EP3CLS70F780I7 - Cyclone III LS 70K LEs FPGA 780-FBGA | Intel
部品番号: EP3CLS70F780I7 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168 | $1,680.00 |
| 100 | $152 | $15,200.00 |
| 500 | $138 | $69,000.00 |
| 1,000 | $125 | $125,000.00 |
EP3CLS70F780I7 概要
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as multipliers and memory. FPGAs occupy a tier above general-purpose microcontrollers in the embedded-compute hierarchy: they offer ASIC-class parallelism and deterministic timing while remaining fully reprogrammable, which makes them the device of choice for high-throughput digital signal processing, custom interface bridging, and hardware-acceleration offload. The Cyclone III LS family specifically targets cost- and power-sensitive designs that require hardware DSP, on-chip RAM, and transceivers or external PHY interfacing, ranking below the more expensive Cyclone IV/V/10 FPGAs in both logic density and transceiver count.
Key features of the EP3CLS70F780I7 include 4 PLLs, 20 global clock networks, 429 maximum user I/Os, dedicated 18x18 hardware multipliers for DSP, and built-in support for DDR/DDR2/QDRII external memory interfaces. The 'I' suffix denotes the Industrial temperature grade (-40C to +100C case), and the '7' speed grade reflects moderate performance within the family. The device operates from a 1.15 V to 1.25 V core supply, with separate VCCPD and VCCIO banks for I/O voltage flexibility (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, 3.3 V LVCMOS/LVTTL).
Architecturally, the Cyclone III LS is fabricated on a 60 nm TSMC low-power process and adds Cyclone III LS-specific blocks such as a configuration bitstream security engine (AES-128/256), CRC and parity protection on internal RAM, and on-chip temperature-sensing diodes. This security/reliability layer differentiates LS from the standard Cyclone III family and is the reason LS parts are commonly specified in industrial-control, military, and aerospace-defense subsystems where bitstream IP protection is required.
Typical applications include industrial motor control and factory-automation backplanes, telecom baseband and protocol-bridging designs, video processing pipelines (surveillance, broadcast), portable test and measurement equipment, and low-cost software-defined radio (SDR) front-ends. The wide temperature range also makes it suitable for outdoor telecommunications gear and automotive infotainment prototyping.
When designing with the EP3CLS70F780I7, plan the power-distribution network around multiple decoupling capacitor values (typically 0.1 uF, 0.01 uF, and bulk) placed under the BGA footprint to suppress simultaneous switching noise (SSN) on the 429 I/O. The FBGA-780 package requires X-ray inspection or proper BGA rework equipment; JTAG-based programming via the Altera/Intel Quartus II toolchain (Cyclone III device family support) is the standard configuration flow.
This page synthesizes distributor pricing for 780-FBGA variants, same-family drop-in alternatives (different speed grades and package options) sourced from the Site MPN list, and practical PCB-layout and configuration notes not found in the manufacturer datasheet alone.
ドロップイン代替品: EP3CLS70F780I7 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3CLS70F780I7 （同一形状・フットプリント） — 相違点: Package, Embedded Memory Bits, Process Technology, RoHS Status, Device Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP3CLS70F780C7N
✅ ドロップイン✓ 在庫あり
$318.75 / 個
データシートを見る →EP3CLS70F780C8N
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP3CLS100F780I7N
✅ ドロップイン✓ 在庫あり
$174 / 個
データシートを見る →EP3CLS100F780I7
✅ ドロップイン✓ 在庫あり
$775 / 個
データシートを見る →EP3CLS150F780I7N
✅ ドロップイン✓ 在庫あり
$128 / 個
データシートを見る →EP3C80F780I7N
✅ ドロップイン✓ 在庫あり
$514.03 / 個
データシートを見る →EP3CLS70F780I7 最大定格＆電気的特性
| Family | Cyclone III LS |
| Logic Elements (LEs) | 70,208 |
| Embedded Memory Bits | 3,068,928 bits (2.93 Mbit) |
| Hardware Multipliers (18x18) | 413 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Maximum User I/Os | 429 |
| パッケージ | 780-ball FBGA (1.0 mm pitch, 29 x 29 mm) |
| Operating Temperature (Industrial, 'I') | -40C to +100C (case) |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V |
| I/O Supply Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Configuration Support | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |
| Bitstream Encryption | AES-128/256 (LS-family feature) |
| Process Node | 60 nm TSMC low-power |
| RoHS ステータス | Non-compliant (per Cyclone III LS datasheet prefix per verified data) |
| Speed Grade | 7 (moderate) |
EP3CLS70F780I7 780-ball fbga (1.0 mm pitch, 29 x 29 mm) ピン配置ガイド
EP3CLS70F780I7 (780-ball fbga (1.0 mm pitch, 29 x 29 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3CLS70F780I7.
詳細は データシート をご参照ください。
主な用途
EP3CLS70F780I7 の用途: 6 件s: Industrial Motor Control and Factory Automation, Telecom Protocol Bridging and Baseband Processing, Video Processing and Surveillance Pipelines, Software Defined Radio (SDR) Front-End, Portable Test and Measurement Equipment, Automotive Infotainment Prototyping.
Industrial Motor Control and Factory Automation
The EP3CLS70F780I7 fits industrial motor control because its 413 dedicated 18x18 multipliers and 2.93 Mbit embedded memory enable multi-axis field-oriented control (FOC) loops in a single device. The 70K LEs host custom PWM generation, encoder-decoder interfaces (EnDat, BISS, SSI), and safety logic (STO, SLS) required by IEC 61800-5-2 functional-safety drives. With 429 user I/Os, designers wire multiple incremental encoder channels, isolated GPIO, and EtherCAT/EtherNet/IP PHYs directly to the FPGA. The Industrial -40C to +100C temperature grade ensures operation in unconditioned factory cabinets where ambient temperatures exceed 60C. The Cyclone III LS AES-128/256 bitstream encryption protects proprietary motor-control IP from cloning. Estimated: at 100 MHz system clock, three-axis FOC consumes approximately 35K LEs and 240 multipliers, leaving headroom for safety logic.
おすすめ
Telecom Protocol Bridging and Baseband Processing
The EP3CLS70F780I7 is well suited for telecom protocol bridging because its 4 PLLs, 20 global clock networks, and 413 multipliers can serialize/deserialize custom framer interfaces and run forward-error-correction (FEC) DSP at line rate. The 2.93 Mbit on-chip RAM absorbs packet bursts in CPRI/OBSAI framer-to-MAC bridges, and the 780-FBGA exposes enough I/Os to drive multiple SFP cages, LVDS links, and SERDES helper PHYs. The -40C to +100C industrial temperature grade supports outdoor base-station enclosures. LS-family AES bitstream encryption protects carrier-licensed protocol stacks from cloning. Estimated: a CPRI-to-10G-Ethernet bridge consumes roughly 45K LEs, 200 multipliers, and 1.8 Mbit block RAM, fitting comfortably within the 70K LE budget.
おすすめ
Video Processing and Surveillance Pipelines
The EP3CLS70F780I7 supports video processing because its 413 hardware multipliers can run 2D FIR video filters, scaling engines, and motion-detection kernels in real time. The 2.93 Mbit embedded memory holds three full HD lines (1920x3 x 16 bits = 11.5 Kbytes per line), and the 429 I/Os interface directly to MIPI-CSI2, BT.656, BT.1120, and HDMI input PHYs. Surveillance DVR designs benefit from AES-256 bitstream encryption that prevents attackers from cloning the analytic IP. Industrial temperature grade supports outdoor IP-camera housings with passive cooling. The 70K LE budget typically hosts 2-3 video pipelines plus an embedded Nios II processor for analytics. Estimated: a 1080p60 scaling + edge-detection pipeline consumes approximately 50K LEs and 180 multipliers.
おすすめ
Software Defined Radio (SDR) Front-End
The EP3CLS70F780I7 is a strong match for low-cost SDR front-ends because its 413 hardware multipliers can run DDC/DUC (digital up/down conversion), FIR pulse-shaping, and narrowband channel filters at sample rates up to ~250 MSPS. The 4 PLLs generate the ADC/DAC sample clocks plus LO multiplication, and the 2.93 Mbit embedded memory hosts NCO lookup tables and channelizer overlap-save buffers. The 780-FBGA exposes enough I/Os for LVDS ADC/DAC interfaces plus USB 3.0 / Gigabit Ethernet data offload. Industrial temperature grade supports tactical/military SDR enclosures. AES-128/256 bitstream encryption is critical for protecting proprietary waveform IP. Estimated: a 16-channel DDC at 122.88 MSPS consumes about 40K LEs and 260 multipliers.
おすすめ
Portable Test and Measurement Equipment
The EP3CLS70F780I7 fits portable T&M equipment because its 60 nm low-power process minimizes battery drain while still providing 70K LEs for arbitrary waveform generation, real-time protocol decoding, and DSP post-processing. The 413 multipliers execute FFT, correlation, and demodulation in real time on captured waveforms. The 429 I/Os support LCD displays, touch controllers, and high-speed ADC/DAC front-ends, while the AES bitstream encryption protects proprietary measurement IP. Industrial temperature grade ensures operation in field environments where ambient temperatures swing between -20C and +70C. Estimated: a 1024-point FFT engine plus 8-channel logic analyzer consumes about 30K LEs and 150 multipliers, leaving room for GUI/control logic.
おすすめ
Automotive Infotainment Prototyping
The EP3CLS70F780I7 is used in automotive infotainment prototyping because its 70K LEs and 413 multipliers can drive multiple LVDS displays, run audio DSP for cabin acoustics, and bridge CAN/LIN/FlexRay networks simultaneously. The 429 user I/Os accommodate camera inputs (front/rear/surround-view), touchscreen controllers, and MOST/Ethernet AVB PHYs. The -40C to +100C industrial temperature grade is suitable for cabin environments (note: this is NOT an AEC-Q100 automotive part - it is industrial-grade used in prototyping). LS AES bitstream encryption protects OEM infotainment IP. Production designs should migrate to Cyclone V or Cyclone IV GX for full AEC-Q100 qualification. Estimated: a surround-view image-processing prototype consumes about 55K LEs and 250 multipliers.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3CLS70F780I7 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3CLS70F780C7N | EP3CLS70F780C8N | EP3CLS100F780I7N | EP3CLS150F780I7N | EP3C80F780I7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FBGA (1.0 mm pitch, 29x29 mm) | 780-FBGA (1.0 mm pitch) - same | 780-FBGA (1.0 mm pitch) - same | 780-FBGA (1.0 mm pitch) - same | 780-FBGA (1.0 mm pitch) - same | 780-FBGA (1.0 mm pitch) - same |
| Logic Elements | 70,208 | 70,208 | 70,208 | 100,000 | 150,000 | 81,000 |
| Family / Security | Cyclone III LS (AES-128/256) | Cyclone III LS (AES-128/256) | Cyclone III LS (AES-128/256) | Cyclone III LS (AES-128/256) | Cyclone III LS (AES-128/256) | Standard Cyclone III (no LS security) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | 7 (moderate) | 7 (moderate) | 8 (slower) | 7 (moderate) | 7 (moderate) | 7 (moderate) |
| Process Node | 60 nm TSMC low-power | 60 nm TSMC low-power | 60 nm TSMC low-power | 60 nm TSMC low-power | 60 nm TSMC low-power | 60 nm TSMC |
主な差別化要因
- Lower temperature grade but otherwise identical silicon （vs EP3CLS70F780C7N)
- LS security features (AES-128/256 bitstream encryption) （vs EP3C80F780I7N)
- More logic elements in same package for design headroom （vs EP3CLS100F780I7N)
- Same package, lower unit cost when commercial temp suffices （vs EP3CLS70F780C8N)
設計ノート
The Cyclone III LS core operates from a 1.15 V to 1.25 V VCCINT supply; use a dedicated switching regulator with at least 2 A peak current capability. VCCPD (1.25 V) and VCCIO (1.2-3.3 V depending on bank) require separate rails; sequence VCCINT before VCCPD per datasheet power-on sequencing requirements. The 60 nm process benefits from excellent dynamic power scaling but total quiescent + dynamic power at full toggle can reach several hundred mA. Use Quartus II PowerPlay early in the design cycle to model power and rail sizing before committing to the PCB stackup.
The 780-FBGA at 1.0 mm pitch demands a 4-6 layer PCB with microvia stackups (laser-drilled 0.1 mm vias preferred). Place a full ball-grid array of decoupling capacitors (0.1 uF, 0.01 uF, 10 uF) on the BGA's underside, ideally on the opposite side of the package. Provide at least 6 thermal vias under the BGA's exposed thermal balls (if present in package variant) to conduct die heat to inner copper planes. Maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS pairs routed from the 429 I/Os.
The 429 I/Os can simultaneously switch (SSO), causing ground bounce and VCCIO sag. Spread high-toggle-rate signals (DDR memory interfaces, LVDS pairs, parallel ADC buses) across multiple I/O banks to share SSO current. Enable on-chip series termination (Rs) and weak pull-ups on configuration pins per Quartus II device options. Use the IBIS model (downloadable from Intel PSG) to validate signal integrity at the 437 MHz maximum core frequency for any LVDS links exceeding 200 MHz toggle rate.
Do not confuse EP3CLS70F780I7 (Cyclone III LS family) with EP3C70F780I7 (standard Cyclone III); the LS part has AES-128/256 bitstream encryption and CRC/parity-protected RAM that the standard part lacks. Configuration mode selection via MSEL pins must match the design's boot source (AS, PS, FPP, JTAG) - incorrect MSEL strapping is the most common first-board fail. The 'I' suffix denotes industrial temperature, NOT industrial qualification (no AEC-Q100); for automotive use, migrate to Cyclone IV/V/10 families with proper AEC-Q100 documentation.
The 780-FBGA package relies on PCB copper area for heat dissipation. Provide a 4 x 4 cm copper flood on top and bottom layers connected to ground under the BGA, plus 9-12 thermal vias under the die to inner ground planes. Estimated: at 100% logic utilization and 100 MHz toggle rate, total power reaches approximately 1.5 W; the package's theta_JA of ~15 C/W yields a junction temperature rise of ~22C above ambient, acceptable for the 100C industrial ceiling. Use the on-chip temperature-sensing diode (LS-only) with an external TMP411 or equivalent to monitor die temperature in safety-critical applications.
コンプライアンス情報
Per verified web data, the Cyclone III LS family datasheet indicates non-RoHS compliant; lead-free reflow is supported per JEDEC J-STD-020. The 'I' suffix indicates industrial temperature grade, NOT AEC-Q100 automotive qualification - migrate to Cyclone IV/V/10 families for AEC-Q100 automotive production.
