EP2S90F1020C4 - Stratix II FPGA 90K LE 1020-BGA | Intel
部品番号: EP2S90F1020C4 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 25 | $1650 | $41,250.00 |
| 100 | $1495 | $149,500.00 |
| 500 | $1325 | $662,500.00 |
EP2S90F1020C4 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than fixed at the fab. Within the broader semiconductor taxonomy, FPGAs sit under programmable logic, a peer category to ASICs and microcontrollers, and are widely used for parallel DSP, high-speed serial I/O bridging, and rapid hardware prototyping. The Stratix II generation introduced an adaptive logic module (ALM) architecture that improved performance and density over the original Stratix family.
Key features of the EP2S90F1020C4 include 4,548 LABs/CLBs, 12 embedded DSP blocks, 96 embedded 18x18 multipliers, 4 PLLs, and support for external memory interfaces including DDR, DDR2, QDR II, and RLDRAM. The device integrates 12 transceiver channels at up to 6.375 Gbps, making it suitable for high-speed serial link aggregation in communications backplanes.
The Stratix II architecture combines ALMs with TriMatrix embedded memory blocks (MLABs, M4K, M-RAM), enabling efficient implementation of both DSP datapaths and on-chip buffering. Combined with 758 general-purpose I/Os across 8 banks supporting LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X signaling, the EP2S90F1020C4 acts as a high-density system integration point.
Typical applications include telecom line cards, software-defined radio baseband processing, video broadcast encoding/decoding, ASIC prototyping, and high-speed serial protocol bridging. Designers choose the EP2S90F1020C4 when raw logic density, embedded DSP throughput, and integrated transceivers must coexist on one silicon die.
A key design consideration is the 1.2 V core supply rail: a low-noise regulator such as a TPS7A4701 or equivalent LDO should supply the VCCINT rail, and the 1020-BGA flip-chip land pattern demands a high-layer-count PCB with controlled-impedance routing. Power estimation tools (Quartus II PowerPlay) are recommended before thermal design closure.
This page synthesizes verified distributor pricing, same-family drop-in alternatives, and practical design notes not collected in the manufacturer datasheet.
ドロップイン代替品: EP2S90F1020C4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2S90F1020C4 （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Speed Grade, Logic Elements, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP2S90F1020C3N
✅ ドロップイン✓ 在庫あり
$1995 / 個
データシートを見る →EP2S90F1020C3
✅ ドロップイン✓ 在庫あり
$640 / 個
データシートを見る →EP2S130F1020C4N
✅ ドロップイン✓ 在庫あり
$2850 / 個
データシートを見る →EP2S130F1020C4
✅ ドロップイン✓ 在庫あり
$2800 / 個
データシートを見る →EP2S130F1020C3N
✅ ドロップイン✓ 在庫あり
$1095 / 個
データシートを見る →EP2S180F1020C4N
✅ ドロップイン✓ 在庫あり
$171 / 個
データシートを見る →EP2S180F1020C3N
✅ ドロップイン✓ 在庫あり
$6800 / 個
データシートを見る →EP2S90F1020C4 最大定格＆電気的特性
| Family | Stratix II |
| Logic Elements | 90,960 |
| Total RAM Bits | 4,520,488 |
| User I/Os | 758 |
| LABs/CLBs | 4,548 |
| Embedded DSP Blocks | 12 |
| Embedded 18x18 Multipliers | 96 |
| Number of PLLs | 4 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| Maximum Operating Frequency | 711.24 MHz |
| パッケージ | 1020-ball FC-FBGA |
| 実装タイプ | Surface Mount |
| 動作温度 | 0C to +85C (commercial) |
| Transceivers | 12 channels up to 6.375 Gbps |
EP2S90F1020C4 1020-ball fc-fbga ピン配置ガイド
EP2S90F1020C4 (1020-ball fc-fbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2S90F1020C4.
詳細は データシート をご参照ください。
主な用途
EP2S90F1020C4 の用途: 7 件s: Telecom Line Card Processing, Software-Defined Radio Baseband, Video Broadcast Encoding and Decoding, ASIC Prototyping, High-Speed Serial Protocol Bridging, Industrial Test and Measurement Equipment, Aerospace and Defense Long-Term Support.
Telecom Line Card Processing
The EP2S90F1020C4 fits telecom line card processing because its 90,960 logic elements and 12 transceiver channels up to 6.375 Gbps handle multi-protocol packet classification and forwarding at line rate. The 758 user I/Os across 8 banks support SFI-4.2, SPI-4.2, and UTOPIA interfaces without external bridge chips. Designers benefit from the integrated 4,520,488-bit TriMatrix memory for deep packet buffering, and the 4 PLLs provide flexible clock domain generation for backplane SerDes aggregation.
おすすめ
Software-Defined Radio Baseband
The EP2S90F1020C4 suits SDR baseband processing thanks to 96 embedded 18x18 multipliers and 12 DSP blocks delivering up to ~2.5 GMACs of throughput for FFT, channelization, and modulation. The 90,960 logic elements implement channel filters, timing recovery, and MAC layers in parallel fabric. The 12 transceiver channels interface directly to ADC/DAC companion chips on the same board, eliminating discrete SERDES, while the 1.2 V core and Quartus II DSP IP library shorten time-to-prototype for OFDM and LTE waveforms.
おすすめ
Video Broadcast Encoding and Decoding
The EP2S90F1020C4 enables broadcast video codecs because its 90,960 logic elements and 758 I/Os handle parallel SD/HD-SDI input aggregation with simultaneous transcoding in fabric. The 4,520,488 bits of on-chip memory buffer reference frames and B-pictures without external SRAM, simplifying PCB layout. Transceiver channels at 6.375 Gbps carry 3G-SDI streams natively, and the 96 multipliers accelerate DCT/IDCT transforms in H.264 and MPEG-2 pipelines.
おすすめ
ASIC Prototyping
The EP2S90F1020C4 is widely used as an ASIC prototyping vehicle because its 90,960 logic elements can map RTL blocks from mid-complexity ASICs with high fidelity. The 4,520,488-bit embedded memory mimics large register files and FIFOs, while 96 multipliers accelerate DSP-heavy netlists. Partitioning across the 1020-FBGA I/O count (758 signals) lets designers emulate multi-million-gate ASIC designs, and Quartus II synthesis preserves timing-accurate RTL for sign-off comparison.
おすすめ
High-Speed Serial Protocol Bridging
The EP2S90F1020C4 fits serial protocol bridging because its 12 transceiver channels support PCIe, Serial RapidIO, GBE, and custom SerDes protocols at up to 6.375 Gbps. Designers implement protocol stacks, DMA engines, and link-layer logic in 90,960 logic elements while the 758 user I/Os provide parallel endpoint connectivity. The 4 PLLs generate multiple reference clocks needed for independent serial domains, eliminating external clock buffers.
おすすめ
Industrial Test and Measurement Equipment
The EP2S90F1020C4 suits test and measurement because its 758 user I/Os digitize many channels simultaneously and its 96 embedded multipliers perform real-time FFT/DFT at sample rates up to 250 MHz. The 4,520,488-bit memory stores capture buffers, and 12 transceiver channels stream aggregated data to host processors over PCIe or Serial RapidIO. Industrial users also leverage the commercial 0C to +85C operating range for laboratory and factory-floor deployments.
おすすめ
Aerospace and Defense Long-Term Support
The EP2S90F1020C4 continues to serve aerospace and defense programs because of its mature Quartus II tool flow, documented supply chain, and traceability through specialty brokers like FPGAX. Its 758 user I/Os and 90,960 logic elements handle radar signal processing, encryption accelerators, and avionics bus interfaces. Defense customers value the long-term availability, hermetic-grade packaging options, and stable bitstream format across long program lifecycles.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2S90F1020C4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2S90F1020C3N | EP2S130F1020C4N | EP2S180F1020C4N |
|---|---|---|---|---|
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same |
| Logic Elements | 90,960 | 90,960 (same) | 130,440 (+43%) | 180,440 (+98%) |
| Total RAM Bits | 4,520,488 | 4,520,488 (same) | 6,747,840 (+49%) | 9,521,408 (+111%) |
| Speed Grade | C4 (faster) | C3 (slower) | C4 (same) | C4 (same) |
| User I/Os | 758 | 758 (same) | 758 (same) | 742 (similar) |
| DSP Blocks | 12 | 12 (same) | 16 (+33%) | 18 (+50%) |
| Embedded Multipliers | 96 | 96 (same) | 128 (+33%) | 144 (+50%) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
主な差別化要因
- Best density-per-watt at 90 nm （vs EP2S130F1020C4N)
- Cost-optimized for mature designs （vs EP2S180F1020C4N)
- Speed grade 4 vs grade 3 timing margin （vs EP2S90F1020C3N)
設計ノート
The EP2S90F1020C4 core voltage is 1.2 V with separate VCCIO rails per bank (1.5 V, 1.8 V, 2.5 V, 3.3 V typical). Use a TPS7A4701 LDO or equivalent for the VCCINT rail; switching regulators are acceptable only with adequate input filtering and PI simulation to avoid coupling noise into transceiver PLLs. Estimated: typical quiescent current is 1-2 A; full-load transceivers push current above 3 A. Decoupling requires 0.1 uF and 10 uF ceramics within 5 mm of each power pin.
The 1020-ball FC-FBGA flip-chip package requires a high-layer-count PCB (10+ layers) with microvia or stacked-via technology for breakout routing. Use 1 oz copper on outer layers and 0.5 oz on inner layers with 1.27 mm ball pitch; escape routing must maintain 100 ohm differential impedance for transceiver lanes. Estimate: keep out area around the BGA should be free of components for at least 5 mm to allow via-in-pad and dog-bone fanout.
The EP2S90F1020C4 can dissipate 10-15 W under full load with active transceivers and 90% logic utilization. Attach a heatsink with thermal interface material rated for the 1020-FBGA top surface, and provide forced airflow of at least 200 LFM. Estimate: theta_JA is approximately 12 C/W with a heatsink; without a heatsink, the junction temperature can exceed 100 C in still air, triggering thermal shutdown.
Place reference clocks within 25 mm of the corresponding PLL clock input pins and route them over a continuous ground plane. Transceiver channels should match length within 0.13 mm for pairs and 2.5 mm across the channel for PCIe Gen2 compliance. AC-coupling capacitors (0.01 uF to 0.1 uF) must be placed in the transmit signal path close to the FPGA ball, with the capacitor body oriented to minimize via stubs.
Common pitfalls include: (1) not enabling the Quartus II initialization bitstream before JTAG configuration, causing the device to appear dead; (2) exceeding the maximum of 758 user I/Os by reassigning bank VCCIO levels incorrectly; (3) mixing 1.5 V and 1.8 V signaling on the same bank without proper VREF reference design; (4) failing to program the MSEL pins for the correct configuration scheme (AS, PS, JTAG). Always verify configuration mode and power sequencing before first bring-up.
コンプライアンス情報
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - the part is a commercial-grade FPGA (0C to +85C). Industrial temperature variants exist in EP2S90F1020I4N for harsher environments.