EP4SGX360FH29I4 - Stratix IV GX FPGA 353K LE, 780-FCBGA | Intel
部品番号: EP4SGX360FH29I4 ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1410 | $705,000.00 |
| 1,000 | $1295 | $1,295,000.00 |
EP4SGX360FH29I4 概要
A Field-Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement arbitrary digital logic through configurable logic blocks (CLBs/LABs), routing fabric, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. Within Intel's programmable-logic hierarchy, the Stratix IV GX family sits in the high-performance mid-range tier above Cyclone but below Stratix V/Stratix 10 in process node and transceiver speed. The 40 nm node gives the EP4SGX360FH29I4 an attractive balance of logic density, power efficiency, and cost for established designs that do not need the newest transceivers.
Key differentiating features include 353,600 logic elements (highest density in the Stratix IV GX family for this pin-out), integrated 8.5 Gbps multi-gigabit transceivers for PCI Express Gen2, Serial RapidIO, XAUI, CEI-6G, and CPRI links, and 14,144 LABs that map to roughly 28,000 adaptive logic modules (ALMs). Hard IP blocks for DDR3 memory controllers, embedded multipliers for DSP, and PCIe Gen2 x8 endpoints are standard.
Architecturally, Stratix IV GX uses ALMs (8-input fracturable look-up tables plus dedicated arithmetic/logic), embedded 9-Kbit M9K and 144-Kbit M144K memory blocks, and per-transceiver Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA) blocks. The 0.9 V core and 1.1 V/1.5 V/1.8 V/2.5 V/3.0 V I/O banks draw power proportional to toggle rate and transceiver utilization; Quarts II power estimation should be used during design entry.
Typical applications include high-speed serial interface bridging (e.g., 10G Ethernet MAC + PHY bridging), DSP accelerator cards for wireless baseband and radar, ASIC/ASSP prototyping, test-and-measurement equipment, military/aerospace signal processing, and broadcast video infrastructure where the integrated transceivers replace external PHYs. The 780-ball FCBGA supports high channel count while still permitting reflow on standard SMT lines.
When designing with this part, allocate transceiver reference-clock quality carefully because jitter directly scales into output eye margins. Use Intel's Stratix IV GX Transceiver Toolkit for eye-diagram tuning and the ALTGX megafunction for protocol mapping. DDR3 interfaces should be length-matched within 25 mils of the target rank to meet tDS/tDH at 800 MHz.
This page synthesizes distributor pricing from DigiKey and Mouser, same-family Stratix IV GX drop-in alternatives from the Site MPN list, and Stratix IV E/Stratix V migration guidance that the manufacturer handbook does not surface in a single place.
ドロップイン代替品: EP4SGX360FH29I4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP4SGX360FH29I4 （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Family, RoHS Status, Embedded Memory.
クイック比較ツール — 並列比較する代替部品を選択:
EP4SGX360FH29I3
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP4SGX360FH29I3N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1950 / 個
データシートを見る →EP4SGX360FH29C4N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4850 / 個
データシートを見る →EP4SGX360FH29C4
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3225 / 個
データシートを見る →EP4SGX360FH29I4 最大定格＆電気的特性
| Series | Stratix IV GX |
| Family | Stratix IV GX FPGA |
| Logic Elements / Cells | 353,600 |
| LABs / CLBs | 14,144 |
| Total Memory Bits | 23,105,536 |
| Number of I/O | 289 |
| Operating Voltage (Core) | 0.9 V |
| 動作温度 | -40C to +100C (industrial, I4 grade) |
| パッケージ / ケース | 780-BBGA, FCBGA (780-HBGA, FC-HFBGA) |
| 実装タイプ | Surface Mount |
| Process Technology | 40 nm |
| Transceivers | Multi-gigabit, up to 8.5 Gbps |
| Supplier Device Package | 780-FCBGA |
| Embedded Memory Type | M9K + M144K block RAM |
| Hard IP Blocks | PCIe Gen2, DDR3 controller, DSP blocks |
EP4SGX360FH29I4 780-fcbga ピン配置ガイド
EP4SGX360FH29I4 (780-fcbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP4SGX360FH29I4.
詳細は データシート をご参照ください。
主な用途
EP4SGX360FH29I4 の用途: 6 件s: 10 Gigabit Ethernet Interface Bridge, Wireless Baseband DSP Accelerator, Radar Signal Processing Card, ASIC / ASSP Prototyping Platform, Broadcast Video Infrastructure, Test & Measurement Equipment Front-End.
10 Gigabit Ethernet Interface Bridge
The EP4SGX360FH29I4 is well-suited for 10G Ethernet MAC + PHY bridging because it integrates multi-gigabit transceivers capable of 8.5 Gbps and exposes up to 289 user I/O for SFP+ cage interconnects. The 353,600 logic elements and 14,144 LABs let designers implement a 10G MAC with full TCP/UDP offload, jumbo-frame buffering, and link-aggregation logic. Using 64-bit wide DDR3 at 800 MHz backed by 23 Mbit of block RAM, the part handles line-rate packets with sub-microsecond latency - a level that fixed-function ASSPs typically cannot match. Pin-compatible I3 speed-grade alternatives let designers trade fMAX for cost on non-timing-critical bridges.
おすすめ
Wireless Baseband DSP Accelerator
The EP4SGX360FH29I4's hard DSP blocks, 23 Mbit of embedded memory, and 353K logic elements are ideal for wireless baseband DSP such as LTE PHY, 5G NR pre-FFT, and software-defined radio front-ends. Designers can map FFT/iFFT kernels, channel-estimation matrices, and turbo-decoder trellis stages to the 14,144 LABs while keeping coefficient tables in M9K/M144K block RAM. Transceiver rates up to 8.5 Gbps connect cleanly to CPRI or OBSAI fronthaul links. Industrial -40C to +100C operation supports outdoor base-station deployments, and the FH29 package's 29x29 mm footprint fits ATCA or microTCA blades.
おすすめ
Radar Signal Processing Card
Radar signal processing - especially phased-array beamforming, pulse compression, and MTI filtering - demands very high logic density and DSP throughput. The EP4SGX360FH29I4 delivers 353,600 logic elements and embedded multipliers that handle 1024-point FFTs in under 10 microseconds at 250 MHz, plus 289 user I/O for ADC/DAC interconnects. The integrated transceivers carry digitized IF data from A/D converters at rates up to 8.5 Gbps (e.g., from TI ADC12D1600 or Analog Devices AD9680) with deterministic latency critical for coherent beamforming. The industrial -40C to +100C temperature grade and ruggedized FCBGA solder-down construction suit airborne and naval radar environments.
おすすめ
ASIC / ASSP Prototyping Platform
ASIC and ASSP prototyping is one of the canonical uses for high-density Stratix IV GX parts. The EP4SGX360FH29I4's 353,600 logic elements plus 14,144 LABs map a typical 20-30 million ASIC gate design when combined with soft memory and IP cores. Hardware debug via SignalTap II logic analyzer and Quartus II TimeQuest timing closure shortens bring-up by weeks. Transceivers emulate SerDes PHYs in pre-silicon validation, while 289 I/O fan out to standard prototyping connectors such as FMC or VITA 57.1. The same FH29 780-FCBGA footprint across I3/I4/C4/C3 speed grades enables design teams to share PCB between prototype and production builds.
おすすめ
Broadcast Video Infrastructure
The EP4SGX360FH29I4 excels in broadcast video routing, format conversion, and compression. Designers use 353K logic elements plus 23 Mbit block RAM to implement multi-channel SDI de-embedders, HDR/WCG color-space converters, and JPEG-XS codec engines. Embedded transceivers support SMPTE ST 2022-6/7 uncompressed video over IP at 6 Gbps, eliminating external HDMI-to-SDI bridge chips. The 780-FCBGA's high I/O count accommodates 12G-SDI quad-link aggregation and PTP grandmaster timestamping. Industrial temperature grade supports 24/7 rack-mounted operation in studios and outside-broadcast trucks.
おすすめ
Test & Measurement Equipment Front-End
High-end oscilloscopes, logic analyzers, and protocol analyzers use the EP4SGX360FH29I4 as the data acquisition and DSP engine. The integrated 8.5 Gbps transceivers acquire raw ADC samples at rates such as 6.4 GSPS (e.g., from TI ADC12J4000), while the 353,600 logic elements implement real-time triggering, decimation, and FFT-based spectrum analysis. 23 Mbit block RAM serves as a deep circular sample buffer, and 289 user I/O fan out to front-panel display, USB 3.0, and 10G Ethernet interfaces. Industrial temperature grade supports bench-top instruments operating in uncontrolled labs, and the FH29 package's compact 29x29 mm area suits multi-channel modular instruments like PXIe digitizers.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP4SGX360FH29I4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP4SGX360FH29I3 | EP4SGX360FH29I3N | EP4SGX360FH29C4N | EP4SGX360FH29C4 | EP4SGX360FF35I4N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FCBGA (FH29) | 780-FCBGA (FH29) | 780-FCBGA (FH29) | 780-FCBGA (FH29) | 780-FCBGA (FH29) | 780-FCBGA (FF35) - different footprint |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Speed Grade | I4 (industrial, fastest) | I3 (industrial, slower) | I3 (industrial, N=lead-free) | C4 (commercial, N=lead-free) | C4 (commercial) | I4 (industrial, N=lead-free) |
| Temperature Grade | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| User I/O | 289 | 289 | 289 | 289 | 289 | 289 |
| Embedded Memory Bits | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
| Transceiver Rate (max) | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps |
主な差別化要因
- Highest-density 780-FCBGA FH29 variant in Stratix IV GX family （vs EP4SGX230KF40I4N)
- Compact 29x29 mm FH29 footprint with full 289 I/O （vs EP4SGX360FF35I4N)
- I4 fastest speed grade in -40C to +100C industrial range （vs EP4SGX360FH29I3)
設計ノート
Estimated: The 780-FCBGA FH29 package has 1.0 mm ball pitch and requires a 12-layer PCB with microvia stack-ups (e.g., 4-2-4 build) for breakout routing. Maintain at least 6 mil trace/space, 4 mil via-to-pad, and use via-in-pad with filled/capped plating if thermal pad soldering under the package is required. Decoupling must follow Intel's Stratix IV GX PDN guide: place 0402 0.1uF X7R capacitors on every other I/O bank pin pair plus 220uF bulk polymer tantalum within 0.5 inch of the package.
Estimated: At typical Stratix IV GX utilization (70% LEs, 16 transceivers at 6.25 Gbps, 8 Gbit/s DDR3), expect 8-12 W dissipation with the FH29 package. Theta_JA is approximately 8 C/W with 400 LFM airflow and 11 C/W passive (per Intel thermal model). Designers should mount a heatsink with 0.5 inch height and apply thermal interface material rated for the -40C to +100C range. For enclosed chassis, de-rate ambient by 10C per Intel reliability guidelines.
Transceiver reference clocks must come from a low-jitter source such as the Texas Instruments CDCE62005 or Silicon Labs Si5338 with integrated jitter cleaner; jitter should be under 150 fs RMS (12 kHz to 20 MHz) to keep the 8.5 Gbps eye margin above 0.3 UI per IEEE 802.3 specifications. Length-match all PCIe/CPRI/XAUI differential pairs within 5 mils and use Intel's Transceiver Toolkit to characterize the channel with the on-chip PRBS generator before bringing up the system.
Do NOT assume that Stratix IV GX configuration bitstreams are interchangeable across speed grades (I4 vs I3 vs C4). Each speed bin requires its own Quartus II programming file because fMAX and delay-line taps differ; trying to load an I4 file into an I3 device will cause configuration failure. Also avoid the FH29 vs FF35 trap: same 780-ball count but DIFFERENT ball-map - schematic swap requires PCB re-spin, not a simple BOM change.
コンプライアンス情報
RoHS/REACH compliance status not explicitly stated in the verified web data; consult Intel's product content declaration. The N-suffix variants (e.g. EP4SGX360FH29I3N) denote lead-free finish per Intel naming convention but this should be verified against the official PCN.
