EP2S130F1508C5 - Stratix II FPGA, 132K LEs, 1508-FBGA | Intel / Altera
部品番号: EP2S130F1508C5 ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $455 | $4,550.00 |
| 100 | $412 | $41,200.00 |
| 500 | $378 | $189,000.00 |
| 1,000 | $345 | $345,000.00 |
EP2S130F1508C5 概要
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as block RAM and DSP blocks. Within the broader hierarchy, an FPGA is a programmable logic device -> logic IC -> integrated circuit -> semiconductor. FPGAs are typically selected over ASICs for lower NRE cost, faster time-to-market, and the ability to update hardware functionality in-system after deployment.
Key features of the EP2S130F1508C5 include Stratix II adaptive logic modules (ALMs) that pack more logic per LUT than previous architectures, dedicated high-speed external memory interfaces (DDR/DDR2/QDRII), up to 12 transceiver channels (Transceiver Block count per device variant), and rich clock management via PLLs. The device supports 1.15 V to 1.25 V core supply and is offered in the commercial speed grade C5. Internal clock networks, RAM blocks, and DSP blocks are tightly coupled to deliver >300 MHz DSP throughput in real designs.
Typical applications include high-speed DSP for wireless baseband and radar processing, ASIC prototyping and emulation, high-throughput data-acquisition front ends, telecom line cards with packet processing, and broadcast video effects engines. The 1508-FBGA package exposes enough I/O to support wide external memory buses plus multiple high-speed serial links via companion transceivers.
When designing with this part, engineers should validate PCB routing against the BGA escape pattern and use Altera/Intel Quartus II toolchain (or compatible) for synthesis and place-and-route. Confirm logic utilization and timing closure in simulation before committing to the production board. Note that the Stratix II family has been EOL'd by Intel; plan for long lead times or consider Stratix IV/V migration paths.
ドロップイン代替品: EP2S130F1508C5 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2S130F1508C5 （同一形状・フットプリント） — 相違点: Speed Grade, Package, Operating Temperature, Process Technology, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
EP2S130F1508C4
✅ ドロップイン✓ 在庫あり
$1295 / 個
データシートを見る →EP2S130F1508C3
✅ ドロップイン✓ 在庫あり
$1350 / 個
データシートを見る →EP2S130F1508C3N
✅ ドロップイン✓ 在庫あり
$270 / 個
データシートを見る →EP2S130F1508C4N
✅ ドロップイン✓ 在庫あり
$4435.83 / 個
データシートを見る →EP2S130F1508C4RB
✅ ドロップイン✓ 在庫あり
$1245 / 個
データシートを見る →EP2S130F1508C5 最大定格＆電気的特性
| Series | Stratix II |
| Manufacturer | Intel / Altera |
| Logic Elements / Cells | 132,540 |
| Logic Array Blocks (LABs) | 6,627 |
| Number of CLBs | 53,016 |
| User I/O Count | 1,126 |
| Embedded Memory (Bits) | 6,747,840 (approx. 6.7 Mbit) |
| Embedded 18x18 Multipliers | 252 |
| Core Voltage | 1.15 V to 1.25 V |
| Process Technology | 90 nm CMOS |
| Speed Grade | C5 (commercial) |
| パッケージ / ケース | 1508-BBGA, FCBGA (FineLine BGA) |
| Package Dimensions | 40 x 40 mm |
| Ball Pitch | 1.0 mm |
| 実装タイプ | Surface Mount |
| 動作温度 | Commercial (0 C to +85 C) |
EP2S130F1508C5 ピン構成
| ピン 1 | I/O Bank 8 — User I/O or dedicated pin (see pin-out file for exact assignment) |
| ピン 2 | I/O Bank 8 — User I/O or dedicated pin |
| ピン 3 | I/O Bank 8 — User I/O or dedicated pin |
| ピン 4 | VCCIO8 — I/O bank 8 supply voltage |
| ピン 5 | I/O Bank 8 — User I/O or dedicated pin |
| ピン 6 | GND — Ground |
| ピン 7 | I/O Bank 8 — User I/O or dedicated pin |
| ピン 8 | I/O Bank 7 — User I/O or dedicated pin |
| ピン 9 | VCCIO7 — I/O bank 7 supply voltage |
| ピン 10 | I/O Bank 7 — User I/O or dedicated pin |
主な用途
EP2S130F1508C5 の用途: 7 件s: Wireless Baseband DSP Processing, ASIC Prototyping and Emulation, High-Speed Data Acquisition Systems, Telecom Line Card Processing, Broadcast Video Processing, Radar Signal Processing, Test and Measurement Instrumentation.
Wireless Baseband DSP Processing
The EP2S130F1508C5's 252 18x18 multipliers and 6.7 Mbit embedded RAM make it well-suited for wireless baseband DSP chains. Its 1,126 user I/Os permit parallel connection to multiple ADC/DAC channels and external DDR2 memory. Designers typically map 3G/4G channel cards, OFDM FFT engines, and turbo decoders onto the fabric at 250-300 MHz, exploiting the Stratix II ALM architecture for high logic density per DSP block. The 1508-FBGA thermal envelope handles sustained DSP workloads within commercial temperature.
おすすめ
ASIC Prototyping and Emulation
With 132,540 logic elements and 1,126 I/Os, the EP2S130F1508C5 is widely deployed as an ASIC prototyping platform. Multiple FPGAs can be tiled via the high I/O count to emulate multi-million-gate ASICs. Quartus II place-and-route supports multi-FPGA partitioning. Designers use the abundant block RAM to model large register files and FIFO buffers. The 90 nm process provides predictable timing closure for ASIC RTL validation at near-ASIC speeds.
おすすめ
High-Speed Data Acquisition Systems
The EP2S130F1508C5's 1,126 I/Os and high-performance external memory interface (DDR/DDR2/QDRII) suit multi-channel data-acquisition front ends. Designers connect 16+ ADC channels at 100-200 MSPS directly into the FPGA, using LVDS pairs for clock and data. The 6.7 Mbit block RAM aggregates samples before DMA transfer. The 1508-FBGA package supports the wide bus widths needed for sustained gigasample-per-second acquisition with on-chip pre-processing.
おすすめ
Telecom Line Card Processing
Telecom line cards use the EP2S130F1508C5 for packet classification, traffic shaping, and SERDES bridging. The high I/O count connects to multiple SFP/SFP+ cages via onboard transceivers, while the embedded multipliers handle encryption and QoS metering. Designers implement deep packet inspection tables in 6.7 Mbit block RAM. The 1508-FBGA's 1.0 mm pitch supports dense backplane routing for ATCA or MicroTCA chassis.
おすすめ
Broadcast Video Processing
The EP2S130F1508C5 handles SD/HD video processing pipelines including format conversion, scaling, and chroma keying. The 252 DSP blocks accelerate 2D FIR filters and motion compensation. With 1,126 I/Os, designers route multiple DVI/HDMI/SDI streams in parallel. The 6.7 Mbit block RAM serves as line buffers and frame stores for real-time video effects. Quartus II Video and Image Processing Suite IP cores accelerate development.
おすすめ
Radar Signal Processing
Phased-array radar systems use the EP2S130F1508C5 for beamforming, pulse compression, and Doppler processing. The 252 18x18 multipliers support real-time FFT-based matched filtering at 250+ MHz, while the 6.7 Mbit RAM stores range-Doppler maps. The 1,126 I/Os interface to multi-element antenna arrays and high-speed ADCs. The Stratix II ALM architecture is efficient for radar-specific FIR/FFT pipelines. Industrial temperature grade parts handle field-deployed radar.
おすすめ
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers leverage the EP2S130F1508C5's logic density and high I/O count. Designers implement deep acquisition memory, complex triggering, and protocol decoding (PCIe, SATA, USB) on-chip. The 6.7 Mbit block RAM captures pre-trigger samples at multi-GSPS rates. The 1508-FBGA package supports dense probe-tip channel multiplexing with minimal signal degradation.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2S130F1508C5 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2S130F1508C4 | EP2S130F1508C3 | EP2S130F1508C3N | EP2S130F1508C4N | EP2S130F1508C4RB |
|---|---|---|---|---|---|---|
| Package | 1508-FBGA (40x40 mm, 1.0 mm pitch) | 1508-FBGA (40x40 mm, 1.0 mm pitch) - same | 1508-FBGA (40x40 mm, 1.0 mm pitch) - same | 1508-FBGA (40x40 mm, 1.0 mm pitch) - same | 1508-FBGA (40x40 mm, 1.0 mm pitch) - same | 1508-FBGA (40x40 mm, 1.0 mm pitch) - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Series | Stratix II | Stratix II - same | Stratix II - same | Stratix II - same | Stratix II - same | Stratix II - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Speed Grade | C5 | C4 (lower Fmax) | C3 (lowest Fmax) | C3 (lowest Fmax) | C4 (lower Fmax) | C4 (lower Fmax) |
| Lead-Free / RoHS | Standard (non-N suffix) | Standard | Standard | Lead-free / N suffix | Lead-free / N suffix | Tape-and-reel variant |
| User I/O Count | 1,126 | 1,126 | 1,126 | 1,126 | 1,126 | 1,126 |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V |
| Lifecycle Status | Last-time-buy (EOL) | Last-time-buy (EOL) | Last-time-buy (EOL) | Last-time-buy (EOL) | Last-time-buy (EOL) | Last-time-buy (EOL) |
主な差別化要因
- Highest speed grade in the Stratix II EP2S130 family （vs EP2S130F1508C4)
- Maximum logic density in Stratix II family （vs EP2S60F1020C5)
- 1508-FBGA package exposes 1,126 user I/Os （vs EP2S130F1020C5 (1020-FBGA variant))
設計ノート
Estimated: At typical Stratix II utilization of 60-70% logic and 250 MHz operation, the EP2S130F1508C5 dissipates 8-12 W. The 1508-FBGA package has theta_JA around 12-15 C/W with a standard 8-layer PCB; junction temperature can reach 100-150 C above ambient without airflow. Heatsink attachment or forced-air cooling (200 LFM minimum) is required for sustained operation. Thermal simulation is strongly recommended before committing to the mechanical design.
The 1508-FBGA with 1.0 mm pitch requires microvia or via-in-pad PCB technology for fanout. Use 8-12 layer stackup with dedicated ground and power planes directly under the BGA. Decoupling: place 0.1 uF X7R capacitors on every VCCIO and VCCINT ball, plus bulk 100 uF tantalum or polymer caps within 1 inch of the package. Follow the Altera Stratix II board design guidelines for trace widths, impedance control, and length matching for DDR2 interfaces.
LVDS and DDR2 signals require 100 ohm differential impedance with matched trace lengths within 25 mils for clock-data pairs. Use series termination resistors near the FPGA driver. Route high-speed signals on inner layers with continuous reference planes. Avoid routing signals over plane splits. The configuration flash and JTAG header should be placed within 2 inches of the FPGA with short, direct traces.
Do not assume speed-grade C5 parts will meet your timing without closure in Quartus II fitter. Stratix II FPGAs require careful attention to DSP block pipelining and RAM block read-during-write modes. Verify the configuration scheme (AS, PS, JTAG) and ensure the EPCS or EPCQ flash is correctly sized for the programming file. Note that Stratix II is EOL; do not start new production designs without planning a migration path to Stratix IV or V.
コンプライアンス情報
RoHS and lead-free status marked unknown - datasheet excerpt provided does not specify compliance. N-suffix variants (e.g. EP2S130F1508C4N) indicate lead-free / RoHS-compliant options. AEC-Q100 not applicable - this is a commercial-grade FPGA, not automotive-qualified.
