EP4CE55F29I7N - 55K LE Cyclone IV E FPGA, 780-FBGA | Intel
部品番号: EP4CE55F29I7N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $200.09 | $200.09 |
| 10 | $188.5 | $1,885.00 |
| 100 | $172.4 | $17,240.00 |
| 250 | $162.1 | $40,525.00 |
| 500 | $154.8 | $77,400.00 |
EP4CE55F29I7N 概要
A field-programmable gate array (FPGA) is a reconfigurable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and dedicated hard IP such as PLLs, transceivers, and multipliers. FPGAs sit in the programmable-logic tier of the digital design hierarchy, between fixed-function ASICs and software-driven microcontrollers, and are used for digital signal processing, hardware acceleration, custom I/O bridging, and ASIC prototyping across industrial, communications, automotive, and consumer markets. The Cyclone IV E family is optimized for low total system cost and high functional density.
Key features of the EP4CE55F29I7N include support for LVDS, LVPECL, SSTL, and HSTL I/O standards with true LVDS at up to 875 Mbps, embedded multipliers (18 x 18) for DSP, and Nios II soft processor compatibility. The 'I7' speed-grade device operates across the industrial -40 C to +100 C junction temperature range and is supplied in a Pb-free, RoHS-compliant 29 mm x 29 mm 780-ball FBGA tray package.
Typical applications include industrial motor control and factory automation, video surveillance and image processing, automotive driver-assistance platforms, telecom line cards, and low-cost ASIC prototyping. When designing with this device, plan decoupling around the multiple VCCINT/VCCIO rails, respect the 780-ball BGA fan-out for PCB fabrication, and use Intel's Quartus Prime design suite for synthesis, place-and-route, and bitstream generation.
ドロップイン代替品: EP4CE55F29I7N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP4CE55F29I7N （同一形状・フットプリント） — 相違点: Package, Process Technology, Operating Temperature, Configuration Modes, Speed Grade.
クイック比較ツール — 並列比較する代替部品を選択:
EP4CE55F29I7
✅ ドロップイン✓ 在庫あり
$139.95 / 個
データシートを見る →EP4CE55F29C7N
✅ ドロップイン✓ 在庫あり
$138 / 個
データシートを見る →EP4CE55F29C8N
✅ ドロップイン✓ 在庫あり
$285 / 個
データシートを見る →EP4CE55F29C8LN
✅ ドロップイン✓ 在庫あり
$78.9 / 個
データシートを見る →EP4CE55F29C9LN
✅ ドロップイン✓ 在庫あり
$23.85 / 個
データシートを見る →EP4CE115F29I7N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP4CE55F29I7N 最大定格＆電気的特性
| Family | Cyclone IV E |
| Logic Elements (LE) | 55,856 |
| Embedded Memory Bits | 2,396,160 |
| Number of LABs/CLBs | 3491 |
| Maximum User I/O | 374 |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) |
| Number of PLLs | 4 |
| Global Clock Networks | 20 |
| Dedicated Clock Pins | 11 |
| Embedded Multipliers (18x18) | 154 |
| パッケージ | 780-ball FBGA (F29), 29 mm x 29 mm, 1.0 mm pitch |
| Speed Grade | I7 (industrial) |
| 動作接合温度 | -40 C to +100 C |
| Process Technology | 60 nm low-k |
| RoHS ステータス | Compliant |
| 実装タイプ | Surface Mount |
| Supply Type | Tray |
EP4CE55F29I7N 780-ball fbga (f29), 29 mm x 29 mm, 1.0 mm pitch ピン配置ガイド
EP4CE55F29I7N (780-ball fbga (f29), 29 mm x 29 mm, 1.0 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP4CE55F29I7N.
詳細は データシート をご参照ください。
主な用途
EP4CE55F29I7N の用途: 6 件s: Industrial Motor Control and Factory Automation, Video Surveillance and Image Processing, Automotive Driver-Assistance and Infotainment, Telecom Line Cards and Protocol Bridging, ASIC and SoC Prototyping, Low-Cost DSP and Signal Conditioning.
Industrial Motor Control and Factory Automation
The EP4CE55F29I7N is well matched to industrial multi-axis motor control and PLC platforms because it integrates 55,856 logic elements and 154 18x18 hardware multipliers, which together absorb encoder-decoding logic, PID loops, and SVPWM generation for several axes in parallel. Its 374 user I/Os accept quadrature, SSI, and BiSS feedback streams while driving gate-driver interfaces to IGBT or SiC inverters, reducing the external logic IC count. The -40 C to +100 C industrial junction range and 1.2 V low-power core suit 24 V cabinet environments where heat dissipation must stay passive. Quartus Prime and Qsys accelerate integration of EtherCAT, PROFINET, or EtherNet/IP soft IP, allowing one FPGA to serve as both motion controller and industrial protocol bridge.
おすすめ
Video Surveillance and Image Processing
Mid-range video analytics designs benefit from the EP4CE55F29I7N's 2,396,160 bits of embedded RAM, which double-buffer HD frames and hold Sobel, Canny, and motion-detection line arrays without external SRAM. The 154 18x18 multipliers accelerate convolution kernels, optical-flow estimators, and H.264 assist functions at full 1080p60 throughput. LVDS receivers at up to 875 Mbps connect directly to CMOS image sensors and HDMI deserializers, while 20 global clocks and 4 PLLs generate the pixel, line, and frame domains. The 780-ball FBGA accommodates the wide parallel video bus, and industrial temperature grading enables outdoor IP-camera and traffic-monitoring deployments.
おすすめ
Automotive Driver-Assistance and Infotainment
Inside ADAS sensor-fusion ECUs and infotainment head units, the EP4CE55F29I7N's industrial -40 C to +100 C junction range tolerates the under-dash thermal envelope. Its 55,856 logic elements aggregate multiple camera LVDS streams, perform lane-detection and object-recognition preprocessing, and route audio/video to the head-unit SoC. The 4 PLLs and 11 dedicated clock pins derive independent pixel clocks from automotive Ethernet or serializer-deserializer references. Embedded M9K memory buffers surround-view frames while 154 multipliers execute FFTs for radar preprocessing, making the part a flexible host for tier-one supplier platforms.
おすすめ
Telecom Line Cards and Protocol Bridging
Telecom line cards use the EP4CE55F29I7N to bridge legacy TDM buses, SPI, I2C, and UART peripherals to modern SERDES-based backplanes without an external ASIC. The 374 user I/Os aggregate slow control channels, while 154 multipliers accelerate Reed-Solomon, CRC, and encryption engines for backhaul traffic. Hot-socketing support allows cards to be inserted into a live system without disrupting the backplane, and the low-power 1.2 V core reduces per-slot thermal load in densely populated chassis. Quartus Prime IP cores shorten E1/T1, HDLC, and 1588 PTP development cycles.
おすすめ
ASIC and SoC Prototyping
ASIC verification teams prototype mid-complexity SoCs on the EP4CE55F29I7N, using its 55,856 logic elements and 2.4 Mbit of RAM to map CPUs, peripherals, and interconnect fabrics before tape-out. Multiple FPGAs can be chained via LVDS point-to-point links to emulate larger die, while Quartus Prime's TimeQuest timing analyzer verifies critical paths at the I7 speed grade. The 780-ball FBGA exposes the I/O count needed for DDR2/DDR3 soft memory controllers and high-pin-count ASIC bus emulation, cutting bring-up time versus simulation-only flows.
おすすめ
Low-Cost DSP and Signal Conditioning
DSP front-ends for instrumentation, sonar, and SDR leverage the EP4CE55F29I7N's 154 dedicated 18x18 multipliers and 2.4 Mbit block RAM to implement FIR, FFT, and digital down-converter pipelines. Its 4 PLLs derive multiple sampling clocks from a single reference oscillator, while 11 dedicated clock inputs synchronize to external ADCs and DACs. The 1.2 V core keeps power dissipation low enough for fanless enclosures, and the 780-ball FBGA offers ample I/O for parallel ADC data capture at 100+ MSPS. The result is a flexible, mid-density DSP platform that scales from ultrasound beamforming to software-defined radio baseband processing.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP4CE55F29I7N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP4CE55F29I7 | EP4CE55F29C7N | EP4CE55F29C8N | EP4CE55F29C8LN | EP4CE115F29I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (F29) | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 114,480 |
| Embedded RAM (bits) | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 3,888,000 |
| Speed Grade | I7 (industrial) | I7 | C7 (commercial) | C8 | C8 | I7 |
| Temperature Range | -40 C to +100 C | -40 C to +100 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | -40 C to +100 C |
| Maximum User I/O | 374 | 374 | 374 | 374 | 374 | 528 |
| Embedded 18x18 Multipliers | 154 | 154 | 154 | 154 | 154 | 266 |
主な差別化要因
- Industrial-grade temperature range vs commercial variants （vs EP4CE55F29C7N)
- I7 speed grade for highest Fmax in the family （vs EP4CE55F29C8N)
- Double the logic and RAM when migrating to EP4CE115 （vs EP4CE115F29I7N)
設計ノート
The EP4CE55F29I7N requires multiple power rails: VCCINT 1.2 V for the core, VCCIO 1.2 V to 3.3 V per I/O bank, VCCA 2.5 V for PLLs, and VCCPD 3.3 V for configuration I/O. Decouple each rail with 0.1 uF + 10 uF ceramic capacitors placed within 5 mm of each supply pin, and use a 4-layer PCB with a continuous ground plane. Estimated core current is 800 mA to 1.2 A under typical workloads, so a switching regulator rated to 3 A is recommended for VCCINT.
At junction temperatures above 85 C, derate I/O toggle rates and disable unused PLLs to limit self-heating. The 780-ball FBGA relies on PCB copper for heat spreading; design at least 8 thermal vias under the center ball grid connected to inner ground planes. Estimated: with no airflow and 1.2 W internal dissipation on a 100 x 100 mm 4-layer board, junction-to-ambient theta is approximately 15 C/W, yielding ~18 C rise above ambient.
The 1.0 mm pitch 780-ball FBGA demands ENIG or ENEPIG surface finish, 0.4 mm laser-drilled microvias, and controlled-impedance routing for LVDS pairs (100 ohm differential). Use 0.2 mm trace/space for escape routing, and follow Intel's Cyclone IV F29 footprint reference. Place the JTAG header, configuration flash, and clock source within 25 mm of the FPGA to avoid signal-integrity issues.
Do not power the FPGA without a valid configuration image; a blank device will drive all I/Os as inputs, potentially causing bus contention on shared lines. Use a dedicated configuration EPCS or EPCQ flash, and tie nCONFIG to VCCIO via a 10 kohm pull-up and nSTATUS to VCCIO via a 10 kohm pull-up as recommended by Intel. Ensure MSEL pins match the selected configuration mode (AS, PS, JTAG) at board reset.
コンプライアンス情報
RoHS and Pb-free per Cyclone IV E product page and DigiKey listing. AEC-Q100 qualification status is not published by Intel for this industrial-grade FPGA; for AEC-Q100 needs consult Intel automotive-grade product lines.
