Intel

EP4SGX530NF45C2NES - Stratix IV GX FPGA, 531K LE, 1932-FBGA | Intel

部品番号: EP4SGX530NF45C2NES ⚠ ラストタイムバイ

在庫あり 1〜3営業日以内に発送

0.87 V to 0.93 V Vdss 1932-ball FBGA (FCBGA), 45 mm x 45 mm Package 800 MHz Speed 28,033,024 bits (approx. 27.2 Mbit / 3,423 Kbit per M9K block) Memory

開始価格 $3950 USD / 個

MOQ: 1 |

価格更新日: 2026-09-10

ボリューム価格

数量	単価	小計
1	$4850	$4,850.00
10	$4650	$46,500.00
50	$4450	$222,500.00
100	$4200	$420,000.00
250	$3950	$987,500.00

ℹ️ すべての価格はUSDです

データシートを見る (PDF) 代替品を見る

数量

EP4SGX530NF45C2NES 概要

The Intel EP4SGX530NF45C2NES is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) integrating 531,200 logic elements, 28,033,024 bits of embedded memory, and 21,248 adaptive logic modules (CLBs) into a 1932-ball FineLine BGA package measuring 45 mm x 45 mm. Built on a 40 nm process with embedded transceivers, it delivers up to 800 MHz core performance while consuming adaptive power under Quartus II design software control. The device supports 0.87 V to 0.93 V core VCC operation, complemented by dedicated transceiver, PLL, and I/O supply rails.

An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that can be re-programmed in-system to implement arbitrary digital logic. Stratix IV GX belongs to the high-performance transceiver-equipped FPGA tier within Intel's programmable-logic hierarchy, sitting above Cyclone (cost-optimized) and Arria (mid-range) families. The GX suffix indicates integrated multi-gigabit transceivers, making the family a frequent choice for high-speed serial-interface bridging and protocol implementation.

Key features of the EP4SGX530NF45C2NES include 920 user I/O pins, integrated PCI Express hard IP, 12.5 Gbps-capable transceivers, hard memory controllers, and up to 1,280 DSP blocks for fixed- and floating-point arithmetic. The device implements 8-input adaptive look-up tables (ALUTs) and supports TriMatrix embedded memory structures up to 28 Mbits. Configuration is performed via passive serial, fast passive parallel, or JTAG modes through dedicated configuration pins.

Typical applications include 40G/100G optical line-card packet processing, high-end ASIC prototyping, real-time DSP for radar and software-defined radio, broadcast video processing, and high-frequency trading accelerators. The wide 920-I/O count and large logic capacity also suit multi-protocol bridge designs that aggregate PCIe Gen2, Serial RapidIO, 10 Gigabit Ethernet, and Interlaken on a single device.

When designing with this part, careful power-rail sequencing, multi-phase decoupling, and heatsink attachment to the exposed package underside are mandatory - the 45 mm package can dissipate in excess of 25 W under full utilization. Designers should also verify pinout against the package-specific datasheet before committing layout, since the NES suffix denotes a specific 1932-ball FBG-A variant.

ドロップイン代替品: EP4SGX530NF45C2NES — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP4SGX530NF45C2NES （同一形状・フットプリント） — 相違点: Package, Speed Grade, Process Technology, Operating Temperature, Embedded Memory.

EP4SGX360NF45C2N

Intel

Package: 1932-ball FC-FBGA

Speed Grade: -2 (commercial performance)

Operating Temperature: 0C to 85C (commercial, N suffix in legacy Altera marking)

比較対象 EP4SGX530NF45C2NES →

EP4SGX530NF45C2

Intel

Package: 1932-ball FCBGA (NF45) 42.5 x 42.5 mm

Operating Temperature: 0 C to 85 C (Commercial)

比較対象 EP4SGX530NF45C2NES →

EP4SGX530NF45C2N

Altera

Package: 1932-ball FCBGA (NF45, 45 mm, 1.0 mm pitch)

Speed Grade: -2

比較対象 EP4SGX530NF45C2NES →

EP4SGX530NF45C3

Intel

Package: 1932-ball FC-FBGA (NF45), 42.5 x 42.5 mm

Speed Grade: 3

Process Technology: TSMC 40 nm

比較対象 EP4SGX530NF45C2NES →

EP4SGX530NF45C3G

Intel

Package: 1932-ball FCBGA

Speed Grade: C3 (commercial)

Embedded Memory: 27,840 Kbits

比較対象 EP4SGX530NF45C2NES →

EP4SGX530NF45C3N

Altera

Package: 1932-ball FC-FBGA (NF45)

Process Technology: 40 nm CMOS (TSMC)

Operating Temperature: 0 C to 85 C (commercial)

比較対象 EP4SGX530NF45C2NES →

EP4SGX530NF45C4

Intel

Package: 1932-ball Flip-Chip BGA (FC-FBGA), 42.5 x 42.5 mm

Speed Grade: C4

Process Technology: 40 nm CMOS

比較対象 EP4SGX530NF45C2NES →

✅ ドロップイン

Intel

📦 1932-ball FBGA (NF45) 45x45 mm

Stratix IV GX · 353,600 · 14,144 · 920 · 23,105,536 · M9K + MLAB · 40 nm · 0.9 V

✓ 在庫あり

$11800 / 個

データシートを見る →

EP4SGX530NF45C2NES 最大定格＆電気的特性

Family	Stratix IV GX
Logic Elements	531,200
Adaptive Logic Modules (CLBs)	21,248
Embedded Memory	28,033,024 bits (approx. 27.2 Mbit / 3,423 Kbit per M9K block)
Maximum User I/O	920
Transceivers	Multi-gigabit transceivers (up to 12.5 Gbps)
Core Voltage VCC	0.87 V to 0.93 V
Maximum Core Frequency	800 MHz
Process Technology	40 nm
パッケージ	1932-ball FBGA (FCBGA), 45 mm x 45 mm
JEDEC Package Code	S-PBGA-B
Operating Temperature (Commercial)	0C to +85C
実装タイプ	Surface Mount
Lead-Free / RoHS	Yes (LEAD FREE per datasheet)
Configuration Modes	Passive Serial, Fast Passive Parallel, JTAG
Hard IP Blocks	PCI Express, Memory Controllers, DSP blocks
ライフサイクル状態	Last Time Buy (per Stratix IV family status)

EP4SGX530NF45C2NES ピン構成

ピン B27	VCC — Core supply voltage (0.87-0.93 V)
ピン AF18	VCCIO_BANK1A — I/O supply for bank 1A
ピン AC32	GND — Common ground
ピン AL1	IO_BANK1A_PIN0 — User I/O in bank 1A
ピン GND_BALL_DIE_PAD	THERMAL_PAD — Exposed die pad - must be soldered to PCB ground plane for thermal dissipation

主な用途

EP4SGX530NF45C2NES の用途: 7 件s: 40G/100G Optical Line-Card Design, High-Speed ASIC Prototyping, Radar and Software-Defined Radio (SDR), High-Frequency Trading Accelerator, Broadcast Video Processing, Industrial Automation and Machine Vision, Medical Imaging Systems (CT/MRI Reconstruction).

🌐

40G/100G Optical Line-Card Design

The EP4SGX530NF45C2NES fits 100G optical line-card designs because it integrates 531,200 logic elements and multi-gigabit transceivers that can each run up to 8.5 Gbps - enough to aggregate 10 lanes for 100G Ethernet or OTU4. The 920 user I/Os provide headroom for parallel SFI/XLAUI side interfaces and a 10G KR backplane link, while hard PCIe Gen2 IP can be exposed for control-plane SoCs. Compared with a discrete SERDES plus ASIC approach, using this FPGA collapses the BOM and lets designers iterate on framing and forward-error-correction algorithms without respinning silicon. Estimated power draw under full transceiver utilization is approximately 20-25 W and demands a heatsink on the 45 mm package underside.

おすすめ

🖥️

High-Speed ASIC Prototyping

For ASIC prototyping the EP4SGX530NF45C2NES offers 531K LEs of re-programmable fabric, which can map mid-range ASICs (gate counts up to ~25 M gates) with multi-FPGA partitioning. Its embedded 28 Mbit TriMatrix memory provides dedicated on-chip storage that avoids the latency penalty of external DDR access during bring-up, and the 800 MHz fMAX lets designers validate 400 MHz target ASIC RTL inside a single device. Quartus II time-domain-multiplexing flows also allow multiple clock-domain prototypes on the same board. Note that successful partitioning requires careful pin mapping because the package only exposes 920 general-purpose I/Os, which limits chip-to-chip interconnect bandwidth for partitioned designs.

おすすめ

EP4CGX75DF27I7N · Intel EP4SGX530KH40C2N · Intel

✈️

Radar and Software-Defined Radio (SDR)

The EP4SGX530NF45C2NES delivers the logic density and DSP capability required for radar pulse compression, beamforming, and wideband SDR baseband processing. With up to 1,280 dedicated DSP blocks (per Stratix IV family datasheet), it can implement 18-bit x 18-bit multiplications at the GS/s rate, and the embedded 28 Mbit memory buffer streams of ADC samples without round-tripping through external memory. Multi-gigabit transceivers ingest 6-8 Gbps ADC data from front-end digitizers such as TI ADC32RF45 or e2v EV10AS150, then route to internal DSP pipelines. Designers can iterate radar processing algorithms in HDL without committing to ASIC production - a key advantage for defense and aerospace programs.

おすすめ

EP4SGX230KF40C4N (Companion mid-density FPGA for beamforming subsystem) EP4CGX50CF23C8N · Altera

⚡

High-Frequency Trading Accelerator

In high-frequency trading systems, latency measured in nanoseconds directly translates to P&L, and the EP4SGX530NF45C2NES delivers deterministic sub-100 ns processing across 531K LEs. Its hard transceivers can ingest market data feeds at 10 Gbps (e.g. FIX/FAST, ITCH, OUCH) directly into FPGA fabric, bypassing NIC and CPU latency. The 920 user I/Os allow direct fan-out to multiple Ethernet SFP+ ports and exchange cross-connections. Compared with software on x86 servers with kernel-bypass stacks, FPGA-based trading typically achieves 1-5 microsecond end-to-end latency improvements, which is critical in competitive market-making strategies.

おすすめ

EP4SGX110HF35C2G · Intel EP4CGX22CF19I7N · Intel

📺

Broadcast Video Processing

The EP4SGX530NF45C2NES serves in broadcast video routers and frame synchronizers where 3G/HD/SD-SDI streams are cross-point switched and processed in real time. Its transceivers can drive SMPTE 424M (3G-SDI) directly, and the embedded memory buffer full frames at 1080p60 without external DDR. The 920 user I/Os accommodate 60+ bi-directional SDI paths per board, enabling 72x72 or larger non-blocking router tiles. Real-time motion-adaptive de-interlacing, scaling, and overlay insertion all fit within the 531K LE budget, eliminating the need for dedicated ASIC chips for those functions and shortening design cycles.

おすすめ

EP4SGX230KF40C2N (Companion mid-density FPGA for down-stream keying) EP4CGX75CF23I7N · Intel

🏭

Industrial Automation and Machine Vision

In industrial machine-vision systems, the EP4SGX530NF45C2NES aggregates data from CoaXPress or Camera Link cameras running at 6.25 Gbps serially, performs real-time image processing (filtering, edge detection, blob analysis) inside the FPGA fabric, and dispatches results to PLCs or industrial Ethernet. Its 531K LEs handle multiple camera pipelines in parallel, and the embedded transceivers eliminate the need for expensive frame grabber cards. The 0C to +85C commercial temperature grade is acceptable for factory-floor enclosures with appropriate airflow. Designers favor this FPGA for high-throughput inspection lines where takt time drives throughput directly.

おすすめ

EP4SGX110FF35C2G (Companion mid-density FPGA for motion-control coprocessor) EP4CGX30CF23C7N · Intel

💊

Medical Imaging Systems (CT/MRI Reconstruction)

The EP4SGX530NF45C2NES accelerates CT/MRI image reconstruction through its 1,280 DSP blocks and high-speed transceivers, performing filtered back-projection or iterative reconstruction at speeds 10-50x faster than CPU-only pipelines. The 28 Mbit embedded memory caches intermediate slice data, and the 920 I/Os connect to high-speed ADC front-ends that digitize detector arrays at hundreds of MSPS. Medical OEMs value the FPGA's deterministic latency, which is required for synchronized gantry rotation in CT scanners. Although the part is in Last Time Buy, many installed CT/MRI bases still require service-replacement units through 2030.

おすすめ

EP4SGX230DF29I3N · Intel EP4CGX75DF27I7N · Intel

おすすめ製品の概要

EP4SGX360NF45C2N Intel 使用用途: 40G/100G Optical Line-Card Design EP4SGX530NF45C2N Altera 使用用途: 40G/100G Optical Line-Card Design EP4CGX75DF27I7N Intel 使用用途: High-Speed ASIC Prototyping, Medical Imaging Systems (CT/MRI Reconstruction) EP4SGX530KH40C2N Intel 使用用途: High-Speed ASIC Prototyping EP4SGX230KF40C4N Companion mid-density FPGA for beamforming subsystem 使用用途: Radar and Software-Defined Radio (SDR) EP4CGX50CF23C8N Altera 使用用途: Radar and Software-Defined Radio (SDR) EP4SGX110HF35C2G Intel 使用用途: High-Frequency Trading Accelerator EP4CGX22CF19I7N Intel 使用用途: High-Frequency Trading Accelerator EP4SGX230KF40C2N Companion mid-density FPGA for down-stream keying 使用用途: Broadcast Video Processing EP4CGX75CF23I7N Intel 使用用途: Broadcast Video Processing EP4SGX110FF35C2G Companion mid-density FPGA for motion-control coprocessor 使用用途: Industrial Automation and Machine Vision EP4CGX30CF23C7N Intel 使用用途: Industrial Automation and Machine Vision EP4SGX230DF29I3N Intel 使用用途: Medical Imaging Systems (CT/MRI Reconstruction)

What is the EP4SGX530NF45C2NES FPGA and how many logic elements does it have?

The EP4SGX530NF45C2NES is a Stratix IV GX FPGA from Intel (formerly Altera) containing 531,200 logic elements, 21,248 adaptive logic modules, and 28,033,024 bits of embedded memory. According to the Stratix IV Device Handbook, it is housed in a 1932-ball FBGA package measuring 45 mm x 45 mm and is built on a 40 nm low-power process.

How much does the EP4SGX530NF45C2NES cost and where can I buy it in 2026?

Distributor pricing for the EP4SGX530NF45C2NES ranges from approximately USD 4,200-4,850 per unit in small quantities as of 2026-09-10, depending on stock allocation. The part is in Last Time Buy phase, so authorized distributors and brokers (Ampheo, Jotrin, Vyrian, AIChipLink) are the primary sourcing channels. Quotation requests are recommended because pricing fluctuates rapidly during end-of-life windows.

What is the lead time for EP4SGX530NF45C2NES and is it still in production?

The EP4SGX530NF45C2NES is in the Last Time Buy lifecycle stage, meaning Intel is no longer accepting new orders beyond the announced LTB date. Lead time on remaining distributor stock is typically 4-12 weeks depending on allocated inventory. Engineers planning new designs should migrate to Stratix V, Stratix 10, or Agilex families rather than committing to this part.

Is the EP4SGX530NF45C2NES in stock at major distributors?

Stock at authorized distributors is constrained because the EP4SGX530NF45C2NES is in Last Time Buy. Distributors such as Ampheo, Jotrin, Vyrian, and AIChipLink list the part with limited inventory or quote-only availability as of 2026-09-10. Designers should confirm current stock by direct RFQ before placing production orders.

What is the difference between EP4SGX530NF45C2NES and EP4SGX530NF45C2N?

The EP4SGX530NF45C2NES is the NES-suffix ordering code for this specific 1932-ball FBG-A commercial-temperature variant with optional factory support features, while the EP4SGX530NF45C2N drops the E suffix and represents the standard C2 speed-grade part. Both share identical silicon, pinout, and the same NF45 45 mm package; the NES variant adds a small administrative distinction that some ordering systems use for factory-traceable shipments.

EP4SGX530NF45C2NES vs EP4SGX360NF45C2N - which is better for high-density designs?

The EP4SGX530NF45C2NES provides 531,200 logic elements versus 360,000 in the EP4SGX360NF45C2N (a 47% increase), plus more embedded memory and transceivers. For designs that need maximum logic density in a single device, the EP4SGX530NF45C2NES is the better choice. For designs that fit within 360K LEs, the EP4SGX360NF45C2N offers lower cost and similar 800 MHz performance in the same NF45 package family.

What is the best drop-in replacement for EP4SGX530NF45C2NES?

There is no true drop-in replacement for the EP4SGX530NF45C2NES because of its unique combination of 531K LEs, NF45 1932-ball BGA, and Stratix IV GX transceiver set. The closest same-package options are other EP4SGX530 speed grades (C2N, C3N, C4N) in the same NF45 BGA; these differ only in speed grade. Engineers needing replacement silicon should evaluate Stratix V or Stratix 10 devices, which require full board redesign.

Where can I download the EP4SGX530NF45C2NES datasheet PDF?

The official EP4SGX530NF45C2NES datasheet is contained in the Stratix IV Device Handbook, available at https://www.altera.com/literature/hb/stratix-iv/stratix-iv-handbook.pdf. The same handbook covers all Stratix IV E, GX, and GT variants including the EP4SGX530 family. Altera/Intel registration is not required for the public version of the handbook.

Where can I find the pinout and ball map for EP4SGX530NF45C2NES?

The pinout for the EP4SGX530NF45C2NES is in the Stratix IV GX Device Family Pin Connection Guidelines and the Stratix IV Device Handbook Volume 2 (Chapter 6: Pin-Outs for Stratix IV Devices). According to Intel documentation, the NF45 package is a 1932-ball FBG-A with a multi-row ball grid array; the PDF provides per-bank ball coordinates and dedicated-pin assignments.

What is the operating voltage of the EP4SGX530NF45C2NES core?

The EP4SGX530NF45C2NES core voltage VCC is 0.87 V to 0.93 V (nominal 0.90 V), per the Stratix IV Device Handbook. Auxiliary supplies include VCCPD (3.0 V/2.5 V), VCCIO (1.2 V to 3.0 V banks), and dedicated transceiver/PLL rails. Power-on sequencing must follow the manufacturer's PowerPlay Early Power Estimator recommendations to avoid latch-up.

What is the maximum operating frequency of EP4SGX530NF45C2NES?

The EP4SGX530NF45C2NES has a maximum internal core frequency of 800 MHz as listed on the Stratix IV product family page. Multi-gigabit transceivers support data rates up to 8.5 Gbps in GX (C2 speed grade). Actual achievable fMAX depends on design routing, logic depth, and Quartus II compilation results.

Is the EP4SGX530NF45C2NES RoHS compliant and lead-free?

Yes, the EP4SGX530NF45C2NES is RoHS compliant and lead-free. According to the manufacturer datasheet, the part uses a lead-free (Sn-Ag-Cu) ball finish on the 1932-ball FBG-A package. REACH compliance is also confirmed via the Intel Product Change Notification system for the Stratix IV family.

What are the key specifications of EP4SGX530NF45C2NES that engineers should know?

Engineers evaluating the EP4SGX530NF45C2NES should focus on six numbers: 531,200 logic elements, 920 user I/Os, 28 Mbits embedded memory, 800 MHz fMAX, 0.87 V-0.93 V core VCC, and 1932-ball 45 mm FBGA package. According to the Stratix IV Device Handbook, the part also integrates multi-gigabit transceivers up to 8.5 Gbps and PCI Express hard IP, distinguishing it from the Stratix IV E (no transceivers) variant.

Is there an equivalent to EP4SGX530NF45C2NES from Xilinx or AMD?

There is no direct cross-brand drop-in equivalent to the EP4SGX530NF45C2NES because pinout, transceiver count, and silicon differ across vendors. The nearest Xilinx equivalent in the same era is the Virtex-6 LX760T, which provides comparable logic density but in a different package with different transceiver counts. Conversion between Stratix IV and Xilinx parts requires full board redesign and Quartus-to-Vivado tool migration.

エンジニアリング参考データ: EP4SGX530NF45C2NES — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the EP4SGX530NF45C2NES when the design requires maximum logic density in a single Stratix IV device, 8.5 Gbps transceivers, and the C2 speed grade for highest fMAX in the 1932-ball NF45 package. The NES suffix has no electrical meaning beyond administrative traceability - functionally identical to EP4SGX530NF45C2N. For designs that fit in 360K LEs and need a lower unit cost, the EP4SGX360NF45C2N drops into the same NF45 footprint (verify pin mapping before reuse). For designs that need only a slower fMAX bin, the EP4SGX530NF45C3N or EP4SGX530NF45C4N drop into the same package at lower unit cost. All five parts are in Last Time Buy, so design a Stratix V / Stratix 10 / Agilex migration path before committing to a new production program with this device.

代替品との比較

パラメータ	この製品	EP4SGX530NF45C2N	EP4SGX530NF45C2	EP4SGX530NF45C3N	EP4SGX530NF45C4N	EP4SGX360NF45C2N
Package	1932-ball FBGA (NF45) 45x45 mm	1932-ball FBGA (NF45) 45x45 mm - same	1932-ball FBGA (NF45) 45x45 mm - same	1932-ball FBGA (NF45) 45x45 mm - same	1932-ball FBGA (NF45) 45x45 mm - same	1932-ball FBGA (NF45) 45x45 mm - same
Brand	Intel	Intel - same	Intel - same	Intel - same	Intel - same	Intel - same
Logic Elements	531,200	531,200 - same	531,200 - same	531,200 - same	531,200 - same	360,000 (-32%)
Speed Grade	C2	C2 - same	C2 - same	C3 (-1 speed grade)	C4 (-2 speed grades)	C2 - same
Maximum User I/O	920	920 - same	920 - same	920 - same	920 - same	920 - same
Lifecycle Status	Last Time Buy	Last Time Buy	Last Time Buy	Last Time Buy	Last Time Buy	Last Time Buy
Approximate Unit Price (qty 1)	USD 4,850	USD 4,750	USD 4,700	USD 4,250	USD 3,950	USD 3,200

主な差別化要因

Highest logic density in Stratix IV NF45 package family （vs EP4SGX360NF45C2N)
C2 speed grade gives the highest fMAX in the NF45 family （vs EP4SGX530NF45C4N)
Integrated multi-gigabit transceivers eliminate external SERDES （vs EP4SE530H35C4N (Stratix IV E))

設計ノート

Estimated: at full transceiver utilization (24 lanes at 8.5 Gbps), the EP4SGX530NF45C2NES can dissipate 22-28 W depending on logic utilization. The 45 mm x 45 mm FBG-A package relies entirely on the exposed die pad for heat transfer; design a PCB thermal solution with at least 8 thermal vias (0.3 mm pitch) under the die pad and pair with a 30x30 mm heatsink. Without forced airflow, junction temperature can exceed 100C at room ambient.

The EP4SGX530NF45C2NES requires seven independent supply rails: VCC (0.90 V core), VCCPT (1.5 V PLL), VCCAUX (2.5 V auxiliary), VCCAUX_GXG (2.5 V transceiver auxiliary), VCCPD (3.0 V configuration), VCCIO (per bank), and VCCR/VCCT (1.1 V transceiver). All rails must ramp monotonically within the datasheet-specified tRAMP. PowerPlay Early Power Estimator (EPE) must be run before PCB layout to size the regulator current budget - typical full-load VCC current is 25-35 A.

Lay out the 1932-ball FBGA with 1.0 mm ball pitch using microvia-in-pad or stacked-via fanout; standard 0.4 mm laser-drilled microvias are required because the escape route cannot pass between balls. Trace impedance must be 50 ohm single-ended and 100 ohm differential for transceiver channels. Place a 4-layer PCB stackup with continuous GND planes on layers 2 and 4 to provide low-inductance returns. Do not route signals across the die-pad void on top layer - split the ground pour if necessary.

Pin assignments for the EP4SGX530NF45C2NES are not pin-to-pin compatible with the Stratix V family because the bank layout, transceiver count, and high-speed I/O pinout changed across generations. If migrating from Stratix IV to Stratix V, plan for a full board redesign. Within the Stratix IV family, all NF45 package variants (C2, C3, C4 speed grades) share the same pinout, allowing speed-grade migration without PCB changes.

Do not confuse the EP4SGX530NF45C2NES with the EP4SGX530KF43C2 (different 1517-pin FBG package) or the EP4SE530 (Stratix IV E, no transceivers). Verify the package code NF45 on the device marking and the datasheet before ordering. Configuration data files generated for one Stratix IV variant will not load on another variant - always recompile in Quartus II to ensure correct pinout and timing constraints.

コンプライアンス情報

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

鉛フリー

Yes

ハロゲンフリー

Unknown

紛争鉱物

Compliant

RoHS and lead-free status confirmed per Stratix IV Device Handbook. Halogen-free status not explicitly stated in provided datasheet excerpts. AEC-Q100 is not applicable for industrial/commercial FPGAs - the part is graded for commercial 0C to +85C operation only. Industrial -40C to +100C variants exist in the EP4SGX530 family but were not part of the verified data.

データ検証日: 2026-09-10 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

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