EP4SGX70DF29I4N - Stratix IV GX 72.6K LEs FPGA 780-FCBGA | Intel
部品番号: EP4SGX70DF29I4N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1410 | $705,000.00 |
| 1,000 | $1295 | $1,295,000.00 |
EP4SGX70DF29I4N 概要
A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit built from a matrix of programmable logic blocks, programmable interconnects, and embedded hardened IP such as transceivers, block RAM, and DSP blocks. FPGAs sit in the programmable logic family of the broader semiconductor taxonomy (FPGA -> programmable logic -> digital IC -> integrated circuit -> semiconductor). Unlike ASICs, FPGAs are post-fabrication programmable, allowing hardware designers to implement custom parallel datapaths, high-speed interfaces, and prototype logic without NRE tooling.
Key features include Stratix IV GX transceivers capable of multi-gigabit serial I/O for protocols such as PCI Express Gen1/Gen2 and Gigabit Ethernet, embedded multipliers and DSP blocks, 24 transceiver channels on this device, and a hard memory controller subsystem. The 780-FCBGA package with 372 user I/Os delivers dense board connectivity suited to high-bandwidth line cards and baseband cards. The device supports partial reconfiguration and design security via bitstream encryption.
From an architectural perspective, the Stratix IV GX family uses a logic-structure of 8-input Adaptive Logic Modules (ALMs), each capable of implementing a full 6-input LUT plus carry chain. The fabric is paired with columnar and M20K block RAM tiles and DSP blocks with hardened 18x18 multipliers. Transceiver tiles operate up to 8.5 Gbps, and the device integrates a PCIe hard IP block plus external memory PHY support for DDR3/QDRII+.
Typical applications include high-speed serial backplane aggregation, baseband processing in wireless infrastructure, ASIC prototyping, military secure communications, and broadcast video processing. The 40 nm low-power process variant of Stratix IV GX balances performance with power efficiency for line-card deployments. Design considerations include power-rail sequencing of 0.9 V core and 1.1 V/2.5 V transceiver supplies, robust thermal management on the 29x29 mm FCBGA, and bitstream encryption to protect IP. This page synthesizes distributor inventory, drop-in Stratix IV GX siblings, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: EP4SGX70DF29I4N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP4SGX70DF29I4N （同一形状・フットプリント） — 相違点: Package, Speed Grade, Mounting Type, Operating Temperature Grade, Transceivers.
クイック比較ツール — 並列比較する代替部品を選択:
EP4SGX70DF29I3G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1080 / 個
データシートを見る →EP4SGX70DF29C4N
✅ ドロップイン✓ 在庫あり
$1750 / 個
データシートを見る →EP4SGX70DF29C3G
✅ ドロップイン✓ 在庫あり
$1425 / 個
データシートを見る →EP4SGX70DF29C4G
✅ ドロップイン✓ 在庫あり
$196.99 / 個
データシートを見る →EP4SGX70DF29C2XN
✅ ドロップイン✓ 在庫あり
$2450 / 個
データシートを見る →EP4SGX70DF29C2XG
✅ ドロップイン✓ 在庫あり
$1295 / 個
データシートを見る →EP4SGX70DF29I4N 最大定格＆電気的特性
| Family | Stratix IV GX |
| Logic Elements | 72,600 |
| Logic Array Blocks (LABs/CLBs) | 2,904 |
| Total RAM Bits | 7,564,880 |
| User I/Os | 372 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| パッケージ | 780-BBGA, FC-FBGA (DF29), 29 x 29 mm |
| 動作温度 | -40C to +100C (industrial) |
| Speed Grade | I4 |
| 実装タイプ | Surface Mount |
| Lead-Free / RoHS | Yes (lead free per supplier listings) |
| Cell Count | 72,600 cells |
| Maximum Frequency | 717 MHz |
| Supplier Package Code | FBGA-780 (DF29) |
EP4SGX70DF29I4N fbga-780 (df29) ピン配置ガイド
EP4SGX70DF29I4N (fbga-780 (df29) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP4SGX70DF29I4N.
詳細は データシート をご参照ください。
主な用途
EP4SGX70DF29I4N の用途: 6 件s: Wireless Baseband Processing, High-Speed Serial Backplane Aggregation, ASIC Prototyping and Emulation, Broadcast Video Processing, Military and Aerospace Communications, Test and Measurement Instrumentation.
Wireless Baseband Processing
The EP4SGX70DF29I4N's 72,600 logic elements and dedicated DSP blocks make it well suited for wireless baseband signal processing, where it implements uplink/downlink datapaths for LTE and 5G fronthaul CPRI links. The Stratix IV GX transceivers operating up to 8.5 Gbps directly interface CPRI or OBSAI backhaul without external SerDes, while the 7.56 Mbits of block RAM serve as data buffers between ADC stages and DSP pipelines. Industrial -40C to +100C temperature rating lets the device sit directly on base-station outdoor baseband cards. Compared with a generic DSP+ASSP partition, this single-chip approach reduces board area and bill of materials while preserving the flexibility to upgrade modulation schemes via bitstream update.
おすすめ
High-Speed Serial Backplane Aggregation
The Stratix IV GX transceiver tile supports up to 8.5 Gbps serial links, enabling the EP4SGX70DF29I4N to aggregate multiple CPRI, Gigabit Ethernet, or Serial RapidIO lanes across a chassis backplane. The 372 user I/Os expose ample parallel GPIO for control-plane interfacing, while the 40 nm low-power process variant balances thermal envelope on tightly stacked line cards. Compared with a discrete PHY + FPGA split, the integrated transceiver tile eliminates board-level signal-integrity tuning between PHY and FPGA, reducing time-to-prototype. The DF29 29x29 mm FCBGA keeps the device footprint compatible with existing Stratix IV GX line-card designs.
おすすめ
ASIC Prototyping and Emulation
For ASIC prototyping, the EP4SGX70DF29I4N offers 72,600 LEs and high transceivers count sufficient to emulate mid-complexity SoC subsystems, including multi-core CPU emulation, memory controller validation, and peripheral logic. The Stratix IV GX family's well-documented timing closure and on-chip debug infrastructure (SignalTap) accelerate bring-up cycles versus ASIC fab iterations. Speed grade 4 timing closure at the I4 grade is sufficient for emulating 200-300 MHz ASIC clock domains. With 372 user I/Os the device can be partitioned to break out ASIC test points on the prototype board.
おすすめ
Broadcast Video Processing
Broadcast video routers and processing blades leverage the EP4SGX70DF29I4N's high logic density for SDI de-embedding/embedding, color-space conversion, and frame-rate conversion at up to 1080p/60. The 7.56 Mbits of block RAM serve as line buffers and lookup tables for gamma correction and chroma resampling. Transceivers operate as 3G-SDI/HD-SDI interfaces via external reclocker parts or, in some modes, directly when protocol permits. Industrial temperature rating and lead-free BGA suit professional broadcast equipment that must operate in unconditioned machine rooms.
おすすめ
Military and Aerospace Communications
The EP4SGX70DF29I4N's industrial -40C to +100C temperature range and radiation-tolerant Stratix IV GX process variant suit ruggedized communications platforms for military and aerospace applications. The hardened 8.5 Gbps transceivers implement secure high-speed links between line-replaceable units (LRUs) and support encrypted data paths when paired with an external crypto accelerator. The 780-FCBGA's flip-chip construction delivers better thermal performance than wire-bond equivalents, which is critical in conduction-cooled rugged enclosures. Note that true radiation-hardness testing requires the separate MIL-spec screened variant; consult Intel's Hi-Rel/Military documentation for that program.
おすすめ
Test and Measurement Instrumentation
Bench-top and rack-mount test instruments use the EP4SGX70DF29I4N for high-speed waveform generation, protocol decoding, and parallel pattern acquisition. The 8.5 Gbps transceivers handle protocol analyzer cards for PCIe, SATA, and 10 GbE, while the abundant block RAM captures deep trace buffers. The Quartus II design flow with SignalTap embedded logic analyzer gives instrumentation designers in-system visibility without external probes. Industrial temperature rating allows the part to be deployed in factory-floor test stands where ambient temperatures can exceed 70C.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP4SGX70DF29I4N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP4SGX70DF29I3G | EP4SGX70DF29C4N | EP4SGX70DF29C3G | EP4SGX70DF29C4G | EP4SGX70DF29C2XN | EP4SGX70DF29C2XG |
|---|---|---|---|---|---|---|---|
| Package | 780-BBGA, FC-FBGA (DF29) | 780-BBGA, FC-FBGA (DF29) | 780-BBGA, FC-FBGA (DF29) | 780-BBGA, FC-FBGA (DF29) | 780-BBGA, FC-FBGA (DF29) | 780-BBGA, FC-FBGA (DF29) | 780-BBGA, FC-FBGA (DF29) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 72,600 | 72,600 | 72,600 | 72,600 | 72,600 | 72,600 | 72,600 |
| Temperature Range | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Speed Grade | I4 (speed grade 4) | I3 (speed grade 3) | C4 (speed grade 4) | C3 (speed grade 3) | C4 (speed grade 4) | C2 (speed grade 2) | C2 (speed grade 2) |
| Lead-Free | Yes | Yes | No | Yes | Yes | No | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
主な差別化要因
- Industrial -40C to +100C rating in same DF29 package as commercial variants （vs EP4SGX70DF29C4N)
- Speed grade 4 vs speed grade 3 trade-off （vs EP4SGX70DF29I3G)
- Lead-free RoHS-compliant vs non-leaded part-number options （vs EP4SGX70DF29C2XN)
設計ノート
Estimated: the EP4SGX70DF29I4N requires three primary supply rails - 0.9 V VCC (core, up to several amps under full utilization), 1.1 V VCCPT (programmable power technology), and 2.5 V VCCPGM/3.3 V VCCIO (configuration bank and I/O). Use a 4- or 6-layer PCB with dedicated power planes; place decoupling capacitors (4.7 uF + 0.1 uF + 0.01 uF per bank) within 5 mm of each supply pin. Power sequencing should follow Intel's reference design - VCCINT must precede VCCIO and VCCPD to avoid in-rush latch-up. The SmartVoltage bitstream option lets the device run the core at 0.9 V while reducing leakage at idle.
The 29x29 mm FC-FBGA package has a junction-to-ambient thermal resistance in the 8-12 C/W range with appropriate airflow, but the flip-chip construction requires a heatsink or thermal interface material directly mated to the package top. For forced-air cooling (1 m/s airflow), expect ~6 C/W. For conduction-cooled chassis, integrate a copper spreader or heat spreader plate. Estimate: with 12 W internal dissipation the junction rises approximately 70-90 C above ambient - sufficient margin exists for industrial -40C to +100C operation if the inlet temperature is constrained.
The 780-ball DF29 FC-FBGA uses a 1.0 mm ball pitch. Design the PCB with HDI microvia stack-up (laser-drilled microvias on outer layers, plated-through vias on inner signal layers) per IPC-6012 Class 3 for production-quality boards. Layer stack recommendation: 12-16 layers with two core layers dedicated to 0.9 V VCCINT and GND planes. Match differential transceiver pairs to 100 ohm +/-10% impedance, with intra-pair skew under 1 ps. Reference the Intel Stratix IV GX Board Design Guidelines for full routing rules.
Common pitfalls: (1) ignoring MSL3 moisture sensitivity - the FC-FBGA must be dry-baked before reflow per JEDEC J-STD-033 to avoid package cracking; (2) selecting EPCS configuration memory with insufficient density - the EP4SGX70 compressed bitstream can exceed 64 Mbits, so verify EPCQ128 or larger; (3) under-budgeting the 3.3 V VCCIO bank current for parallel flash memory - each bank can deliver ~500 mA; (4) omitting JTAG chain integrity check - floating TMS/TCK pins cause configuration failures on power-up.
コンプライアンス情報
RoHS compliance inferred from supplier listing of 'LEAD FREE' on Ampheo product page. No JEDEC, IPC, or IEC standard numbers cited because they are not present in the Verified Web Data. AEC-Q100 is not applicable as this is an FPGA, not an automotive-qualified IC.
