Intel

EP4CE40F23C8L - Cyclone IV E FPGA, 39.6K LEs, 484-FBGA | Intel (Altera)

部品番号: EP4CE40F23C8L ✓ 生産中

在庫あり 1〜3営業日以内に発送

1.2 V Vdss LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI, Differential LVDS Rds(on) 484-pin FBGA (F23), 1.0 mm ball pitch, 23x23 mm Package 8 (industrial low-power process, 8-stage logic) Speed 1,161,216 bits (1.16 Mbit) Memory

開始価格 $72.1 USD / 個

MOQ: 1 |

価格更新日: 2026-09-09

ボリューム価格

数量	単価	小計
1	$96.33	$96.33
10	$91.5	$915.00
100	$85.2	$8,520.00
500	$78.4	$39,200.00
1,000	$72.1	$72,100.00

ℹ️ すべての価格はUSDです

データシートを見る (PDF) 代替品を見る

数量

EP4CE40F23C8L 概要

The Intel (formerly Altera) EP4CE40F23C8L is a low-cost, low-power Cyclone IV E Field-Programmable Gate Array (FPGA) fabricated on a 60 nm process, delivering 39,600 logic elements, 1,161,216 bits of embedded memory, and 116 hardware multipliers in a 484-pin FineLine BGA package. It operates from a 1.2 V core supply with hot-socketing and 8 mA low-power standby support, targeting cost-sensitive high-volume applications. The device provides 328 general-purpose I/O pins and four general-purpose PLLs for clock management.

What is a Cyclone IV E FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as multipliers, memory blocks, and PLLs. Cyclone IV E sits in the low-power, low-cost tier of the Cyclone family, positioned below Cyclone V and above legacy Cyclone III devices. It belongs to the broader hierarchy of programmable logic devices (PLD), sitting alongside CPLDs in the digital logic ecosystem but offering dramatically higher logic density. The 'E' suffix designates the Enhanced logic-and-memory variant optimized for parallel processing and DSP workloads rather than high-speed serial transceivers.

Key features include 4 input/output banks supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), embedded RAM blocks up to 4 Kbits each, configurable JTAG boundary-scan, and Cyclone-specific configuration schemes including Active Serial and JTAG. The device supports up to 200 MHz internal operation in commercial temperature grades and offers configurable Multiplier blocks optimized for DSP functions. Configuration memory supports both compression and encryption for secure bitstream handling.

Architecture highlights include an 8-input adaptive logic module (ALM) that improves packing efficiency over the 4-input LUT structure used in earlier Cyclone generations, a dedicated 18x18 multiplier block array, and global clock networks supported by up to 8 dedicated clock pins. The PLLs feature dynamic reconfiguration and support spread-spectrum clocking. On-chip memory totals 1.16 Mbits organized as M9K blocks of 9 Kbits each.

Typical applications include industrial motor control, video processing pipelines, low-cost ASIC prototyping, embedded vision systems, and consumer electronics requiring moderate logic density without the cost of larger FPGAs. The wide temperature grade variants (denoted by the 'L' suffix) extend operation into industrial environments. Designers choose this device for parallel DSP, glue-logic consolidation, and small-to-medium state-machine implementations.

Design consideration: estimate board area carefully. The 484-FBGA has 1.0 mm ball pitch and requires at least 6 PCB layers with controlled-impedance routing for high-speed I/O signals. Always reference the Cyclone IV Device Family Pin Connection Guidelines for unused-pin termination, especially for differential pairs used in LVDS modes.

This page synthesizes distributor pricing, drop-in same-package alternatives, and PCB layout design notes not aggregated on any single distributor page.

ドロップイン代替品: EP4CE40F23C8L — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP4CE40F23C8L （同一形状・フットプリント） — 相違点: Package, Embedded Memory, Speed Grade, Process Technology, RoHS Status.

EP4CE40F23C6

Intel

Package: FBGA-484 (23 x 23 mm, 1.0 mm pitch)

Embedded Memory: 1,161,216 bits (1134 Kbits)

Speed Grade: C6 (commercial, mid-tier)

比較対象 EP4CE40F23C8L →

EP4CE40F23C6N

Intel

Package: 484-ball FBGA (FBGA-484, 23 x 23 mm, 1.0 mm pitch)

Speed Grade: 6

Process Technology: 60 nm

比較対象 EP4CE40F23C8L →

EP4CE40F23C7

Intel

Package: 484-ball FBGA (F23)

Process Technology: 60 nm low-power

RoHS Status: Compliant (lead-free FBGA)

比較対象 EP4CE40F23C8L →

EP4CE40F23C7N

Intel

Package: 484-ball FineLine BGA (FBGA)

Speed Grade: C7

Process Technology: 60 nm low-power CMOS

比較対象 EP4CE40F23C8L →

EP4CE40F23C8

Intel

Package: 484-ball FBGA (F23)

Embedded Memory: 1,161,216 bits (1134 Kbit)

Process Technology: 60 nm

比較対象 EP4CE40F23C8L →

EP4CE40F23C8LN

Intel

Package: 484-FBGA, 23 × 23 mm, 1.0 mm pitch

Speed Grade: C8 (8 ns)

Process Technology: 60 nm

比較対象 EP4CE40F23C8L →

EP4CE40F23C8N

Intel

Package: 484-ball FBGA (FineLine BGA), 1.0 mm pitch

Embedded Memory: 1,134 Kbit (M9K blocks)

Process Technology: 60 nm low-power

比較対象 EP4CE40F23C8L →

EP4CE40F23C9LN

Intel

Package: FBGA-484

Embedded Memory: 1,161,216 bit

比較対象 EP4CE40F23C8L →

✅ ドロップイン

Intel

📦 484-pin FBGA (F23)

Cyclone IV E · 39,600 · 1,161,216 bits (1134 Kbits) · 116 · 328 · 4 · 20 · AS, AP, FPP, JTAG

✓ 在庫あり

$71.4 / 個

データシートを見る →

EP4CE40F23C8L 最大定格＆電気的特性

Family	Cyclone IV E
Logic Elements	39,600
Embedded Memory	1,161,216 bits (1.16 Mbit)
Embedded Multipliers (18x18)	116
General-Purpose PLLs	4
Maximum User I/O Pins	328
Process Technology	60 nm (TSMC low-power)
Core Voltage	1.2 V
パッケージ	484-pin FBGA (F23), 1.0 mm ball pitch, 23x23 mm
Speed Grade	8 (industrial low-power process, 8-stage logic)
Configuration Schemes	Active Serial, Passive Serial, JTAG
I/O Standards Supported	LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI, Differential LVDS
Global Clock Networks	20
Embedded RAM Block Size	9 Kbits (M9K blocks)
RoHS ステータス	Compliant

EP4CE40F23C8L 484-pin fbga (f23), 1.0 mm ball pitch, 23x23 mm ピン配置ガイド

EP4CE40F23C8L (484-pin fbga (f23), 1.0 mm ball pitch, 23x23 mm パッケージ) のピン配置。このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

EP4CE40F23C8L の 484-pin fbga (f23), 1.0 mm ball pitch, 23x23 mm パッケージピン配置図

詳細なピン配置データはありません: EP4CE40F23C8L.

詳細はデータシートをご参照ください。

主な用途

EP4CE40F23C8L の用途: 6 件s: Industrial Motor Control, Video Processing Pipelines, ASIC Prototyping and Emulation, Low-Cost ASIC Replacement and Glue Logic, Embedded Vision and Image Sensor Aggregation, Communications Protocol Bridging.

🏭

Industrial Motor Control

The EP4CE40F23C8L's 116 hardware 18x18 multipliers and 39,600 logic elements make it well-suited for industrial motor control loops running field-oriented control (FOC) algorithms at 10-50 kHz PWM rates. The 328 user I/Os accommodate multi-axis encoder feedback (QEP interfaces), Hall sensors, and PWM outputs without external logic. Four general-purpose PLLs synthesize precise switching frequencies from a single crystal reference. Designers typically pair it with industrial-grade companion chips (EPCS configuration flash, isolated gate drivers) for high-voltage IGBT/SiC inverters. Compared to DSP+MCU dual-chip solutions, a single Cyclone IV E handles both the control loop and supervisory state machine, reducing BOM cost.

おすすめ

EPCS64SI16N (Configuration flash for AS mode) ISO5852S (Isolated gate driver for IGBT/SiC) EP4CE40F23C7N · Intel

📺

Video Processing Pipelines

The EP4CE40F23C8L's 1.16 Mbits of embedded M9K memory and 39,600 logic elements support single-channel video processing pipelines (deinterlacing, scaling, color space conversion) up to 1080p30 resolution. The 328 I/Os accommodate parallel RGB/YUV interfaces plus control channels. M9K blocks buffer line-scan memory between pipeline stages with predictable timing. For multi-channel or higher-resolution designs, a Cyclone IV E part with larger memory (EP4CE115F23) is preferred. Compared to ASSPs, the FPGA enables proprietary video algorithms without external memory bandwidth bottlenecks.

おすすめ

ADV7180 (Video decoder for analog input) ADV7511 (HDMI transmitter for output) MT48LC16M16A2 (External DDR-style frame buffer)

🖥️

ASIC Prototyping and Emulation

Engineers use the EP4CE40F23C8L as a low-cost ASIC prototype target for designs originally targeted at 0.18-0.13 um ASIC processes. The 39,600 LEs map cleanly to mid-complexity ASIC gates, and 116 multipliers cover most DSP functions. Configuration via JTAG enables rapid design iteration cycles. For larger ASIC prototypes, multiple FPGAs are co-simulated over LVDS inter-FPGA links. Compared to high-end Virtex/Stratix parts, the Cyclone IV E delivers sufficient logic density at 10-20x lower unit cost, ideal for early-stage validation before ASIC tape-out.

おすすめ

EPCQ64ASI16N (Quad-serial configuration flash) SN65LVDS31 (LVDS serializer for inter-board links) EP4CE115F23C8N · Intel

🔧

Low-Cost ASIC Replacement and Glue Logic

The EP4CE40F23C8L consolidates discrete glue logic, address decoding, and custom I/O expansion into a single programmable device. Engineers replace 3-5 standard-logic chips (74-series) plus a small CPLD with one Cyclone IV E, simplifying board layout and reducing BOM cost. The 4 general-purpose PLLs eliminate external clock generator ICs, while 328 I/Os handle board-level interconnect. Hot-socketing capability allows live insertion in backplane systems. Compared to multiple discrete ICs, a single FPGA reduces board area by 50-70% and simplifies EMC compliance.

おすすめ

SN74LVC8T245 (Level shifter example (function absorbed into FPGA)) CDCE913 (Programmable clock generator (PLL function absorbed))

📱

Embedded Vision and Image Sensor Aggregation

The EP4CE40F23C8L aggregates multiple MIPI-CSI or parallel image sensors into a unified processing pipeline, exploiting 328 I/Os to accept 2-3 sensor streams simultaneously. The 116 hardware multipliers accelerate Sobel, Laplacian, and other convolution kernels at 60 fps. M9K blocks buffer pixel rows between filter stages with single-cycle access. The device fits drone, robotics, and machine vision applications where 1080p image processing must run on a power budget under 2W. Compared to ASSP ISPs, the FPGA enables proprietary pre-processing algorithms without software overhead.

おすすめ

OV5640 (5 MP CMOS image sensor) MT9V032 (Global-shutter VGA sensor for machine vision) EP4CE30F29I8LN · Intel

🌐

Communications Protocol Bridging

The EP4CE40F23C8L bridges legacy industrial protocols (RS-485, CAN, UART, SPI) to Ethernet or USB, using its abundant I/O count and embedded multipliers for protocol encoding/decoding. The 4 PLLs synthesize multiple baud-rate clocks from a single reference, eliminating external baud-rate generators. M9K blocks buffer packet payloads. Typical designs implement Modbus-RTU to Modbus-TCP gateways, CAN-to-Ethernet bridges, or SPI-to-UART multiplexers. Compared to microcontroller-based bridges, the FPGA delivers deterministic latency and parallel protocol handling without RTOS overhead.

おすすめ

MAX3485 (RS-485 transceiver) TJA1050 · NXP Semiconductors W5500 · WIZnet

おすすめ製品の概要

EPCS64SI16N Configuration flash for AS mode 使用用途: Industrial Motor Control ISO5852S Isolated gate driver for IGBT/SiC 使用用途: Industrial Motor Control EP4CE40F23C7N Intel 使用用途: Industrial Motor Control ADV7180 Video decoder for analog input 使用用途: Video Processing Pipelines ADV7511 HDMI transmitter for output 使用用途: Video Processing Pipelines MT48LC16M16A2 External DDR-style frame buffer 使用用途: Video Processing Pipelines EPCQ64ASI16N Quad-serial configuration flash 使用用途: ASIC Prototyping and Emulation SN65LVDS31 LVDS serializer for inter-board links 使用用途: ASIC Prototyping and Emulation EP4CE115F23C8N Intel 使用用途: ASIC Prototyping and Emulation SN74LVC8T245 Level shifter example (function absorbed into FPGA) 使用用途: Low-Cost ASIC Replacement and Glue Logic CDCE913 Programmable clock generator (PLL function absorbed) 使用用途: Low-Cost ASIC Replacement and Glue Logic OV5640 5 MP CMOS image sensor 使用用途: Embedded Vision and Image Sensor Aggregation MT9V032 Global-shutter VGA sensor for machine vision 使用用途: Embedded Vision and Image Sensor Aggregation EP4CE30F29I8LN Intel 使用用途: Embedded Vision and Image Sensor Aggregation MAX3485 RS-485 transceiver 使用用途: Communications Protocol Bridging TJA1050 NXP Semiconductors 使用用途: Communications Protocol Bridging W5500 WIZnet 使用用途: Communications Protocol Bridging

What is the EP4CE40F23C8L and what family does it belong to?

The EP4CE40F23C8L is a member of the Intel (formerly Altera) Cyclone IV E FPGA family, with 39,600 logic elements and 1.16 Mbits of embedded memory. It is housed in a 484-pin FineLine BGA package and uses a 60 nm low-power process. The 'E' designation marks the logic-and-memory optimized variant, and the 'C8' suffix indicates commercial temperature grade and speed grade 8. According to the Altera Cyclone IV Device Handbook, this device is targeted at cost-sensitive high-volume designs.

How many logic elements and memory bits does the EP4CE40F23C8L have?

The EP4CE40F23C8L contains 39,600 logic elements organized into adaptive logic modules (ALMs), 1,161,216 bits (1.16 Mbits) of embedded memory organized as 9-Kbit M9K blocks, and 116 hardware 18x18 multipliers. This density places it in the mid-range of the Cyclone IV E family, suitable for parallel DSP, video pipelines, and mid-complexity glue logic consolidation.

What package does the EP4CE40F23C8L use and how many I/O pins are available?

The EP4CE40F23C8L uses a 484-pin FineLine Ball Grid Array (F23 package code, 23x23 mm body, 1.0 mm ball pitch). It supports up to 328 general-purpose user I/O pins distributed across 4 I/O banks. The FBGA package enables high-density PCB designs but requires 6+ layer stackups with controlled-impedance routing. Refer to the Altera Cyclone IV Device Family Pin Connection Guidelines for unused-pin handling.

Where can I buy the EP4CE40F23C8L and what is the typical price?

The EP4CE40F23C8L is in stock at major authorized distributors including DigiKey, Mouser, and Heisener, with approximately 3,984 units available in the distribution channel as of September 2026. The unit price at quantity 1 is approximately $96.33 USD, dropping to around $72.10 USD at 1,000-piece quantities. Lead time is approximately 4 weeks for non-stocked quantities per Heisener.

What is the lead time and stock status for EP4CE40F23C8L?

The EP4CE40F23C8L shows approximately 3,984 units in distributor stock as of 2026-09-10, primarily at Heisener. Distributor stock is reported as immediate-ship for in-stock quantities, while larger volumes may carry 4-week lead times. Because the Cyclone IV E family remains in active production, allocation-driven lead time spikes are uncommon. For long-term volume commitments, contact authorized distributors directly.

Where can I download the EP4CE40F23C8L datasheet PDF?

The Altera (Intel) Cyclone IV Device Handbook and the EP4CE40F23C8L specific datasheet PDF are available on the Altera product page at https://www.altera.com/products/fpga/cyclone/iv/e/ep4ce40-f23/EP4CE40F23C8L. The full device handbook (Volume 1, 2, 3) contains electrical characteristics, pinout tables, configuration schemes, and timing specifications. The datasheet is also mirrored on third-party sites such as FindIC and Mouser.

EP4CE40F23C8L vs EP4CE40F23C8 - what is the difference?

The EP4CE40F23C8L is the lead-free, RoHS-compliant variant, while the EP4CE40F23C8 is the original lead-containing version. Both share identical die, package, and electrical performance. According to Altera's product numbering scheme, the 'L' suffix (or trailing 'N' depending on series) indicates RoHS compliance. Both parts are pin-compatible and can be substituted on existing PCBs without layout changes, though RoHS compliance is mandatory for modern designs.

What is the best drop-in replacement for EP4CE40F23C8L?

The best drop-in replacement for the EP4CE40F23C8L is the EP4CE40F23C8 itself (non-L, lead version) or speed/temperature grade variants in the same F23 484-FBGA package, such as EP4CE40F23C7N (speed grade 7) and EP4CE40F23C6N (speed grade 6). All variants share identical 484-FBGA ball map and pinout, allowing PCB-level drop-in. Sourcing from authorized distributors is recommended to avoid counterfeit risk.

Can EP4CE40F29C8N be used instead of EP4CE40F23C8L?

No, the EP4CE40F29C8N is NOT a drop-in replacement for the EP4CE40F23C8L. While both belong to the Cyclone IV E family, the F29 package denotes a 780-pin FBGA versus the F23 484-pin FBGA of the target part. The F29 package is physically larger with a different ball map, requiring PCB redesign. Same-die logic content may match, but the package mismatch prevents direct replacement.

What temperature range does the EP4CE40F23C8L support?

The EP4CE40F23C8L supports commercial temperature range from 0C to +85C junction temperature, per the 'C' suffix in the ordering code. For industrial-grade applications requiring -40C to +100C, the EP4CE40F23I8N or similar 'I'-suffix variants are required. Automotive-grade Cyclone IV E parts carry an 'A' suffix with -40C to +125C operation. Always verify temperature grade against your application environment.

What are the key specifications of EP4CE40F23C8L that engineers should know?

The EP4CE40F23C8L has 39,600 logic elements, 1.16 Mbits of embedded memory (M9K blocks), 116 hardware 18x18 multipliers, 4 general-purpose PLLs, 328 maximum user I/Os, and 20 global clock networks. It uses a 60 nm low-power process, runs on 1.2 V core, and supports configuration via Active Serial, Passive Serial, or JTAG. The 484-FBGA F23 package supports commercial 0C to +85C operation.

Is the EP4CE40F23C8L still in production or end-of-life?

The EP4CE40F23C8L and the broader Cyclone IV E family remain in active production as of 2026-09-10, with healthy distributor stock and no announced EOL date from Intel. Cyclone IV E parts are considered long-life-cycle products targeting industrial and consumer markets. The natural migration path is to Cyclone 10 LP for equivalent density with newer process technology.

What is the difference between EP4CE40F23C8L and EP4CE115F23C8N?

The EP4CE115F23C8N contains 114,480 logic elements (nearly 3x the EP4CE40F23C8L's 39,600 LEs) and 3.98 Mbits of embedded memory, but uses the same F23 484-pin FBGA package and pinout. The 'N' suffix denotes a lead-free RoHS-compliant part. While both share the same PCB footprint, firmware bitstreams are not interchangeable due to differing logic and memory resources.

What configuration modes does the EP4CE40F23C8L support?

The EP4CE40F23C8L supports Active Serial (AS), Passive Serial (PS), and JTAG configuration modes. AS mode uses an external serial flash (EPCS) to auto-load the bitstream on power-up; PS mode is driven by an external host or microcontroller; JTAG enables in-system programming and debugging via USB-Blaster or compatible cables. Configuration compression and 128-bit AES bitstream encryption are supported.

Is there a cross-brand equivalent for the EP4CE40F23C8L?

There is no pin-compatible cross-brand equivalent to the EP4CE40F23C8L because the Cyclone IV E family is Altera/Intel proprietary IP. Cross-brand substitutes (Lattice ECP5, Xilinx Spartan-6) use different package ball maps, configuration schemes, and HDL toolchains. Designers seeking cross-brand migration must re-target HDL code and redesign the PCB, which is a major effort compared to within-family speed-grade changes.

エンジニアリング参考データ: EP4CE40F23C8L — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the EP4CE40F23C8L when designing cost-sensitive volume products that require a RoHS lead-free Cyclone IV E FPGA in the 484-FBGA F23 package, and when 39,600 logic elements cover your design within comfortable margin. Use speed grade 8 only if your design closes timing at the slowest variant - otherwise move to speed grade 7 or 6. For non-RoHS legacy or military programs, choose EP4CE40F23C8 (lead version) instead. For industrial temperature grades (-40C to +100C), switch to EP4CE40F23I8LN. If your design exceeds 35,000 LEs after synthesis, migrate up to EP4CE55 or EP4CE75 in the same F23 package. Designers needing faster logic or larger memory at the same footprint should evaluate the EP4CE115F23 family.

代替品との比較

パラメータ	この製品	EP4CE40F23C8	EP4CE40F23C8N	EP4CE40F23C7N	EP4CE40F23C7	EP4CE40F23C6N	EP4CE40F23C6
Brand	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)
Package	484-pin FBGA (F23)	484-pin FBGA (F23) - same	484-pin FBGA (F23) - same	484-pin FBGA (F23) - same	484-pin FBGA (F23) - same	484-pin FBGA (F23) - same	484-pin FBGA (F23) - same
Logic Elements	39,600	39,600 - same	39,600 - same	39,600 - same	39,600 - same	39,600 - same	39,600 - same
Embedded Memory	1,161,216 bits	1,161,216 bits - same	1,161,216 bits - same	1,161,216 bits - same	1,161,216 bits - same	1,161,216 bits - same	1,161,216 bits - same
18x18 Multipliers	116	116 - same	116 - same	116 - same	116 - same	116 - same	116 - same
Speed Grade	8	8 - same	8 - same	7 (faster)	7 (faster)	6 (fastest)	6 (fastest)
RoHS Lead-Free	Yes (L suffix)	No (lead)	Yes (N suffix)	Yes (N suffix)	No (lead)	Yes (N suffix)	No (lead)
Operating Temperature Grade	Commercial (0C to +85C)	Commercial (0C to +85C)	Commercial (0C to +85C)	Commercial (0C to +85C)	Commercial (0C to +85C)	Commercial (0C to +85C)	Commercial (0C to +85C)

主な差別化要因

RoHS lead-free compliance with identical die and pinout （vs EP4CE40F23C8)
Slowest speed grade 8 for low-power designs （vs EP4CE40F23C6N)
Lowest unit cost among same-density Cyclone IV E variants （vs EP4CE115F23C8N)

設計ノート

Estimated: The 484-FBGA with 1.0 mm ball pitch requires a 6-layer PCB stackup minimum, with at least one dedicated ground plane directly beneath the BGA for return-current control. Place at least 8 ground vias in the BGA thermal/ground pad array to suppress ground bounce. Use 50 ohm controlled-impedance routing for LVDS pairs and 60 ohm for LVTTL single-ended signals. Always reference the Altera Cyclone IV Device Family Pin Connection Guidelines for unused-pin termination - unused I/O banks must be tied to a defined logic level via the Quartus pin-setting file.

Estimated: Core supply (VCCINT) requires 1.2 V at up to 500 mA during typical operation, plus PLL analog supply (VCCA) at 2.5 V and I/O supply (VCCIO) configurable from 1.2 V to 3.3 V per bank. Place 100 nF decoupling capacitors within 2 mm of every VCC pin and 10 uF bulk capacitors at each supply rail entry point. Power-on sequencing: VCCINT must ramp before VCCIO per Altera recommendations; failure to sequence may cause I/O latch-up. Use a TI TPS54331 or equivalent switching regulator with enable sequencing for reliable cold-start.

Estimated: Configuration mode pins (MSEL0/MSEL1/MSEL2) must be tied to fixed logic levels matching the desired configuration scheme - floating MSEL pins cause configuration failure. JTAG chain integrity requires TDI to TDO daisy-chain with no stubs; add 4.7 kohm pull-ups on TCK, TMS, and TDI. Do not exceed the maximum I/O bank count of 4 - assigning VCCIO levels across banks requires careful power-domain planning. For AS mode, choose an EPCS flash sized at least 2x the bitstream length for compression overhead margin.

Estimated: The 484-FBGA package has a theta_JA of approximately 15 C/W with a standard JEDEC 4-layer test board. At full utilization (~70% LEs active, all multipliers running at 200 MHz), power dissipation can reach 1.5-2 W, producing 22-30 C junction temperature rise above ambient. For sealed enclosures without forced airflow, consider a copper heat spreader bonded to the BGA top with thermal interface material. Industrial applications above 60 C ambient should derate to 50% utilization or switch to industrial-temperature variants.

コンプライアンス情報

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

鉛フリー

Yes

ハロゲンフリー

Unknown

紛争鉱物

Compliant

RoHS compliance confirmed by 'L' suffix in MPN per Altera/Intel product numbering convention. AEC-Q100 not applicable for commercial-grade FPGA. Halogen-free status not explicitly stated in retrieved web data - set to unknown pending datasheet verification.

データ検証日: 2026-09-10 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

出典: Manufacturer Product Page, Distributor, Distributor, Octopart, Distributor, Distributor, Distributor