EP2SGX130GF1508C3 - Stratix II GX 132K Logic Elements FPGA | Intel
部品番号: EP2SGX130GF1508C3 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 50 | $1610 | $80,500.00 |
| 100 | $1495 | $149,500.00 |
| 250 | $1380 | $345,000.00 |
EP2SGX130GF1508C3 概要
A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hardware resources (memory, transceivers, DSP blocks) on a single die. FPGAs occupy a unique tier in the semiconductor hierarchy between general-purpose processors (CPUs, MCUs) and application-specific integrated circuits (ASICs): they offer ASIC-class parallelism and throughput while retaining firmware-level reconfigurability. The Stratix II GX family specifically targets high-speed serial I/O and signal-processing workloads, sitting within the broader categories of programmable logic -> logic ICs -> integrated circuits -> semiconductors.
Key features of the EP2SGX130GF1508C3 include 132,540 logic elements, 6,627 LABs (Logic Array Blocks), 717 MHz maximum internal operating frequency, and integrated PCI Express hard IP. The device supports LVDS, LVTTL, LVCMOS, and LVPECL I/O standards across 734 user I/Os distributed in 12 banks, enabling flexible mixed-voltage interfacing. Embedded RAM totals 6,748,860 bits distributed across MRAM and M4K blocks, providing high-bandwidth on-chip storage for packet buffers and DSP coefficient tables.
The 90 nm process node delivers a balance of power efficiency and operating frequency for the Stratix II GX architecture. Up to 20 full-duplex transceiver channels support protocols including PCI Express, XAUI, Serial RapidIO, and custom serial interfaces up to 6.375 Gbps. Cyclone-to-Stratix migration is supported through Quartus II design tools, and the device family is supported by the Altera Quartus II design suite for synthesis, place-and-route, and timing analysis.
Typical applications include high-end telecommunications line cards, military radar and signal processing, medical imaging backplanes, ASIC prototyping, and high-performance computing acceleration. The 1508-ball FBGA package supports high signal-density boards required for multi-gigabit serial designs. The Stratix II GX family is well-suited to wireline backhaul, test and measurement equipment front ends, and custom hardware accelerators where deterministic latency and parallel processing are required.
Design consideration: the 1.2 V core supply requires multiple decoupling capacitors placed adjacent to the dedicated VCC pins per the pin connection guidelines. The 40 x 40 mm package demands controlled-impedance PCB stack-up and matched-length routing for transceiver channels. Junction temperature must remain below the 100 C commercial operating limit for C3 speed grade parts, requiring thermal vias beneath the package thermal pad.
This page synthesizes distributor availability, Stratix II GX family cross-references, and practical design considerations not consolidated in the manufacturer datasheet, supporting faster sourcing decisions for engineers evaluating EP2SGX130-class FPGAs.
ドロップイン代替品: EP2SGX130GF1508C3 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2SGX130GF1508C3 （同一形状・フットプリント） — 相違点: Package, RoHS Status, Logic Elements, Speed Grade, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP2SGX130GF1508C5
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$645 / 個
データシートを見る →EP2SGX130GF1508C4
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$985 / 個
データシートを見る →EP2SGX130GF1508I3
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EP2S130F1508C3
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1350 / 個
データシートを見る →EP2S180F1508C3
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP2SGX130GF1508C3 最大定格＆電気的特性
| Family | Stratix II GX |
| Logic Elements | 132,540 |
| Logic Array Blocks (LABs) | 6,627 |
| Total Memory Bits | 6,748,860 |
| Maximum User I/O | 734 |
| Number of I/O Banks | 12 |
| Transceiver Channels | Up to 20 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Operating Temperature Grade | Commercial (C3 speed grade) |
| パッケージ | 1508-ball FBGA (FCBGA) 40 x 40 mm, 1.0 mm pitch |
| Maximum Internal Frequency | 717 MHz |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Contains lead / RoHS non-compliant |
EP2SGX130GF1508C3 1508-ball fbga (fcbga) 40 x 40 mm, 1.0 mm pitch ピン配置ガイド
EP2SGX130GF1508C3 (1508-ball fbga (fcbga) 40 x 40 mm, 1.0 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2SGX130GF1508C3.
詳細は データシート をご参照ください。
主な用途
EP2SGX130GF1508C3 の用途: 6 件s: High-Speed Telecommunications Line Cards, Military Radar and Signal Processing, ASIC Prototyping and Emulation, Medical Imaging Backplanes, Test and Measurement Equipment, High-Performance Computing Acceleration.
High-Speed Telecommunications Line Cards
The EP2SGX130GF1508C3's 20 integrated transceiver channels supporting up to 6.375 Gbps are ideal for wireline backhaul line cards and SONET/SDH framers in telecommunications infrastructure. With 132,540 logic elements and 6.7 Mbit embedded memory, the device handles multi-protocol aggregation including XAUI, Serial RapidIO, and custom serial links without external PHY devices. The 1.2 V core on a 90 nm process balances throughput and power efficiency for densely populated line card designs where 734 user I/Os interface to network processors and framer ASICs.
おすすめ
Military Radar and Signal Processing
The Stratix II GX architecture in EP2SGX130GF1508C3 is well-suited to military radar beamforming and signal-processing front ends where deterministic latency and high parallelism are required. With 6,748,860 bits of embedded memory and 132,540 logic elements, the FPGA implements pulse compression, FFT cores, and adaptive beamforming algorithms in real time. The integrated transceivers stream digitized IF data directly to backplane ADCs/DACs at multi-gigabit rates, eliminating external serializer/deserializer components in size-constrained platforms.
おすすめ
ASIC Prototyping and Emulation
With 132,540 logic elements and 734 user I/Os, the EP2SGX130GF1508C3 serves as an effective ASIC prototyping platform for designs up to ~10 million gates. The Stratix II GX family supports large multi-FPGA partitioning with high-speed serial links between devices for chip-level verification before tape-out. Quartus II design tools provide synthesis and incremental compile flows that accelerate bring-up of complex SoC prototypes, while the commercial C3 speed grade offers faster compile times than lower-speed bins.
おすすめ
Medical Imaging Backplanes
The EP2SGX130GF1508C3 enables real-time image reconstruction in CT, MRI, and ultrasound systems where parallel processing of high-bandwidth data streams is required. 132,540 logic elements implement parallel beamforming and back-projection kernels, while 6.7 Mbit embedded memory stores filter coefficient tables and intermediate frame buffers. The 20 transceiver channels aggregate digitized sensor data from analog front-end boards, reducing PCB complexity in space-constrained scanner chassis.
おすすめ
Test and Measurement Equipment
Test and measurement front ends for oscilloscopes, protocol analyzers, and logic analyzers leverage the EP2SGX130GF1508C3's high-speed transceivers and abundant logic capacity. The device implements real-time protocol triggering, deep trace memory buffering via 6.7 Mbit embedded RAM, and high-bandwidth data export over PCI Express or XAUI links. With 717 MHz maximum internal frequency, the FPGA meets timing closure requirements for state machine decoding at multi-gigabit line rates.
おすすめ
High-Performance Computing Acceleration
The EP2SGX130GF1508C3 functions as a coprocessor in HPC clusters where 132,540 logic elements accelerate custom algorithms such as genomics search, financial Monte Carlo simulation, or scientific kernels. The integrated transceivers deliver 6.375 Gbps link bandwidth to host CPUs over proprietary interconnect, while embedded memory provides fast scratchpad storage for tiled matrix operations. The C3 commercial speed grade offers the lowest-cost option for accelerator cards deployed in temperature-controlled data center racks.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2SGX130GF1508C3 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2SGX130GF1508C5 | EP2SGX130GF1508C4 | EP2SGX130GF1508I3 | EP2S130F1508C3 | EP2S180F1508C3 |
|---|---|---|---|---|---|---|
| Package | 1508-ball FBGA 40x40 mm | 1508-ball FBGA 40x40 mm - same | 1508-ball FBGA 40x40 mm - same | 1508-ball FBGA 40x40 mm - same | 1508-ball FBGA 40x40 mm - same | 1508-ball FBGA 40x40 mm - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 179,400 (+35%) |
| Transceiver Channels | Up to 20 | Up to 20 | Up to 20 | Up to 20 | 0 (no transceivers) | 0 (no transceivers) |
| Speed Grade | C3 (commercial) | C5 (commercial, faster) | C4 (commercial) | I3 (industrial) | C3 (commercial) | C3 (commercial) |
| User I/Os | 734 | 734 | 734 | 734 | 734 | 734 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Node | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| Embedded Memory Bits | 6,748,860 | 6,748,860 | 6,748,860 | 6,748,860 | 6,748,860 | 9,383,040 (+39%) |
主な差別化要因
- Integrated multi-gigabit transceivers vs Stratix II non-GX variants （vs EP2S130F1508C3)
- Commercial speed grade C3 is the lowest-cost option in this density tier （vs EP2SGX130GF1508C5)
- Same package footprint as other 130K Stratix II GX variants （vs EP2S180F1508C3)
設計ノート
The EP2SGX130GF1508C3 requires multiple supply rails: VCCINT (1.2 V core), VCCIO (per bank, 1.2-3.3 V), VCCA (1.2 V PLL analog), and VCCD_PLL (1.2 V PLL digital). Power sequencing must follow the Stratix II GX handbook guidelines: VCCINT must ramp before or simultaneously with VCCIO, and the POR (power-on-reset) trip point must be respected. Use of a dedicated FPGA power sequencer IC such as the LTC2923 or equivalent is recommended for multi-rail sequencing. Decoupling: place 0.1 uF and 0.01 uF ceramic capacitors adjacent to every VCC pin pair, with bulk 100 uF-470 uF polymer or electrolytic capacitors at each supply domain.
Estimated: at full logic utilization with 20 active transceivers, total power consumption may approach 15-20 W. The 1508-ball FBGA package exposes a thermal pad; PCB layout must include a continuous ground plane beneath the package with thermal vias (0.3 mm drill, 0.5 mm pitch) to inner copper layers for heat spreading. Without thermal management, junction temperature can exceed 100 C and trigger thermal protection. Use thermal simulation tools (e.g., ANSYS, FloTHERM) during board design to validate the thermal solution before fabrication.
The 1508-ball FBGA at 1.0 mm pitch requires HDI PCB fabrication with microvia (laser-drilled) technology for inner-layer breakout. Stack-up: minimum 8-layer board with 4 routing layers; recommended 10-12 layers for full transceiver signal integrity. Transceiver channels require 100-ohm differential routing with matched length within 150 mil for data lines and within 25 mil for the differential pair. Use the Stratix II GX handbook High-Speed Board Design Guidelines for reference stack-up, and target an insertion loss below 6 dB at 3 GHz for 6.375 Gbps links.
Common pitfalls when designing with the EP2SGX130GF1508C3: (1) Configuration mode selection (AS, PS, JTAG) must be set correctly via MSEL pins; mismatched settings prevent the device from configuring. (2) Unused transceiver channels must be powered down in Quartus II to avoid excess current draw. (3) JTAG TCK must be slower than the configuration clock for boundary-scan operations. (4) The C3 speed grade has the slowest timing among commercial grades; switching to C7 (industrial) or higher speed grade requires re-running timing analysis. (5) Do not connect pull-up or pull-down resistors to JTAG pins; these pins have internal weak pull-ups per the handbook.
コンプライアンス情報
Per YIC Electronics distributor listing, the EP2SGX130GF1508C3 contains lead and is RoHS non-compliant. This is consistent with Stratix II GX devices manufactured before the RoHS transition. REACH, halogen-free, and conflict minerals status were not stated in available data.
