EP3SL340F1760C4LN - 340K LE Stratix III L FPGA, 1760-BGA | Intel
部品番号: EP3SL340F1760C4LN ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $18010.97 | $18,010.97 |
| 10 | $17500 | $175,000.00 |
| 100 | $16800 | $1,680,000.00 |
| 500 | $16000 | $8,000,000.00 |
| 1,000 | $15200 | $15,200,000.00 |
EP3SL340F1760C4LN 概要
What is an FPGA? An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows designers to configure digital logic blocks and interconnects after manufacture. Within the broader semiconductor taxonomy, an FPGA belongs to programmable logic -> digital IC -> integrated circuit. The Stratix III L family is a low-power variant of the Stratix III family, optimized for static and dynamic power reduction compared to the standard Stratix III while retaining the same high-end feature set for DSP and memory-intensive workloads.
Key differentiating features of the EP3SL340F1760C4LN include 1120 user I/O on a 1760-ball FC-FBGA package, 1120 maximum user I/O count, 18822144 embedded memory bits, and integrated DSP blocks optimized for high-throughput arithmetic pipelines. The C4 speed grade and L power suffix denote the lowest static-power variant of the speed bin, ideal for thermally constrained enclosures. The N suffix confirms lead-free / RoHS-compliant terminal finish.
The Stratix III L architecture combines ALMs (Adaptive Logic Modules) arranged in LABs, M20K memory blocks, and variable-precision DSP blocks with 9-bit, 18-bit, and 36-bit operand support, enabling high-performance FFT, FIR, and matrix operations. Partial reconfiguration, dedicated clock networks with PLL support, and up to 12 transceiver channels (depending on variant) make the device suitable for high-speed serial protocols.
Typical applications include high-end ASIC prototyping, software-defined radio baseband processing, high-definition video broadcast and image-processing pipelines, military radar and electronic-warfare systems, and telecom line-card packet processing. The wide memory and DSP bandwidth also make the EP3SL340F1760C4LN a common choice for medical imaging accelerators such as CT and MRI reconstruction engines.
Designers should note that the 1760-ball FC-FBGA package demands careful PCB stack-up, microvia fabrication, and matched-length routing to preserve signal integrity across the 1120 user I/O. Thermal analysis must include both static and dynamic power, and the 1760-ball package's thermal performance depends heavily on PCB copper area and airflow within the chassis. Quartus II is the supported development environment, and a license is recommended for the full timing closure and signal-integrity flows.
This page synthesizes distributor pricing, packaging variants, and design notes not found in a single manufacturer datasheet, and links to equivalent Stratix III L device MPNs for designers facing obsolescence or lead-time pressure.
ドロップイン代替品: EP3SL340F1760C4LN — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3SL340F1760C4LN （同一形状・フットプリント） — 相違点: Package, Speed Grade, Operating Temperature, Embedded Memory Bits, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP3SL340F1760C4L
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3100 / 個
データシートを見る →EP3SL340F1760C4
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$9750 / 個
データシートを見る →EP3SL340F1760C3N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2950 / 個
データシートを見る →EP3SL340F1760C3
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$12480 / 個
データシートを見る →EP3SL340F1760C2
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$18500 / 個
データシートを見る →EP3SL340F1760C4LN 最大定格＆電気的特性
| Family | Stratix III L |
| Process Technology | 65 nm |
| Core Voltage | 0.9 V |
| Logic Elements (LEs) | 337,500 |
| Embedded Memory Bits | 18,821,144 bit |
| Logic Array Blocks (LABs) | 13,500 |
| Maximum User I/O | 1,120 |
| Maximum Operating Frequency | 375 MHz |
| Speed Grade | C4 |
| Power Variant | L (low-power) |
| 動作温度 | 0C to +85C (commercial) |
| パッケージ | 1760-ball FC-FBGA |
| 実装タイプ | Surface Mount (flip-chip BGA) |
| Lead-Free / RoHS | Yes (N suffix) |
EP3SL340F1760C4LN 1760-ball fc-fbga ピン配置ガイド
EP3SL340F1760C4LN (1760-ball fc-fbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3SL340F1760C4LN.
詳細は データシート をご参照ください。
主な用途
EP3SL340F1760C4LN の用途: 7 件s: High-Performance DSP and FFT Pipelines, ASIC Prototyping and Emulation, Telecom Line-Card Packet Processing, Medical Imaging Acceleration, Military Radar and Electronic Warfare, Broadcast Video Processing, Industrial Automation and Machine Vision.
High-Performance DSP and FFT Pipelines
The EP3SL340F1760C4LN's 337,500 logic elements and integrated variable-precision DSP blocks make it well suited to multi-gigasample-per-second FFT and FIR pipelines. With 18,821,144 bits of embedded memory, the device can hold large coefficient tables and intermediate buffers on-chip, eliminating off-chip memory round trips. Designers implementing radar, software-defined radio, or image-processing accelerators use the EP3SL340F1760C4LN to sustain high throughput at the C4 speed grade while keeping dynamic power manageable thanks to the L low-power architecture.
おすすめ
ASIC Prototyping and Emulation
With 337,500 logic elements and 1,120 user I/O, the EP3SL340F1760C4LN is widely used for ASIC and SoC prototyping where designers partition RTL across multiple FPGAs. The 1760-ball FC-FBGA package exposes enough I/O for high-pin-count ASIC interfaces, and the L power variant reduces thermal load in multi-FPGA emulation boards. Quartus II synthesis supports incremental compile flows that map directly from ASIC RTL to the Stratix III L fabric, accelerating time-to-prototype for complex chips.
おすすめ
Telecom Line-Card Packet Processing
Telecom line cards require deep packet buffers and lookup-table acceleration, both of which the EP3SL340F1760C4LN provides through 18,821,144 bits of M20K memory and 13,500 LABs. The 1,120 user I/O sustain multiple 10 Gbps interfaces and external TCAM lookups, while the C4 speed grade supports 375 MHz operation for wire-speed packet classification. The L power variant is well suited to NEBS-compliant chassis where static power matters as much as dynamic performance.
おすすめ
Medical Imaging Acceleration
CT, MRI, and ultrasound imaging systems use the EP3SL340F1760C4LN to accelerate back-projection, beamforming, and image-reconstruction algorithms. The on-chip memory supports sliding-window convolution without external DRAM access, while the DSP blocks deliver the multiply-accumulate throughput required for real-time imaging at clinically relevant frame rates. The 1760-ball FC-BGA integrates cleanly into imaging accelerator PCIe boards and benefits from the low-power L variant in fan-limited enclosures.
おすすめ
Military Radar and Electronic Warfare
Radar and EW systems leverage the EP3SL340F1760C4LN's combination of high logic density and DSP throughput to implement pulse compression, MTI filtering, and digital beamforming in a single device. The 1760-ball FC-FBGA exposes enough I/O for multi-channel A/D converter interfaces, and the L variant's lower static power extends mission duration on platform-limited power budgets. Designers use the same Stratix III L family for both commercial and ruggedized variants with different operating temperature grades.
おすすめ
Broadcast Video Processing
High-definition broadcast and post-production equipment uses the EP3SL340F1760C4LN for real-time video scaling, color-space conversion, and multi-stream multiplexing. The 1,120 user I/O support multiple SDI, HDMI, and DisplayPort interfaces simultaneously, while the 18 Mbit embedded memory buffers full frames for low-latency processing. Designers benefit from the L variant's reduced dynamic power when chassis cooling is constrained by acoustic targets in broadcast environments.
おすすめ
Industrial Automation and Machine Vision
The EP3SL340F1760C4LN powers multi-camera machine vision inspection systems where on-chip DSP accelerates convolutional inference and image preprocessing. With 1,120 user I/O the device can interface to multiple Camera Link or CoaXPress channels directly, while the C4 timing margin simplifies meeting deterministic frame-rate requirements. The L variant's thermal profile suits sealed factory-floor enclosures with limited airflow.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3SL340F1760C4LN — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3SL340F1760C4L | EP3SL340F1760C4 | EP3SL340F1760C3N | EP3SL340F1760C3 | EP3SL340F1760C2 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1760-ball FC-FBGA | 1760-ball FC-FBGA - same | 1760-ball FC-FBGA - same | 1760-ball FC-FBGA - same | 1760-ball FC-FBGA - same | 1760-ball FC-FBGA - same |
| Speed Grade | C4 | C4 | C4 | C3 | C3 | C2 |
| Lead-Free (N suffix) | Yes | No | No | Yes | No | No |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Embedded Memory (bits) | 18,821,144 | 18,821,144 | 18,821,144 | 18,821,144 | 18,821,144 | 18,821,144 |
| Maximum User I/O | 1,120 | 1,120 | 1,120 | 1,120 | 1,120 | 1,120 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
主な差別化要因
- Lowest-power 337,500-LE variant in Stratix III family （vs EP3SL340F1760C4 (no L suffix))
- Lead-free RoHS-compliant terminal finish (N suffix) （vs EP3SL340F1760C4L)
- C4 speed grade for maximum timing margin （vs EP3SL340F1760C3N)
- Single-die 1760-ball FC-FBGA density （vs EP3SL340F1517C4LN (1517-ball variant))
設計ノート
The 1760-ball FC-FBGA package requires a high-layer-count PCB (typically 12+ layers) with microvia-in-pad fabrication to escape the dense BGA pitch. Per Intel Stratix III hardware design guidelines, the stack-up must provide matched impedance for LVDS pairs and matched-length routing across the I/O bank to bank traces. Use of low-loss dielectrics (Df < 0.012) is recommended for high-speed transceiver channels, and via-in-pad plating must be controlled to avoid voids under the BGA solder balls.
Estimated: with 0.9 V core at 337,500 LEs active and a 65 nm L-process at typical 40% toggle rate, junction-to-ambient thermal resistance must remain below 0.5 C/W for safe operation. The 1760-ball package dissipates mostly through PCB copper area; per Intel layout guidelines, at least 8 layers of 1-oz copper thermal pad array under the device are required to keep junction temperature below 85C. Designers should validate with thermal simulation in the actual chassis before relying on this estimate.
The Stratix III L power variant reduces static leakage through longer-channel transistors but does not eliminate the need for power-sequencing circuitry. Per Intel Stratix III datasheet, all VCCINT, VCCA, and VCCPD rails must reach stable voltage within 100 ms of each other in the documented sequence; failure to sequence may latch-up internal I/O. Use the Intel Enpirion or third-party PowerSoC modules designed for Stratix III to simplify the analog supply chain.
Do not assume C3, C4, or C2 speed-grade timing files are interchangeable - the EP3SL340F1760C4LN is characterized only for the C4 speed grade and re-timing from C4 to C3 (or C2) requires regenerating SDC files and re-running TimeQuest timing analysis. Mixing speed-grade silicon with mismatched SDC files is a common cause of timing failure in field returns.
Dedicated clock input pins and PLL reference inputs must be routed with controlled impedance and isolated from noisy switching signals. Per Intel AN 522, keep at least 3W (3x trace width) spacing between high-speed clocks and switching I/O and avoid routing across power-plane splits. For LVDS pairs, maintain 100 ohm differential impedance with length matching within 20 ps across the entire channel.
コンプライアンス情報
Lead-free confirmed by N suffix per JEDEC J-STD-609. RoHS compliance inferred from Intel Stratix III family product page; specific certificate of compliance should be requested from Intel for regulated deployments. AEC-Q100 not applicable for FPGAs.
