EP4CE15F23I8L - Cyclone IV E FPGA, 15408 LEs | Altera
部品番号: EP4CE15F23I8L ✓ 生産中EP4CE15F23I8L 概要
A Cyclone IV E FPGA is a programmable-logic semiconductor within the broader FPGA and programmable-logic hierarchy. Unlike fixed-function logic, an FPGA allows designers to configure interconnect and logic blocks after manufacture, enabling implementation of control logic, interfaces, communication engines, signal processing, and embedded systems on one device. The EP4CE15 family is positioned for cost-conscious designs that require more logic capacity than small CPLDs while retaining the integration benefits of a single FPGA package.
The EP4CE15F23I8L provides 15408 logic elements, making it suitable for multi-module digital systems such as industrial controllers, data-acquisition front ends, communication gateways, and embedded control platforms. The 484-pin FBGA package supports a high pin count for power, ground, configuration, clock, and user I/O assignments. The listed package dimensions are approximately 23 mm wide, allowing placement on a dense multilayer PCB when the board design follows the manufacturer’s land-pattern and assembly guidance.
The 60 nm fabrication technology and 1.2 V operating specification place the device in the conventional low-power FPGA technology class. Designers should use the Cyclone IV E device documentation for detailed I/O counts, supported memory blocks, PLL resources, configuration requirements, pin assignments, electrical limits, and power-up behavior. The exact values for many device-level parameters are not stated in the product result and are therefore marked as data-needed in the specification table rather than inferred.
Typical applications include industrial automation, test and measurement, communications, embedded vision, and general-purpose control systems. In these systems, the programmable architecture allows logic functions and interface protocols to be consolidated into one FPGA instead of being distributed across multiple discrete logic devices. Configuration storage, clocking, decoupling, signal integrity, thermal management, and programming-tool compatibility remain the principal system-level design responsibilities.
For a new board, allocate the FBGA footprint, power rails, configuration interface, clock inputs, and I/O according to the official Cyclone IV E hardware design guidance. Maintain the required bypass-capacitor arrangement, route high-speed signals with controlled impedance, and verify timing and thermal conditions in the final PCB stack-up. The manufacturer product page is the authoritative starting point for the ordering part number and package-specific attributes.
This product page combines the verified ordering information with a practical engineering-focused comparison of compatible family options, application guidance, pinout and datasheet references, and design considerations. It is intended to help engineers confirm fit, plan the PCB and power architecture, and identify an appropriate procurement route before integrating the EP4CE15F23I8L into a programmable-logic design.
ドロップイン代替品: EP4CE15F23I8L — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP4CE15F23I8L （同一形状・フットプリント） — 相違点: Device Type, Package Type.
EP4CE15F23I8LN
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP4CE15F23C8LN
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP4CE15F23I8L 最大定格＆電気的特性
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone IV E |
| Logic Elements | 15408 |
| Process Technology | 60 nm |
| Nominal Operating Voltage | 1.2 V |
| Package Type | 484-pin FBGA |
| Package Code | BGA |
| Package Form | Square |
| Package Width | 23 mm |
| Terminal Type | Ball |
| Number of Terminals | 484 |
| 実装タイプ | Surface Mount |
| Product Type | Cyclone IV E FPGA |
| Manufacturer Ordering Part Number | EP4CE15F23I8L |
| ライフサイクル状態 | Active listing |
EP4CE15F23I8L 23 mm ピン配置ガイド
EP4CE15F23I8L (23 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP4CE15F23I8L.
詳細は データシート をご参照ください。
主な用途
EP4CE15F23I8L の用途: 6 件s: Industrial Automation Controller, Data-Acquisition Front End, Communication Gateway, Test and Measurement Equipment, Embedded Signal Processing, Programmable Logic Control.
Industrial Automation Controller
The EP4CE15F23I8L fits industrial automation controllers because its 15408 logic elements can consolidate sequencing, machine-state logic, sensor conditioning interfaces, and communications. The 484-pin FBGA exposes a large pin count for control signals and peripheral connectivity, while the 60 nm process technology and 1.2 V operating specification are characteristic of the Cyclone IV E family. A practical design would use Quartus-generated constraints, dedicated clock routing, and board-level decoupling. The principal trade-off is package complexity: the 484-ball footprint requires careful escape routing, inspection, and assembly control compared with a smaller leaded package.
おすすめ
Data-Acquisition Front End
EP4CE15F23I8L is appropriate for data-acquisition front ends that require parallel sampling control, digital filtering, buffering, and interface logic in one programmable device. The 15408 logic elements provide capacity for control state machines and data paths, while the 484-pin FBGA supports numerous acquisition and communication signals. Engineers should partition high-speed acquisition paths from clock and configuration circuitry, then apply timing constraints for all clocks. Compared with a fixed-function acquisition ASIC, the FPGA allows algorithm updates and protocol changes, but firmware, timing closure, and signal-integrity verification become design responsibilities.
おすすめ
Communication Gateway
The EP4CE15F23I8L can serve as the central programmable engine in a communication gateway that bridges serial, parallel, Ethernet, and control interfaces. Its 15408 logic elements are useful for protocol engines, buffering, routing tables, and test logic, while the 484-pin FBGA provides enough package connections for multiple buses and clock domains. The design should establish a clean clocking hierarchy and use the manufacturer's configuration guidance so each interface has predictable timing. This approach offers field-updatable protocol support, but firmware size, routing congestion, and high-speed I/O validation must be checked during implementation.
おすすめ
Test and Measurement Equipment
EP4CE15F23I8L is well suited to programmable test and measurement equipment because logic density can be used for pattern generation, timing control, trigger logic, data formatting, and instrument interfaces. The 484-pin FBGA permits simultaneous access to many acquisition and control channels, and the device can be reconfigured to support different test sequences. Designers should constrain all timing-critical paths, separate sensitive measurement circuitry from digital switching, and budget FPGA thermal margin for sustained operation. Compared with a fixed test controller, the FPGA supports evolving standards and custom algorithms, but it also requires formal verification and careful clock-domain planning.
おすすめ
Embedded Signal Processing
EP4CE15F23I8L can implement embedded digital filtering, modulation, correlation, waveform generation, and control functions where adaptable logic is valuable. The 15408 logic elements allow parallel datapaths and supporting control logic to be consolidated, while the 484-pin FBGA supports parallel converters, memory interfaces, clocks, and control signals. For high-throughput designs, use pipelined architectures and apply aggressive timing constraints so routing does not limit the intended clock rate. The tradeoff versus a DSP is greater design flexibility and parallel throughput, with the corresponding burden of firmware development, verification, and resource balancing.
おすすめ
Programmable Logic Control
The EP4CE15F23I8L works well as a programmable logic controller for equipment that combines deterministic sequencing, interlocks, counters, timers, and communication handling. Its 15408 logic elements provide considerably more implementation capacity than a basic CPLD, while the 484-pin FBGA supports a broad I/O mix on compact boards. Engineers can implement control logic in HDL and verify behavior with simulation before programming the production configuration. Compared with a microcontroller, the FPGA provides deterministic hardware concurrency and flexible pin timing, but firmware update mechanisms, external memory handling, and application development may require more specialized expertise.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP4CE15F23I8L — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP4CE15F23I8LN | EP4CE15F23C8LN |
|---|---|---|---|
| Package | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA |
| Brand | Altera | Altera | Altera |
| FPGA Family | Cyclone IV E | Cyclone IV E | Cyclone IV E |
| Logic Elements | 15408 | 15408 | 15408 |
| Process Technology | 60 nm | 60 nm | 60 nm |
| Nominal Operating Voltage | 1.2 V | 1.2 V | 1.2 V |
| Pin Compatibility | 484-pin FBGA | Same terminals and package stated | Same FBGA-484 package family |
主な差別化要因
- Exact EP4CE15 F23 family compatibility （vs EP4CE15F23I8LN)
- Package-compatible sourcing option （vs EP4CE15F23C8LN)
- Programmable-logic density in a compact package （vs EP4CE15F23I8LN)
設計ノート
Use the official EP4CE15 F23 package drawing and pin-connection guidelines to create the 484-ball land pattern. Check ball assignments against the Quartus pin planner rather than relying on generic Cyclone IV pinouts. Provide unobstructed assembly access, a compatible solder-mask-defined or non-solder-mask-defined land pattern as required by the selected assembly process, and thermal-via geometry based on the manufacturer's PCB guidelines.
Plan the 1.2 V core and other required Cyclone IV E supply rails as a complete power tree. Follow the manufacturer's recommended bypass-capacitor placement and keep high-current paths short while separating noisy digital return currents from sensitive analog returns. Confirm static and dynamic current limits, startup sequencing, and rail tolerance in the device documentation before fixing the power architecture.
The dense FBGA package can concentrate heat around the die and its power-delivery structures. Use the package thermal data to determine whether exposed-pad or thermal-via treatment is required, route heat into the PCB copper planes, and evaluate the assembled board in its final enclosure. Validate worst-case ambient temperature and activity factor because development activity can materially change FPGA power dissipation.
Reserve clean clock routes, treat configuration signals as critical, and maintain controlled return paths beneath high-speed interfaces. Isolate clock, data, and configuration routing where practical, and define the board stack-up before assigning impedance-sensitive I/O standards. Add test points for configuration, reset, and supply rails so production programming and fault diagnosis are practical.
コンプライアンス情報
The verified product result does not state the RoHS, REACH, lead-free, halogen-free, or conflict-minerals status for the exact ordering part number. AEC-Q100 is not applicable because this is an FPGA rather than an automotive-qualified power component.
