EP4CGX150DF27C6N - 149760 Cells, 3.125 Gbps Transceiver FPGA | Intel
部品番号: EP4CGX150DF27C6N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 100 | $245 | $24,500.00 |
| 500 | $225 | $112,500.00 |
| 1,000 | $205 | $205,000.00 |
EP4CGX150DF27C6N 概要
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and memory. Within the broader taxonomy it sits between an ASIC (fixed-function, high-NRE) and a microcontroller (firmware-defined, lower performance), making it ideal for high-throughput parallel processing, protocol bridging, and design-iterable logic. The Cyclone IV family targets cost-sensitive, low-power applications where ASIC NRE is unjustified.
Key features of the EP4CGX150DF27C6N include 8 integrated 3.125 Gbps transceivers, dedicated hardware multipliers and DSP blocks for signal processing, distributed and embedded memory, and support for common I/O standards (LVDS, LVTTL, PCI Express, DDR2/3). It supports PCI Express Gen1 x1/x2/x4 hard IP blocks and offers a low static power design typical of the Cyclone IV family.
Architecturally, the device is built around Logic Array Blocks (LABs) containing adaptive logic modules (ALMs), fed by global and peripheral routing. The integrated transceivers support protocols such as PCIe, Gigabit Ethernet, CPRI, and Serial RapidIO, while the hard memory controller and PLL block simplify clock and external memory interfacing.
Typical applications include industrial motor control, video processing, software-defined radio, automotive driver assistance, and communication infrastructure. The FBGA-672 package is well suited to high-density PCB designs with controlled-impedance routing for high-speed serial links.
When designing with this device, ensure signal-integrity-aware PCB layout for the multi-gigabit transceiver channels, including matched-length routing and proper decoupling. Engineers should also verify Quartus Prime tool support for the target logic capacity and transceiver configuration.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: EP4CGX150DF27C6N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP4CGX150DF27C6N （同一形状・フットプリント） — 相違点: Package, Speed Grade, Transceivers, Operating Temperature, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP4CGX150DF27C7N
✅ ドロップイン✓ 在庫あり
$171 / 個
データシートを見る →EP4CGX150DF27C8N
✅ ドロップイン✓ 在庫あり
$305 / 個
データシートを見る →EP4CGX150DF27I7N
✅ ドロップイン✓ 在庫あり
$175.6 / 個
データシートを見る →EP4CGX150DF27I6N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP4CGX110DF27C6N
✅ ドロップイン✓ 在庫あり
$119.9 / 個
データシートを見る →EP4CGX150DF27C6N 最大定格＆電気的特性
| Family | Cyclone IV GX |
| Logic Elements | 149,760 |
| Process Technology | 60 nm |
| Core Supply Voltage | 1.2 V (range 1.16 V to 1.24 V) |
| パッケージ | 672-ball FBGA (F27) |
| Transceivers | 8 high-speed serial channels up to 3.125 Gbps |
| PCIe Hard IP | Yes, Gen1 x1/x2/x4 |
| Speed Grade | C6 (commercial) |
| 動作温度 | Commercial (0C to +85C) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
| Pin/Ball Count | 672 |
EP4CGX150DF27C6N 672-ball fbga (f27) ピン配置ガイド
EP4CGX150DF27C6N (672-ball fbga (f27) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP4CGX150DF27C6N.
詳細は データシート をご参照ください。
主な用途
EP4CGX150DF27C6N の用途: 7 件s: Industrial Motor Control, Video Processing and Bridging, Software Defined Radio, Automotive Driver Assistance Systems, Communication Infrastructure, Test and Measurement Instrumentation, Embedded Computing and Protocol Bridging.
Industrial Motor Control
The EP4CGX150DF27C6N fits industrial motor control with its 149,760 logic elements and eight 3.125 Gbps transceivers enabling multi-axis feedback loops. Its integrated DSP blocks deliver the multiply-accumulate throughput needed for FOC and SVPWM algorithms, while the PCI Express hard IP simplifies connection to industrial PCs. Engineers typically run motor control loops at 20-100 kHz inside the FPGA fabric with deterministic latency, using one transceiver per axis for encoder communication. The 1.2 V core keeps power dissipation low enough for enclosed industrial cabinets.
おすすめ
Video Processing and Bridging
For video processing and bridging applications, the EP4CGX150DF27C6N provides enough logic capacity for real-time SDI de-embedders, color space converters, and format bridges up to 3 Gbps. The 3.125 Gbps transceivers accept SDI, HDMI, or DisplayPort serial streams, while the programmable fabric handles buffering and timing. The FBGA-672 footprint supports matched-length routing required for SDI-compliant signal integrity, with measured jitter well below 0.3 UI on locked designs.
おすすめ
Software Defined Radio
Software defined radio (SDR) designs benefit from the EP4CGX150DF27C6N's 149,760 logic elements for FFT/iFFT computation and eight transceivers supporting multi-band RF front-ends. The hard DSP blocks accelerate FIR filters and channelizers, while the embedded memory holds time-domain sample buffers for real-time processing. PCI Express Gen1 x4 interfaces digitize data to a host PC, with the FPGA delivering measured sample rates above 200 MSPS on optimized cores.
おすすめ
Automotive Driver Assistance Systems
In ADAS applications, the EP4CGX150DF27C6N handles sensor fusion between cameras, radar, and LiDAR with its parallel logic capacity and serial transceiver channels. The device supports multi-lane CSI-2 bridging, real-time object detection preprocessing, and CAN/LIN/Ethernet gateway functions. Use industrial temperature grade EP4CGX150DF27I6N for under-hood or exterior sensor housings, where -40C to +100C operation is required.
おすすめ
Communication Infrastructure
For communication infrastructure, the EP4CGX150DF27C6N supports CPRI, OBSAI, and Serial RapidIO links via its 3.125 Gbps transceivers, commonly deployed in small-cell baseband processing and remote radio head (RRH) applications. The PCI Express hard IP enables connection to baseband SoCs, while the logic capacity accommodates protocol stacks and encryption layers. The FBGA-672 package delivers the routing density needed for multi-link designs.
おすすめ
Test and Measurement Instrumentation
In test and measurement, the EP4CGX150DF27C6N functions as a high-speed capture and pattern generator front-end, with 3.125 Gbps transceivers driving protocol-aware test sequences and 149k logic elements executing real-time analysis. The PCI Express link streams aggregated samples to host analysis software. The commercial speed grade (C6) supports the highest internal clock rates for capturing edge transitions at sub-nanosecond resolution.
おすすめ
Embedded Computing and Protocol Bridging
The EP4CGX150DF27C6N is widely used for embedded protocol bridging between SPI, I2C, UART, USB, Ethernet, and PCI Express domains. With 149,760 logic elements it can implement multiple soft cores alongside custom logic, while the transceivers handle high-speed serial links. This combination suits industrial gateways, IoT edge nodes, and aerospace interface units where protocol translation must be deterministic and low-latency.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP4CGX150DF27C6N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP4CGX150DF27C7N | EP4CGX150DF27C8N | EP4CGX150DF27I7N | EP4CGX150DF27I6N | EP4CGX110DF27C6N |
|---|---|---|---|---|---|---|
| Package | FBGA-672 (F27) | FBGA-672 (F27) - same | FBGA-672 (F27) - same | FBGA-672 (F27) - same | FBGA-672 (F27) - same | FBGA-672 (F27) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 149,760 | 149,760 | 149,760 | 149,760 | 149,760 | 109,424 |
| Speed Grade | C6 | C7 | C8 | I7 | I6 | C6 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial |
| Transceivers | 8 channels, 3.125 Gbps | 8 channels, 3.125 Gbps | 8 channels, 3.125 Gbps | 8 channels, 3.125 Gbps | 8 channels, 3.125 Gbps | 8 channels, 3.125 Gbps |
| PCIe Hard IP | Gen1 x1/x2/x4 | Gen1 x1/x2/x4 | Gen1 x1/x2/x4 | Gen1 x1/x2/x4 | Gen1 x1/x2/x4 | Gen1 x1/x2/x4 |
| Unit Price (qty 1) | USD 285 | USD 295 | USD 265 | USD 315 | USD 305 | USD 235 |
主な差別化要因
- Highest speed grade in F27 package （vs EP4CGX150DF27C8N)
- Higher logic density in same package （vs EP4CGX110DF27C6N)
- Commercial temperature grade with lowest cost （vs EP4CGX150DF27I7N)
設計ノート
The FBGA-672 package at 1.0 mm pitch requires controlled-impedance PCB routing for transceiver channels. Use 100-ohm differential pairs for 3.125 Gbps lanes and keep matched lengths within 0.127 mm tolerance. Apply continuous reference ground planes on adjacent layers and provide ample decoupling (0.1uF + 10uF) near each power pin. Source: Cyclone IV hardware design guide.
Estimate: at 1.2 V core voltage with full transceiver utilization, the EP4CGX150DF27C6N dissipates approximately 3-4 W of power. The FBGA-672 package has a typical theta_JA of around 15-20 C/W with proper PCB layout. A solid ground plane with thermal vias under the BGA and forced airflow is recommended for industrial temperature grades. Source: estimated based on typical Cyclone IV GX power data.
For 3.125 Gbps transceiver operation, use AC-coupled capacitor networks (typically 100 nF) on each serial channel as recommended by the Cyclone IV GX handbook. Power-on sequencing requires all power rails to ramp monotonically and stabilize before configuration begins - consult the device handbook for the exact sequence. Without proper sequencing, the device may latch-up or fail to configure. Source: Cyclone IV device handbook.
コンプライアンス情報
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified (industrial grade variants available separately). Lead-free packaging standard.