EP2S30F484C4 - Stratix II FPGA 33,880 Logic Elements | Intel / Altera
部品番号: EP2S30F484C4 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168 | $1,680.00 |
| 100 | $152 | $15,200.00 |
| 500 | $138 | $69,000.00 |
| 1,000 | $124 | $124,000.00 |
EP2S30F484C4 概要
A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to configure digital circuits after PCB assembly by loading a configuration bitstream into on-chip SRAM. FPGAs sit in the broader semiconductor hierarchy as integrated circuits (ICs) > programmable logic > programmable logic devices (PLDs) > FPGAs, and are commonly used as glue logic, DSP accelerators, high-speed serial interface bridges, and ASIC prototyping platforms. Unlike ASICs, FPGAs deliver time-to-market advantages and in-system reprogrammability at the cost of higher per-unit price and static power consumption.
Key features of the EP2S30F484C4 include 13552 CLBs, 16 global clock networks, embedded 18-bit × 18-bit multipliers (DSP blocks), and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL via dedicated True Physical (TPHY) interface circuitry. The device integrates up to 1.36 Mbit of embedded TriMatrix memory distributed across MRAM, M4K, and M512 blocks, enabling on-chip FIFO and packet-buffer implementations without external SRAM. Dedicated high-speed transceiver channels are not included in this density; designs requiring multi-Gbps serial links would target Stratix II GX variants.
Architecturally, the Stratix II family uses an 8-input ALM with a shared arithmetic chain, allowing any 6-input LUT function to be packed alongside a second smaller LUT into the same ALM, which improves logic density versus traditional 4-input LUT architectures. The 1.2 V core is supported by on-chip voltage regulation, and configuration can be loaded through JTAG, passive serial (PS), fast passive parallel (FPP), or via an external configuration device such as the EPCS or EPC4 family.
Typical applications include telecom line-card processing, industrial motor control, ASIC prototyping, video processing pipelines, and military/aerospace systems where the commercial-temp variant is acceptable. The 484-pin FBGA with 1.0 mm ball pitch supports compact board layouts while exposing 342 general-purpose I/Os, sufficient for multi-lane parallel buses.
When designing with this part, designers should pay particular attention to power-plane decoupling for the 1.2 V VCCINT rail (multiple 0.1 µF + bulk 10 µF capacitors adjacent to the package), the use of Quartus II design software (the original development flow; Quartus Prime is required for newer Stratix series but Stratix II is still supported in legacy versions), and thermal management on the FC-FBGA with adequate via stitching to inner ground planes.
This page synthesizes distributor pricing, drop-in Stratix II alternatives (same 484-ball footprint), and practical design notes not found in the standalone manufacturer datasheet.
ドロップイン代替品: EP2S30F484C4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2S30F484C4 （同一形状・フットプリント） — 相違点: Package, Speed Grade, Operating Temperature, PLLs, Core Voltage.
クイック比較ツール — 並列比較する代替部品を選択:
EP2S30F484C3
✅ ドロップイン✓ 在庫あり
$620 / 個
データシートを見る →EP2S30F484C3N
✅ ドロップイン✓ 在庫あり
$797.9622 / 個
データシートを見る →EP2S30F484I4
✅ ドロップイン✓ 在庫あり
$159 / 個
データシートを見る →EP2S30F484I4N
✅ ドロップイン✓ 在庫あり
$305 / 個
データシートを見る →EP2S30F484C5N
✅ ドロップイン✓ 在庫あり
$367.48 / 個
データシートを見る →EP2S30F484C5
✅ ドロップイン✓ 在庫あり
$305.4 / 個
データシートを見る →EP2S30F484C4 最大定格＆電気的特性
| Family | Stratix II |
| Logic Elements | 33,880 |
| Logic Array Blocks (LABs) | 1694 |
| CLBs | 13552 |
| Total RAM Bits | 1,369,728 |
| User I/Os | 342 |
| Core Voltage (VCCINT) | 1.2 V |
| Process Technology | 90 nm CMOS |
| Maximum Operating Frequency | 711.24 MHz |
| パッケージ | 484-pin FC-FBGA (1.0 mm pitch) |
| Package Dimensions | 23 x 23 mm |
| 実装タイプ | Surface Mount |
| 動作温度 | 0 °C to +85 °C (Commercial) |
| Temperature Grade | C4 (Commercial) |
| Configuration Interface | JTAG / Passive Serial / Fast Passive Parallel |
EP2S30F484C4 23 x 23 mm ピン配置ガイド
EP2S30F484C4 (23 x 23 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2S30F484C4.
詳細は データシート をご参照ください。
主な用途
EP2S30F484C4 の用途: 7 件s: ASIC Prototyping and Logic Emulation, Telecom Line-Card Processing, Video Processing Pipelines, Industrial Motor Control and Drive, Test and Measurement Instrumentation, Defense and Aerospace Down-Select (with COTS screening), Embedded DSP Front-End (Software Defined Radio).
ASIC Prototyping and Logic Emulation
The EP2S30F484C4's 33,880 logic elements and 1.36 Mbit of embedded RAM provide sufficient capacity to prototype mid-complexity ASIC designs before tapeout. Its 342 user I/Os accommodate full 32- to 64-bit wide bus emulation, while the Quartus II design flow supports ASIC-style gate-level netlists. The commercial temp grade (0 °C to 85 °C) suits lab and bench-validation environments, and drop-in migration to the I4 variant (industrial temp) is straightforward when prototypes need field deployment. Compared with FPGA fabric-only logic emulators, the Stratix II family integrates DSP blocks and TriMatrix memory that allow prototype validation of DSP subsystems and FIFO-heavy dataplanes.
おすすめ
Telecom Line-Card Processing
Telecom line cards use FPGAs like the EP2S30F484C4 for packet classification, framer interfacing, and backplane bridging. The 342 I/Os are sufficient to interface multiple SFI-4 or SPI-4 parallel backplane lanes plus local packet-DRAM buses, while the on-chip 18×18 multipliers accelerate CRC and QoS policing. The 1.2 V core combined with 90 nm CMOS delivers predictable power for air-cooled ATCA shelves, and the 484-ball FC-FBGA exposes enough user I/O to keep board layers manageable. Compared with ASIC solutions, the EP2S30 lets telecom OEMs re-spin feature sets without re-masking.
おすすめ
Video Processing Pipelines
The EP2S30F484C4 is well-suited to mid-resolution video processing such as 1080p60 image signal processing, multi-channel HD-SDI muxing, and camera-link front ends. Its 711 MHz core clock and on-chip DSP blocks handle real-time color-space conversion and deinterlacing without external co-processors, while the 1.36 Mbit embedded RAM acts as line buffers, eliminating external SRAM. The 484-ball FC-FBGA provides enough LVDS pairs for parallel camera interfaces, and the commercial temp grade matches indoor broadcast equipment. Compared with discrete DSP solutions, the EP2S30 collapses DSP, glue logic, and video timing into one part.
おすすめ
Industrial Motor Control and Drive
Industrial motor drives use the EP2S30F484C4 to combine field-oriented control (FOC), PWM generation, encoder feedback, and communication interfaces in one programmable platform. The DSP blocks run Park/Clarke transforms and PI controllers in hardware, while the 342 I/Os support multiple encoder channels, gate-driver interfaces, and CAN/RS-485 links. Drop-in migration to the EP2S30F484I4N industrial-temp variant extends operation to -40 °C to 100 °C for outdoor cabinet drives. Compared with fixed-function MCUs, the EP2S30 enables rapid tuning of control algorithms and multi-axis coordination in a single device.
おすすめ
Test and Measurement Instrumentation
Automated test equipment and bench instrumentation use the EP2S30F484C4 for protocol-aware pattern generation, deep trace capture, and high-speed ADC/DAC interfacing. The 711 MHz fabric and 342 I/Os can drive 16+ parallel LVDS lanes at 1 Gbps aggregate, enough for protocol analyzers on PCIe Gen1, Serial RapidIO, or proprietary backplanes. The 1.36 Mbit embedded RAM captures multi-event trace buffers without external FIFO chips. Compared with discrete logic + ASIC solutions, the EP2S30 lets test vendors re-target protocols through bitstream swaps, accelerating time-to-market for new standards.
おすすめ
Defense and Aerospace Down-Select (with COTS screening)
The EP2S30F484C4 is occasionally used in defense subsystems where commercial-temp screening is acceptable per MIL-STD-454 or the program-specific COTS allowance. Its 342 I/Os handle MIL-STD-1553, ARINC 429, and high-speed serial sensor buses, while 90 nm CMOS radiation tolerance is sufficient for non-geostationary-orbit missions with appropriate shielding. Designers typically screen lots using the EP2S30F484I4 industrial-temp variant, then perform their own up-screening for vibration and thermal-cycling. Compared with rad-hard ASICs, the EP2S30 delivers lower NRE cost and faster iteration.
おすすめ
Embedded DSP Front-End (Software Defined Radio)
The EP2S30F484C4 is used as a DSP front-end for software-defined-radio (SDR) platforms where down-conversion, channelization, and pulse shaping are implemented in FPGA fabric. Its 18×18 multipliers handle FFT/FIR blocks at IF sample rates up to ~200 MHz, while 1.36 Mbit embedded RAM stores FFT windows. The 342 user I/Os accept parallel ADC outputs from 12/14-bit GSPS converters, making the EP2S30 a mid-range cost/performance node for tactical SDR. Compared with TI DSP + FPGA two-chip solutions, a single EP2S30 reduces BOM and inter-chip latency.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2S30F484C4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2S30F484C3 | EP2S30F484C3N | EP2S30F484I4 | EP2S30F484I4N | EP2S30F484C5 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-ball FC-FBGA (1.0 mm pitch) | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Speed Grade | C4 | C3 (slower) | C3 (slower) | I4 | I4 | C5 (faster) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial |
| Lead-Free (N suffix) | No | No | Yes | No | Yes | No |
| User I/Os | 342 | 342 | 342 | 342 | 342 | 342 |
| Total RAM Bits | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- Mid-density Stratix II device with a high I/O-to-LE ratio （vs EP2S15F484C4)
- Same-footprint migration to industrial temperature （vs EP2S30F484I4)
- Higher fMAX headroom than lower speed grades （vs EP2S30F484C3)
- Cost-effective configuration via small EPCS device （vs Stratix II GX variants (e.g., EP2SGX30EF484))
設計ノート
The EP2S30F484C4 requires at least four independent supply rails: VCCINT (1.2 V core), VCCIO (per-bank I/O voltage, 1.5 V to 3.3 V), VCCPD (3.3 V pre-driver), and VCC_CLK (2.5 V PLL clock). Decoupling guidance from the Stratix II device handbook recommends at least one 0.1 µF X7R capacitor per VCC/VCCIO ball adjacent to the package, plus bulk 22 µF to 47 µF tantalum or ceramic on each supply. Designers should also tie VCCAUX to 2.5 V even when not using JTAG, since the auxiliary pins feed internal programming logic.
The 484-ball FC-FBGA uses a 1.0 mm ball pitch and a 22 × 22 ball array with corner depopulation. Recommended PCB stack-up is at least six layers with dedicated ground and power planes directly below the BGA; via-in-pad (VIPPO) is strongly recommended for signal layers. Per the Altera AN-428 PCB layout guidelines, escape trace width should be 4 mil (0.1 mm) with 8 mil (0.2 mm) drill and 16 mil (0.4 mm) antipad. Trace impedance for LVDS pairs should be 100 Ω differential.
Estimated: with typical 33,880-LE Stratix II utilization at 50% and 100 MHz internal clock, ICCINT is approximately 1.5 A, leading to 1.8 W core dissipation plus ~0.6 W from I/O at 50 MHz toggle rate. The 484-ball FC-FBGA has a theta_JA of approximately 17 °C/W with 1 oz copper inner planes; junction-to-ambient delta is therefore under 35 °C, well within the 85 °C commercial limit. Industrial deployments targeting 100 °C ambient should verify with measured thermal profiling on the actual PCB.
Common pitfalls with the EP2S30F484C4 include: (1) loading bitstreams through FPP from a misconfigured EPC4 — verify MSEL pin settings match the configuration mode (00 = AS, 01 = PS, 10 = FPP, 11 = JTAG); (2) confusing 'C4' speed grade with package size — 'C4' is the speed grade encoding, not the ball count; (3) attempting to JTAG-chain multiple Stratix II devices — each MSEL encoding must match every device in the chain; (4) failing to power-down in the correct sequence — VCCINT must reach 1.0 V before VCCIO/VCCPD cross 2.0 V during ramp-up.
Pin assignments should be generated through Quartus II Fitter rather than manual pin picking, especially for the EP2S30F484C4 with 342 user I/Os. The Fitter respects I/O bank voltage rules (grouping I/Os by VCCIO bank), differential-pair placement, and DDR/PCIe clocking constraints. Manual pin edits outside Fitter recommendations may silently fail at 711 MHz fMAX. Designers should review the 'Pin-Out File (.csv)' in the Quartus project output before committing the PCB layout to fabrication.
コンプライアンス情報
RoHS / REACH / lead-free status is not explicitly stated in the verified web data for the EP2S30F484C4; the part pre-dates strict RoHS enforcement on many Altera Stratix II SKUs. The 'N' suffix variants (e.g., EP2S30F484C3N, EP2S30F484I4N) explicitly denote lead-free packages and are the recommended choice if RoHS compliance is required. The EP2S30F484C4 itself should be verified against the lot date code for RoHS exemption applicability.
