EP3SE110F1152C4L - Stratix III E FPGA 107500 LEs 1152-FBGA | Intel
部品番号: EP3SE110F1152C4L ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5270.52 | $5,270.52 |
| 10 | $4791.38 | $47,913.80 |
| 100 | $4216.41 | $421,641.00 |
| 500 | $3794.77 | $1,897,385.00 |
| 1,000 | $3372.13 | $3,372,130.00 |
EP3SE110F1152C4L 概要
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that lets engineers implement arbitrary digital logic through configurable logic blocks (CLBs), routing interconnect, and hard IP blocks such as transceivers and memory controllers. FPGAs sit in the broader hierarchy of programmable logic -> logic IC -> integrated circuit -> semiconductor. Compared to ASICs, FPGAs offer in-system reprogrammability and faster time-to-market; compared to CPLDs, they deliver orders-of-magnitude higher logic capacity and richer DSP/embedded-memory resources.
Key features of the EP3SE110F1152C4L include 107500 logic elements for high gate-count designs, 8936448 bits (about 8.9 Mbit) of embedded RAM for packet buffering and data caching, 744 maximum user I/Os for wide external buses, and 800 MHz maximum internal operation for high-throughput datapaths. The 1152-ball FCBGA package supports controlled-impedance signal routing required by LVDS and DDR memory interfaces typical of Stratix III designs.
Architecturally, the Stratix III E series uses an enhanced adaptive logic module (ALM) fabric and MultiTrack interconnect for predictable timing closure. Hard IP blocks include high-speed transceivers, dedicated DSP blocks, and embedded TriMatrix memory that can be configured as single-port, simple dual-port, or true dual-port with separate read/write clocks.
Typical applications include ASIC prototyping, high-speed networking line cards, DSP accelerator cards, video broadcast equipment, and test and measurement platforms. The combination of high logic density, abundant I/O, and 8.9 Mbit embedded RAM makes it suitable for designs previously requiring multiple smaller FPGAs.
When designing with this device, ensure PCB layout supports the FCBGA ball pitch with microvia stack-ups, and that the Quartus II toolchain version matches the device silicon revision (C4 speed grade 4, commercial temperature 0C-85C). Plan power sequencing for the 0.9 V core rail with sufficient decoupling.
This page synthesizes distributor inventory, same-family drop-in variants, and Stratix III design notes not consolidated on any single manufacturer or distributor page.
ドロップイン代替品: EP3SE110F1152C4L — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3SE110F1152C4L （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Family, Speed Grade, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP3SE110F1152C4
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2200 / 個
データシートを見る →EP3SE110F1152C3N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1560 / 個
データシートを見る →EP3SE110F1152C3
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3200 / 個
データシートを見る →EP3SE110F1152C2N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1925 / 個
データシートを見る →EP3SE110F1152C2
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4100 / 個
データシートを見る →EP3SE110F1152C2NES
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1320 / 個
データシートを見る →EP3SE110F1152C4L 最大定格＆電気的特性
| Device Type | FPGA - Field Programmable Gate Array |
| Series | Stratix III E |
| Logic Elements | 107500 |
| Embedded Memory | 8936448 bits (8.9 Mbit) |
| Maximum User I/O | 744 |
| Internal Frequency | 800 MHz (max) |
| Core Supply Voltage | 0.9 V |
| パッケージ | 1152-ball FCBGA (BBGA-1152) |
| Package Type | FBGA (Fine-pitch BGA) |
| Pins | 1152 |
| Speed Grade | C4 (speed grade 4) |
| 動作温度 | 0C to 85C (commercial) |
| 実装タイプ | Surface Mount |
| Manufacturer | Intel (formerly Altera) |
EP3SE110F1152C4L fbga (fine-pitch bga) ピン配置ガイド
EP3SE110F1152C4L (fbga (fine-pitch bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3SE110F1152C4L.
詳細は データシート をご参照ください。
主な用途
EP3SE110F1152C4L の用途: 6 件s: ASIC Prototyping and Emulation, High-Speed Networking Line Cards, DSP Accelerator Cards, Video Broadcast and Imaging Equipment, Test and Measurement Instrumentation, Industrial High-Performance Control.
ASIC Prototyping and Emulation
The EP3SE110F1152C4L fits ASIC prototyping because its 107500 logic elements, 8.9 Mbit embedded TriMatrix memory, and 744 user I/Os provide the headroom required to map full SoC designs into a single device. Stratix III E supports deep trace buffers and TDM interfaces needed for emulator bring-up. Place-and-route with Quartus II yields timing-accurate prototypes of ASIC RTL pre-silicon.
おすすめ
High-Speed Networking Line Cards
The EP3SE110F1152C4L suits 10G/40G Ethernet line cards because of its high logic capacity, abundant embedded RAM for packet buffers, and 744 I/Os to drive multiple SFP+ cages or backplane SERDES channels. Stratix III E integrates hard PCS and PMA blocks for multi-lane serial links per the manufacturer datasheet. The 0.9 V core rail reduces line-card power budget relative to previous-generation FPGAs.
おすすめ
DSP Accelerator Cards
The EP3SE110F1152C4L works as a co-processor in DSP accelerator cards because Stratix III E integrates dedicated DSP blocks delivering high GMACs throughput for FFT and filtering. With 8.9 Mbit embedded memory, the device holds intermediate FFT samples without external SRAM. The 744 I/Os support PCIe, DDR2/DDR3 interfaces per the manufacturer datasheet for host connection and high-bandwidth memory access.
おすすめ
Video Broadcast and Imaging Equipment
The EP3SE110F1152C4L fits broadcast video processing because its high logic density supports uncompressed SD/HD/UHD pixel pipelines, while the 8.9 Mbit embedded RAM enables line buffering and chroma resampling. The 744 I/Os drive HDMI/SDI/DisplayPort phycopia and external DDR memory banks per the manufacturer datasheet. Quartus II IP cores include optimized video format converters that map efficiently to ALMs.
おすすめ
Test and Measurement Instrumentation
The EP3SE110F1152C4L serves in PXI and AXIe instrumentation because its 800 MHz fabric and rich DSP blocks deliver real-time FFT/spectral analysis at high sample rates. The 744 I/Os accommodate multi-channel ADC/DAC interfaces per the manufacturer datasheet. Stratix III E embedded transceivers connect to high-speed ADCs while the ALM fabric handles decimation and triggering in firmware.
おすすめ
Industrial High-Performance Control
The EP3SE110F1152C4L suits industrial motion and process control because the ALM fabric and DSP blocks execute multi-axis servo loops while 744 I/Os handle encoder feedback and drive signals. Stratix III E commercial 0-85C operation per the manufacturer datasheet fits factory-floor enclosures. Embedded TriMatrix memory supports trajectory buffering and PID coefficient storage.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3SE110F1152C4L — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3SE110F1152C4 | EP3SE110F1152C3N | EP3SE110F1152C3 | EP3SE110F1152C2N | EP3SE110F1152C2 | EP3SE110F1152C2NES |
|---|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | C4 | C4 | C3 (faster) | C3 (faster) | C2 (fastest) | C2 (fastest) | C2 (fastest) |
| Logic Elements | 107500 | 107500 | 107500 | 107500 | 107500 | 107500 | 107500 |
| Embedded Memory (bits) | 8936448 | 8936448 | 8936448 | 8936448 | 8936448 | 8936448 | 8936448 |
| Maximum User I/O | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Lead-Free / RoHS | Yes (L suffix) | No | Yes (N suffix) | No | Yes (N suffix) | No | Yes (ES variant) |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C |
主な差別化要因
- Lead-free / RoHS-compliant terminal finish （vs EP3SE110F1152C4)
- Slower speed grade with lower cost （vs EP3SE110F1152C3N)
- High logic density with abundant embedded RAM （vs Lower-density Cyclone III devices in Site MPN list)
設計ノート
The 1152-ball FCBGA package requires a microvia PCB stack-up with via-in-pad or dogbone fan-out per the manufacturer datasheet. Use laser-drilled microvias (0.1 mm or smaller) for signal breakout and standard vias for power/ground. Impedance-controlled traces must target 50 ohm single-ended or 100 ohm differential per the Stratix III Device Handbook pinout guide to support LVDS and DDR memory interfaces.
Stratix III E devices require multi-rail power sequencing per the manufacturer datasheet. The 0.9 V core rail must reach regulation before I/O supplies (typically 1.2 V/1.5 V/1.8 V/2.5 V/3.3 V per bank standard). Use a sequencer with monotonic ramps; insufficient decoupling will cause power-good glitches that corrupt configuration. Reference the Stratix III pin connection guidelines for bulk capacitor placement per bank.
Do not select a Quartus II software version newer than 13.0 for Stratix III E design entry - newer versions dropped Stratix III support and the device family database is absent. Per the manufacturer datasheet, all design files, simulation models, and IP must be regenerated with a Quartus II version that includes the Stratix III E device library. Using a newer Quartus release causes synthesis errors.
Estimated: At full utilization of 107500 logic elements and 8.9 Mbit memory toggling at 800 MHz, the FCBGA-1152 package can dissipate 8-12 W. Without a heatsink and adequate airflow, junction temperature may exceed the 85C commercial limit. Calculate per the manufacturer datasheet thermal model using typical activity factor (0.1-0.2) and clock tree toggle rate; ensure theta-JA does not exceed 15 C/W with the planned PCB thermal design.
コンプライアンス情報
RoHS compliant per L-suffix designation. REACH, halogen-free, and conflict minerals status not explicitly stated in verified web data; mark as unknown.
