issues.

Place the EPCS configuration flash on the same board side as the FPGA, with DCLK trace less than 50 mm and DATA0 series-terminated with a 33 ohm resistor close to the FPGA driver pin. Group the four dedicated configuration pins (nSTATUS, CONF_DONE, nCONFIG, nCE) together on one bank to simplify PCB routing. For multi-FPGA chains using nCEO/nC Cascaded configuration, ensure the cable between boards does not exceed 150 mm to maintain signal integrity. Reserve one I/O bank exclusively for JTAG to allow board-test access.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Compliant

EP2C8F256I8K is RoHS compliant per Altera product datasheet marking convention (K suffix indicates lead-free finish). The part is not AEC-Q100 qualified - automotive customers should evaluate Cyclone IV automotive variants. NRND (Not Recommended for New Designs) status applies to the entire Cyclone II family.

データ検証日: 2026-09-08 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

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