EP2S130F1020I4 - 132K LE Stratix II FPGA, 742 I/O, FC-FBGA-1020
部品番号: EP2S130F1020I4 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 25 | $1620 | $40,500.00 |
| 100 | $1495 | $149,500.00 |
| 250 | $1395 | $348,750.00 |
EP2S130F1020I4 概要
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor whose logic fabric, routing, and I/O can be customized after manufacturing via a configuration bitstream stored in SRAM. FPGAs sit between microcontrollers (fixed-function, software-driven) and ASICs (fixed-function, hardware) in the compute hierarchy: programmable logic IC -> reconfigurable logic -> programmable logic device -> semiconductor. The Stratix II generation introduced the adaptive logic module (ALM) architecture that replaces the 4-input LUT of earlier families with an 8-input fracturable LUT, improving effective density and DSP performance per silicon area.
Key features of the EP2S130F1020I4 include 12 high-speed transceiver-like channels (Stratix II does not include multi-gigabit transceivers, but supports LVDS I/O up to 1 Gbps), dedicated DSP blocks for high-throughput arithmetic, embedded TriMatrix memory with true dual-port and FIFO modes, and support for external memory interfaces including DDR2, DDR, QDRII, and RLDRAM. The 1.2 V core VCC plus PLL and I/O banks operate from independent supplies, enabling mixed-voltage system design. Internal pull-up resistors on all user I/O pins simplify board bring-up.
Typical applications span high-performance digital signal processing, ASIC prototyping, high-speed serial connectivity aggregation, and complex state-machine control in telecom, defense, and test-and-measurement equipment. The 742 I/O and large logic budget also suit memory-intensive datapaths such as packet buffering and image-processing pipelines.
When designing with this part, pay attention to configuration scheme selection (Fast Passive Parallel x8 is common at power-up), I/O bank voltage compatibility with attached memories, and thermal management: a 90 nm high-density FPGA can exceed 10 W under full utilization, requiring airflow or a heatsink. Confirm FPGA fabric utilization headroom against the 132,540 LE budget and verify timing closure in Quartus II before tape-out-equivalent prototype release. This page synthesizes distributor pricing, drop-in alternative MPNs sharing the F1020 FC-FBGA footprint, and design notes not consolidated in the manufacturer datasheet.
ドロップイン代替品: EP2S130F1020I4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2S130F1020I4 （同一形状・フットプリント） — 相違点: Operating Temperature, Speed Grade, Package, Total RAM Bits, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP2S130F1020C5N
✅ ドロップイン✓ 在庫あり
$1320 / 個
データシートを見る →EP2S130F1020C4N
✅ ドロップイン✓ 在庫あり
$2850 / 個
データシートを見る →EP2S130F1020C3N
✅ ドロップイン✓ 在庫あり
$1095 / 個
データシートを見る →EP2S130F1020C5
✅ ドロップイン✓ 在庫あり
$4100 / 個
データシートを見る →EP2S130F1020C4
✅ ドロップイン✓ 在庫あり
$2800 / 個
データシートを見る →EP2S130F1020I4 最大定格＆電気的特性
| Family | Stratix II |
| Logic Elements | 132,540 |
| Equivalent LEs | ~180,000 |
| Adaptive Logic Modules (ALMs) | 53,016 |
| Embedded Memory (bits) | 6,747,840 |
| Embedded Memory (M512 blocks) | 530 |
| Embedded Memory (M4K blocks) | 768 |
| Embedded Memory (M-RAM blocks) | 4 |
| Embedded 18x18 Multipliers | 504 |
| DSP Blocks | 48 |
| User I/O Pins | 742 |
| User I/O Banks | 12 |
| パッケージ | 1020-ball FC-FBGA (33x33 mm) |
| Process Node | 90 nm CMOS, all-layer copper |
| Core Voltage (VCCINT) | 1.2 V |
| Speed Grade | I (industrial performance) |
| Device Revision | 4 |
| 動作接合温度 | -40C to +100C (industrial) |
| Configuration Scheme | Fast Passive Parallel x8, Passive Serial, JTAG |
| 実装タイプ | Surface Mount (FC-FBGA) |
| RoHS ステータス | Compliant (per distributor listings) |
EP2S130F1020I4 1020-ball fc-fbga (33x33 mm) ピン配置ガイド
EP2S130F1020I4 (1020-ball fc-fbga (33x33 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2S130F1020I4.
詳細は データシート をご参照ください。
主な用途
EP2S130F1020I4 の用途: 6 件s: ASIC Prototyping, High-Speed Digital Signal Processing, Telecom Line Card Aggregation, Test and Measurement Instrumentation, Image and Video Processing Pipelines, Defense and Aerospace Signal Intelligence.
ASIC Prototyping
The EP2S130F1020I4's 132,540 LEs and 742 user I/O deliver sufficient logic capacity to map medium-to-large ASIC RTL designs (gate-equivalent up to ~2 M gates) for hardware emulation and verification. The 1.2 V 90 nm fabric provides deterministic timing that closely approximates the target ASIC, while the Stratix II ALM architecture preserves register and LUT hierarchy cleanly. The F1020 FC-BGA exposes 742 user I/O, enabling full visibility into internal ASIC nodes via logic analyzer or pattern-generator breakouts during bring-up. Quartus II synthesis-and-place-and-route flow with the TimeQuest timing analyzer provides ASIC-grade SDC constraint enforcement.
おすすめ
High-Speed Digital Signal Processing
The EP2S130F1020I4 integrates 504 18x18 multipliers in 48 dedicated DSP blocks, supporting sustained throughput for FIR filters, FFT engines, and radar/sonar preprocessing at sample rates above 200 MHz. Pairing the DSP fabric with the 6.75 Mbit embedded memory enables double-buffered sample stores without external SRAM. The Stratix II ALM architecture avoids the 4-LUT fragmentation that plagues DSP-heavy designs on older families, allowing multiplier-plus-adder chains to map cleanly. Industrial temperature rating makes this part suited to DSP cards in ruggedized defense and aerospace platforms.
おすすめ
Telecom Line Card Aggregation
The 742 user I/O of the EP2S130F1020I4 support aggregation of multiple E1/T1, E3/DS3, or Ethernet interfaces at the line card level, while 6.75 Mbit embedded memory absorbs packet bursts. SelectIO+ technology on each I/O bank allows 1.5 V LVCMOS, LVDS, LVPECL, and HSTL I/O standards, so the FPGA can interface directly to PHY chips, SerDes devices, and backplane transceivers without external level translation. DDR2/QDRII external memory controllers enable large packet buffer pools for QoS-aware scheduling.
おすすめ
Test and Measurement Instrumentation
The EP2S130F1020I4 is well suited to high-channel-count logic analyzer, protocol analyzer, and ATE pin-electronics front ends because of its high I/O count and reconfigurable I/O standards. The 1 Gbps LVDS capability on selected banks enables capture of high-speed serial protocols up to 8b/10b-encoded links. Industrial temperature rating plus 132,540 LEs also supports mixed-signal test orchestration with embedded soft-CPU cores for test sequencing.
おすすめ
Image and Video Processing Pipelines
The EP2S130F1020I4 handles real-time image processing for medical imaging, machine vision, and broadcast video at resolutions up to 1080p60 and beyond. The 6.75 Mbit embedded memory acts as line buffers between processing stages, while 504 18x18 multipliers accelerate convolution kernels and motion estimation. The 742 I/O support parallel camera sensor interfaces (LVDS-based sub-LVDS, HiSPi), HDMI/DVI input bridging, and DDR2 frame buffer access. Industrial temperature grade enables medical and factory-floor deployment.
おすすめ
Defense and Aerospace Signal Intelligence
The EP2S130F1020I4's industrial -40C to +100C junction rating and large logic capacity support rugged signal-intelligence and electronic-warfare preprocessing systems where COTS-plus components are acceptable. The high embedded memory bandwidth enables wideband digital down-conversion and cross-channel correlation. The 1020-ball FC-FBGA F1020 package is designed for high-vibration PCB mounting via underfill or corner staking, and the industrial speed grade 'I' provides sufficient timing margin over the full temperature swing.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2S130F1020I4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2S130F1020C5N | EP2S130F1020C4N | EP2S130F1020C3N | EP2S130F1020C5 | EP2S130F1020C4 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FC-FBGA (F1020) 33x33 mm | 1020-ball FC-FBGA (F1020) - same | 1020-ball FC-FBGA (F1020) - same | 1020-ball FC-FBGA (F1020) - same | 1020-ball FC-FBGA (F1020) - same | 1020-ball FC-FBGA (F1020) - same |
| Logic Elements | 132,540 LEs | 132,540 LEs | 132,540 LEs | 132,540 LEs | 132,540 LEs | 132,540 LEs |
| Embedded Memory | 6,747,840 bits | 6,747,840 bits | 6,747,840 bits | 6,747,840 bits | 6,747,840 bits | 6,747,840 bits |
| Embedded 18x18 Multipliers | 504 | 504 | 504 | 504 | 504 | 504 |
| User I/O Pins | 742 | 742 | 742 | 742 | 742 | 742 |
| Operating Temperature | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Speed Grade | I (industrial performance) | 5 (fastest C-grade) | 4 | 3 (slowest) | 5 | 4 |
| Lifecycle Status | Obsolete (last-time-buy completed) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- Industrial temperature grade for harsh environments （vs EP2S130F1020C5N)
- Largest logic capacity in the Stratix II family (after EP2S180) （vs EP2S90F1020C5N)
- 742 user I/O for high-density board connectivity （vs EP2C70F672I8N)
設計ノート
Estimated: A Stratix II EP2S130F1020I4 under full logic and DSP utilization at 200 MHz can dissipate 12-15 W. The 33x33 mm F1020 FC-FBGA exposes a thermal pad structure suited to a thermal interface material (TIM) plus an attached heatsink or a cold plate. Design the PCB with at least a 4-layer stack with a top-side copper pour stitched to the FPGA thermal balls, and use airflow of at least 200 LFM over the heatsink to keep junction temperature below 100C in industrial-grade operation.
Estimated: At full logic utilization (132K LEs at 100% toggle rate) the EP2S130F1020I4 core (VCCINT) draws approximately 4-6 A from the 1.2 V rail; PLL analog supplies (VCCA) and I/O banks add several hundred mA each. Use a multi-rail power-supply sequencer such as the LTC2978 or UCD9222 to enforce VCCINT-before-VCCIO turn-on and to monitor voltage tolerance windows; failure to sequence correctly can latch-up the device or reduce long-term reliability.
Estimated: The 1020-ball FC-FBGA at 1.0 mm pitch requires high-density PCB routing - a 12-layer stackup with 0.5 oz copper and 0.076 mm microvia stack is typical. Fan-out must escape the inner-row balls to buried vias; place at least one decoupling capacitor (0.1 uF X5R + 10 uF bulk) per every 4-6 power balls. Maintain 100-ohm differential impedance on LVDS pairs and verify signal-integrity simulation for DDR2 interfaces (which can operate up to 333 MHz at this speed grade).
The 'I4' suffix denotes both industrial temperature grade AND device revision 4; do not assume any Stratix II die revision will behave identically in your design - read the errata document for your revision before locking the bitstream. Configuration bitstreams are not revision-portable; recompile in Quartus II whenever switching die revision or speed grade.
Place the JTAG chain header within 50 mm of the EP2S130F1020I4 to keep TCK signal integrity. Add external 4.7k pull-ups on MSEL[2:0] configuration-mode pins and ensure nCONFIG, nSTATUS, and CONF_DONE have pull-ups per the Stratix II handbook. For high-speed LVDS I/O, route within one signal layer adjacent to a continuous ground plane and avoid splitting the plane under the FPGA.
コンプライアンス情報
RoHS and REACH compliance inferred from modern distributor listings; halogen-free status not explicitly stated in the verified web data. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Intel/Altera conflict-mineral statement available via corporate compliance portal.
