EP3C40Q240C8N - Cyclone III FPGA, 39.6K LEs, 240-BFQFP | Intel
部品番号: EP3C40Q240C8N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $108.01 | $108.01 |
| 10 | $97.21 | $972.10 |
| 100 | $81.5 | $8,150.00 |
| 500 | $70.2 | $35,100.00 |
| 1,000 | $64.8 | $64,800.00 |
EP3C40Q240C8N 概要
A Cyclone III FPGA is a programmable logic device built on a TSMC 65 nm low-power process that combines lookup tables (LUTs), embedded memory blocks (M9K), embedded multipliers, and a flexible I/O ring into a single fabric. Cyclone III sits within Intel's FPGA hierarchy below Cyclone IV and Cyclone V, optimized for cost-sensitive, power-sensitive applications such as industrial control, video processing, and communication bridging. The fabric is configured at power-up from an external flash memory or via JTAG.
Key features include 4 phase-locked loops (PLLs) for flexible clock synthesis, support for multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL), and 20 global clock networks. The Cyclone III family emphasizes low static and dynamic power compared with Cyclone II while maintaining a comparable logic density. The 240-BFQFP package enables conventional surface-mount assembly with no fine-pitch BGA handling, simplifying prototyping and low-volume manufacturing.
Typical applications include industrial motor control, video surveillance and image processing pipelines, automotive infotainment pre-production prototypes, low-cost software-defined radio front-ends, and protocol bridging between legacy and modern serial interfaces. The combination of 126 hardware multipliers and 1134 Kb of block RAM makes the EP3C40 well suited to DSP-style filtering and buffering tasks that would otherwise require a discrete DSP.
Designers should plan for at least 4-layer PCB stack-up with dedicated power planes for VCCINT (1.2 V) and VCCIO (1.2 V to 3.3 V) to maintain signal integrity across the 128 user I/Os. Quartus II Web Edition (or later) is required for synthesis, place-and-route, and bitstream generation; configuration can be loaded via JTAG or through an Altera-compatible serial flash.
This page synthesizes current distributor pricing, same-family Cyclone III drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: EP3C40Q240C8N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3C40Q240C8N （同一形状・フットプリント） — 相違点: Package, Speed Grade, Family, Core Voltage, Logic Elements.
クイック比較ツール — 並列比較する代替部品を選択:
EP3C40Q240C8
✅ ドロップイン✓ 在庫あり
$78.5 / 個
データシートを見る →EP3C40Q240I8N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP3C40Q240C7N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EP3C25Q240C8N
✅ ドロップイン✓ 在庫あり
$160.4667 / 個
データシートを見る →EP3C16Q240C8N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$30.9 / 個
データシートを見る →EP4CE40F23I7N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$52.75 / 個
データシートを見る →EP3C40Q240C8N 最大定格＆電気的特性
| Family | Cyclone III |
| Logic Elements | 39,600 |
| Embedded Memory | 1,161,216 bits (1134 Kb) |
| Embedded 18x18 Multipliers | 126 |
| PLLs | 4 |
| User I/Os | 128 (maximum for this package) |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) |
| Process Node | TSMC 65 nm low-power |
| パッケージ | 240-BFQFP (Plastic Enhanced QFP) |
| ピン数 | 240 |
| 実装タイプ | Surface Mount |
| 動作温度 | 0C to +85C (commercial) |
| Speed Grade | 8 |
| Configuration | Serial (AS) or JTAG |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
EP3C40Q240C8N 240-bfqfp (plastic enhanced qfp) ピン配置ガイド
EP3C40Q240C8N (240-bfqfp (plastic enhanced qfp) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3C40Q240C8N.
詳細は データシート をご参照ください。
主な用途
EP3C40Q240C8N の用途: 6 件s: Industrial Motor Control, Video Surveillance and Image Processing, Automotive Infotainment Prototyping, Low-Cost Software-Defined Radio Front-End, Legacy-to-Modern Protocol Bridging, Educational FPGA Development Platforms.
Industrial Motor Control
The EP3C40Q240C8N fits three-phase industrial motor control because its 126 embedded 18x18 multipliers implement field-oriented control (FOC) and Park/Clarke transforms without an external DSP, while 1134 Kb of embedded memory buffers three-phase PWM waveforms and ADC sample streams. The 4 PLLs generate the high-resolution PWM carrier clocks and the encoder sampling clock from a single crystal, simplifying BOM. The 240-BFQFP package survives conventional SMT reflow and is reworkable in the field, important for industrial drive serviceability. Designers typically run the FPGA at 100 MHz to 150 MHz for FOC loops, well within the EP3C40 timing margin for speed grade 8.
おすすめ
Video Surveillance and Image Processing
The EP3C40Q240C8N handles real-time video pipelines at D1 to 720p resolutions because its 126 hardware multipliers run Sobel, Gaussian, and motion-detection kernels in parallel without CPU offload, while M9K memory blocks implement line buffers for incoming pixel streams. The 128 user I/Os accommodate parallel BT.656 or LVDS camera inputs plus a TFT or HDMI bridge output. The 1.2V core voltage plus 3.3V I/O allows direct connection to CMOS image sensors without level shifters. Quartus II provides free video IP cores that target this exact density, accelerating time-to-market for surveillance OEMs.
おすすめ
Automotive Infotainment Prototyping
The EP3C40Q240C8N is used in pre-production automotive infotainment prototypes because its 39,600 LEs run CAN, LIN, and MOST protocol stacks in hardware, offloading the application processor and freeing it for HMI rendering. The 1134 Kb of block RAM holds audio buffers for hands-free and voice-prompt functions, while 128 I/Os interface to TFT panels, touch controllers, and external codecs. Although the C8N commercial grade does not meet AEC-Q100 directly, prototypes typically migrate to the I7N industrial grade (also 240-BFQFP) for qualification testing, sharing the same PCB and Quartus project.
おすすめ
Low-Cost Software-Defined Radio Front-End
The EP3C40Q240C8N implements SDR front-end functions including digital up/down-conversion, channel filtering, and FFT pre-processing because its embedded multipliers execute complex MAC operations at 100 MHz-plus sample rates. The 4 PLLs derive ADC sampling clocks and DAC reconstruction clocks from a common reference, while 1134 Kb of memory buffers sample streams between the converter and the host CPU. The Cyclone III architecture supports LVDS I/O at hundreds of MHz, enabling direct connection to wideband ADC/DAC pairs. Power consumption is roughly 30 percent lower than Cyclone II at the same operating frequency.
おすすめ
Legacy-to-Modern Protocol Bridging
The EP3C40Q240C8N bridges between legacy parallel buses (ISA, VME, PC/104) and modern serial interfaces (PCIe, USB, GbE) because its 128 user I/Os absorb wide legacy data buses while embedded multipliers handle serial encoding/decoding and CRC generation. The 1134 Kb of memory implements FIFO buffers between mismatched bus widths, and the 4 PLLs supply independent clocks for both legacy and modern domains. The 240-BFQFP package allows hand-solderable rework for industrial replacement applications. Quartus II IP library includes legacy bus controllers that compile directly to EP3C40 resources.
おすすめ
Educational FPGA Development Platforms
The EP3C40Q240C8N powers university and training FPGA development boards because its 240-BFQFP package is hand-solderable and reworkable, allowing students to recover from bad soldering and bridging mistakes. The 39,600 LEs and 1134 Kb memory support rich lab projects covering CPU cores (Nios II), DSP filters, and full SoC designs without exhausting resources. Quartus II Web Edition (free) supports the part fully, eliminating software licensing cost for academic users. The 4 PLLs and 128 I/Os accommodate the typical mix of switches, LEDs, displays, and external memory found on training boards.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3C40Q240C8N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3C40Q240C8 | EP3C40Q240I8N | EP3C40Q240C7N | EP3C25Q240C8N | EP3C16Q240C8N | EP4CE40F23I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 240-BFQFP | 240-BFQFP - same | 240-BFQFP - same | 240-BFQFP - same | 240-BFQFP - same | 240-BFQFP - same | 240-BFQFP - same family footprint |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 24,624 (-38%) | 15,408 (-61%) | 39,600 (same density, new family) |
| Embedded Memory | 1134 Kb | 1134 Kb | 1134 Kb | 1134 Kb | 594 Kb (-48%) | 516 Kb (-54%) | 1134 Kb |
| Embedded 18x18 Multipliers | 126 | 126 | 126 | 126 | 66 (-48%) | 56 (-56%) | 116 (-8%) |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| User I/Os | 128 | 128 | 128 | 128 | 148 (more I/Os freed by lower density) | 148 (more I/Os freed by lower density) | 148 (Cyclone IV E pin mapping) |
| Temperature Grade | Commercial 0C to 85C | Commercial 0C to 85C | Industrial -40C to 100C | Commercial 0C to 85C | Commercial 0C to 85C | Commercial 0C to 85C | Industrial -40C to 100C |
| Speed Grade | 8 | 8 | 8 | 7 (~12% faster) | 8 | 8 | 7 |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.0 V to 1.2 V (lower core voltage) |
主な差別化要因
- Highest density in the Cyclone III 240-BFQFP package family （vs EP3C25Q240C8N)
- Drop-in commercial-grade pin-compatible sibling available （vs EP3C40Q240I8N)
- Migration path to newer Cyclone IV E family without package redesign （vs EP4CE40F23I7N)
設計ノート
The EP3C40Q240C8N requires a clean 1.2 V core supply (VCCINT) with tolerance to 1.15 V to 1.25 V per the Cyclone III datasheet. I/O bank supplies (VCCIO) operate from 1.2 V to 3.3 V and are bank-independent, allowing mixed-voltage I/O standards on the same device. Place at least one 0.1 uF decoupling capacitor per VCCINT and VCCIO pin, plus bulk 10 uF to 100 uF tantalum or polymer capacitors near each supply pin. Estimated: at typical 100 MHz operation with moderate toggle rates, ICCINT is in the 200 mA to 500 mA range and ICCIO depends entirely on bank loading.
The 240-BFQFP package has 0.5 mm pitch leads and requires a 4-layer PCB with dedicated VCCINT and GND planes for clean power delivery and signal return paths. Reserve at least 6 mil trace/space design rules for breakout from the QFP, and use 8 mil traces to escape the inner leads. A thermal pad is not present on this QFP; rely on copper pours on top and inner layers for heat dissipation. Estimate: at 1.5 W total power, a 10 mm x 10 mm copper pour on each layer keeps junction rise below 25 C without forced airflow.
Do not leave any VCCIO bank supply floating - unused banks should be tied to a valid voltage (typically 2.5 V or 3.3 V) to prevent floating I/O pin states. Configuration mode pins (MSEL) must be tied to specific levels to select AS, PS, JTAG, or Fast passive parallel configuration; floating MSEL pins cause boot failures. JTAG TCK must be pulled low or driven by a valid buffer during power-up to prevent configuration glitches. Always include a pull-up on nCONFIG and a pull-down on nSTATUS per Cyclone III handbook recommendations.
Cyclone III LVDS inputs and outputs support data rates up to 840 Mbps per the family datasheet. For LVDS, route differential pairs with 100 ohm differential impedance and maintain pair length matching within 150 mil. SSTL and HSTL I/O standards used for DDR/DDR2 memory interfaces require 50 ohm single-ended impedance and length matching to within 50 mil across byte lanes. The 4 PLLs are placed in corner banks; place clock input pins within 2 LAB rows of the PLL for best jitter performance.
コンプライアンス情報
RoHS and REACH compliant per Intel product declaration. C8N suffix denotes commercial temperature grade and is not AEC-Q100 qualified; for automotive applications choose EP3C40Q240I8N industrial grade and validate against AEC-Q100 requirements at the system level. Halogen-free status not explicitly stated in available data.
