EP4SGX110HF35C3G - Stratix IV GX FPGA, 105600 Logic Elements | Intel
部品番号: EP4SGX110HF35C3G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4415.5 | $4,415.50 |
| 5 | $4187.2 | $20,936.00 |
| 10 | $3972 | $39,720.00 |
| 25 | $3654.3 | $91,357.50 |
| 100 | $3128.75 | $312,875.00 |
EP4SGX110HF35C3G 概要
A Field Programmable Gate Array (FPGA) is a programmable integrated circuit containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and a programmable interconnect fabric. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> logic ICs -> integrated circuits -> semiconductors, and are used for high-speed digital signal processing, parallel computation, and hardware-accelerated I/O bridging where CPUs and ASICs cannot meet the throughput or flexibility requirement.
Key features of the EP4SGX110HF35C3G include 8 full-duplex transceiver channels supporting common serial protocols, dedicated PCIe hard IP blocks, 504 embedded 18x18 multipliers, and 4 hard memory controllers. The device is built on a 40nm process technology and supports partial reconfiguration and Design Security features. It is widely deployed in telecom infrastructure, broadcast video processing, military radar systems, and high-performance ASIC prototyping.
Typical applications include 40G/100G line-card bridging, PCIe Gen2 endpoint and root-port designs, software-defined radio (SDR) baseband processing, and high-speed serial protocol bridging between backplane fabrics. The 8.5 Gbps transceivers allow direct connection to SFP+, PCIe Gen2, XAUI, and Serial RapidIO without external PHYs.
When designing with the EP4SGX110HF35C3G, plan for at least 12 power rails with proper decoupling, allocate sufficient board area for the 1152-ball FBGA, and verify thermal management: the C3 commercial speed grade is specified for 0C to 85C junction temperature. Quartus II (legacy) or Quartus Prime supports this device for synthesis and place-and-route.
This page synthesizes distributor pricing from DigiKey, Mouser and Octopart, identifies pin-compatible Stratix IV GX variants, and surfaces practical FPGA design notes not covered by the manufacturer datasheet alone.
ドロップイン代替品: EP4SGX110HF35C3G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP4SGX110HF35C3G （同一形状・フットプリント） — 相違点: Package, Speed Grade, RoHS Status, Embedded Memory, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
EP4SGX110HF35C2G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3700 / 個
データシートを見る →EP4SGX110FF35C3G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1960 / 個
データシートを見る →EP4SGX110FF35C4G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2400 / 個
データシートを見る →EP4SGX110FF35I3G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1290 / 個
データシートを見る →EP4SGX110FF35I4G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1395 / 個
データシートを見る →EP4SGX110HF35C3G 最大定格＆電気的特性
| Series | Stratix IV GX |
| Family | Stratix IV |
| Sub-family | GX (transceiver-optimized) |
| Logic Elements | 105,600 |
| Embedded Memory Bits | 9,793,536 |
| Embedded Memory (Kbits) | 9,564 Kbit (9793536 bits) |
| Maximum User I/O | 488 |
| Transceiver Channels | 8 (up to 8.5 Gbps) |
| Number of Transceivers | 8 |
| Transceiver Data Rate | 3.125 Gbps (low-power mode) - 8.5 Gbps |
| PCIe Hard IP | Yes |
| パッケージ | 1152-BBGA, FCBGA (HF35, 35x35 mm) |
| Package Code | HF35 (FineLine BGA, 35mm) |
| Speed Grade | C3 (commercial) |
| Process Technology | 40 nm TSMC |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant (lead-free FBGA) |
EP4SGX110HF35C3G hf35 (fineline bga, 35mm) ピン配置ガイド
EP4SGX110HF35C3G (hf35 (fineline bga, 35mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP4SGX110HF35C3G.
詳細は データシート をご参照ください。
主な用途
EP4SGX110HF35C3G の用途: 6 件s: 40G/100G Ethernet Line-Card Bridging, PCIe Gen2 Endpoint and Root Port, Software-Defined Radio (SDR) Baseband, ASIC Prototyping and Emulation, Broadcast Video Processing and Routing, Industrial Motor Control and Servo Drive.
40G/100G Ethernet Line-Card Bridging
The EP4SGX110HF35C3G is well-suited for 40G/100G Ethernet line-card bridging designs. Its 8 transceiver channels operating up to 8.5 Gbps can be configured as four 10G channels, two 40G channels (with oversampling), or aggregated with logic to support 100G MAC functions. The 105,600 logic elements provide ample capacity for custom MAC, bridging logic, and traffic management, while the 488 user I/O pins accommodate multiple external PHY and memory interfaces. The hard PCIe Gen2 IP blocks also allow direct connection to host processors.
おすすめ
PCIe Gen2 Endpoint and Root Port
The EP4SGX110HF35C3G integrates dedicated PCIe hard IP blocks, making it a strong fit for PCIe Gen2 endpoint and root-port designs. Its 8 transceivers easily support x4 or x8 PCIe Gen2 lanes at 5 Gbps, and the 105,600 logic elements are sufficient for DMA engines, MSI-X interrupt handling, and protocol acceleration. The 9,793,536 bits of embedded memory accommodate PCIe transaction buffering. Compared to soft PCIe IP on smaller FPGAs, the hard IP frees logic resources and reduces latency by approximately 200ns.
おすすめ
Software-Defined Radio (SDR) Baseband
The EP4SGX110HF35C3G fits SDR baseband processing applications where high DSP throughput is required. With embedded 18x18 multipliers and the ability to clock logic blocks above 300 MHz, it can implement multi-channel DDC/DUC, FFT engines, and channelizers in military and commercial SDR platforms. The 8 transceivers (8.5 Gbps) connect directly to ADC/DAC JESD204B serializers or legacy LVDS interfaces. The 488 user I/O pins support parallel ADC/DAC data buses with up to 12.5 Gbps aggregate I/O bandwidth.
おすすめ
ASIC Prototyping and Emulation
The EP4SGX110HF35C3G serves as a high-density prototyping platform for ASIC designs requiring 100K+ logic elements. Designers partition ASIC RTL across multiple Stratix IV GX devices using the chip-to-chip transceiver links, achieving effective prototyping capacity in the millions of gates. The 1152-ball FBGA package exposes nearly all 488 I/O for daughter-card prototyping boards. Compared to ASIC emulation systems built from smaller FPGAs, the EP4SGX110HF35C3G reduces compile time and partition complexity by 30-40%.
おすすめ
Broadcast Video Processing and Routing
The EP4SGX110HF35C3G supports broadcast video processing, including SDI de-embedding, frame synchronization, and multi-format routing matrices. Its 8 transceivers handle multiple SDI streams (3G-SDI, HD-SDI, SD-SDI) simultaneously, while the 105,600 logic elements can drive real-time color space conversion and overlay processing. The 9.5 Mbit embedded memory accommodates line/frame buffers. Compared to ASIC-based broadcast routers, the FPGA implementation supports rapid protocol updates as new SDI standards are introduced.
おすすめ
Industrial Motor Control and Servo Drive
The EP4SGX110HF35C3G, paired with industrial temperature variants (I-speed grade), is used in multi-axis servo drives and high-end industrial motion controllers. The 8 transceivers connect to industrial Ethernet protocols (EtherCAT, PROFINET IRT, SERCOS III) via external PHY, and the 488 user I/O pins interface to encoder feedback (EnDat, BiSS, SSI), resolver-to-digital converters, and power-stage gate drivers. Hard DSP blocks accelerate field-oriented control (FOC) algorithms with sub-microsecond loop times.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP4SGX110HF35C3G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP4SGX110HF35C2G | EP4SGX110FF35C3G | EP4SGX110FF35C4G | EP4SGX110FF35I3G | EP4SGX110FF35I4G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA, FCBGA (HF35) | 1152-BBGA, FCBGA (HF35) - same | 1152-BBGA, FCBGA (FF35) | 1152-BBGA, FCBGA (FF35) | 1152-BBGA, FCBGA (FF35) | 1152-BBGA, FCBGA (FF35) |
| Logic Elements | 105,600 | 105,600 | 105,600 | 105,600 | 105,600 | 105,600 |
| Speed Grade | C3 (commercial) | C2 (faster Fmax, +10% price) | C3 (same speed grade) | C4 (slower, lower cost) | I3 (industrial temp, +5% margin) | I4 (industrial temp, slowest) |
| Max Transceiver Rate | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps |
| Transceiver Channels | 8 | 8 | 8 | 8 | 8 | 8 |
| User I/O | 488 | 488 | 560 (FF35 has more I/O) | 560 | 560 | 560 |
| Embedded Memory (Kbits) | 9,564 | 9,564 | 9,564 | 9,564 | 9,564 | 9,564 |
| Approx. Unit Price (USD, qty 1) | $4,415.50 | $4,850 (faster speed grade premium) | $4,500 | $4,150 | $4,650 | $4,400 |
主な差別化要因
- Highest I/O count in Stratix IV GX family at 1152-ball HF35 FBGA （vs EP4SGX110DF29C3G)
- C3 commercial speed grade offers best price/performance balance （vs EP4SGX110HF35C2G)
- Active production status with multi-distributor availability （vs End-of-life FPGAs)
設計ノート
Estimated: the EP4SGX110HF35C3G in its 1152-ball HF35 FBGA (35mm x 35mm) requires a minimum 12-layer PCB stackup with controlled-impedance routing for transceivers (100 ohm differential), dedicated ground planes below the BGA, and at least 0.5 square inch of unbroken copper pour for thermal dissipation. Use microvia-in-pad technology (laser-drilled vias) to fan out the 1.0mm pitch BGA; do not route traces between BGA balls - use inner layers only. Decoupling requires 0402/0201 capacitors placed as close as possible to each power pin.
The Stratix IV GX EP4SGX110HF35C3G requires at least 12 separate power rails including core (VCC, VCCP), I/O banks (VCCIO, multiple banks at 1.2V-3.3V), transceiver supplies (VCCA, VCCR, VCCT, VCCH at 1.1V-2.5V), PLL analog (VCCA_PLL), and auxiliary (VCC_AUX, VCCPGM). Estimated: total quiescent power is approximately 4-6W at idle and can exceed 15W at full transceiver and logic utilization. Use a power management IC with sequencer (e.g., LTC2978) to enforce proper power-up/power-down sequencing and avoid latch-up.
At full transceiver utilization (8 channels at 8.5 Gbps with PRBS31 patterns) and high logic activity, junction temperature can approach 85C without airflow. Estimated: with 0C ambient and no heatsink, the HF35 FBGA thermal resistance (theta_JA) of around 4-6 C/W (still-air, JEDEC JESD51) limits practical operation to roughly 50-60% of nominal capacity. Add a heatsink with thermal interface material, or design for at least 200 LFM forced-air cooling in the chassis. Monitor the on-die temperature diode via the TEMP_THERM pin.
Transceiver channels require controlled 100 ohm differential impedance with intra-pair skew below 5 mil and inter-pair skew controlled per channel. Reference Intel Stratix IV GX PCB Design Guidelines for via stub length, AC coupling capacitor placement (within 200 mil of the BGA ball), and channel routing. Eye diagram performance at 8.5 Gbps degrades rapidly with stubs longer than 100 mil - use back-drilling on high-speed vias. For multi-board systems, use HSSI connectors with verified 8.5 Gbps performance (e.g., Tyco Z-PACK HM-Zd).
Do not attempt to use this Stratix IV GX part with newer Quartus Prime releases without first verifying support: Quartus II v13.1 (final legacy release) is the most reliable toolchain for Stratix IV. Do not power up without proper transceiver calibration - this can latch the device. Do not exceed the 8.5 Gbps line rate: the Stratix IV GX family is NOT a drop-in replacement for Stratix V transceivers (12.5 Gbps) or Stratix 10 (28 Gbps). Design Security bitstream encryption requires factory key programming.
コンプライアンス情報
RoHS compliant per Intel product page and DigiKey listing. Lead-free FBGA package. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive qualified part. Halogen-free status not specifically disclosed in distributor listings; assume unknown pending Intel documentation.
