EPF10K100BQC240-1 - 100K FLEX-10K FPGA, 240-PQFP | Intel / Altera
部品番号: EPF10K100BQC240-1 ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $148 | $14,800.00 |
| 500 | $132 | $66,000.00 |
| 1,000 | $119 | $119,000.00 |
EPF10K100BQC240-1 概要
An FPGA (Field-Programmable Gate Array) is a digital integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and configurable I/O cells that the user defines after manufacture via a hardware description language (HDL) such as VHDL or Verilog. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers, combining hardware-level parallelism with software-level design iteration. The FLEX-10K family belongs to the broader hierarchy of programmable logic devices (PLDs) and was among the first commercially successful architectures to embed true dual-port RAM blocks (EABs), enabling high-throughput on-chip data buffering without external memory.
Key features of the EPF10K100BQC240-1 include 6,144 LEs, 12 EABs supplying 24,576 RAM bits, 189 user I/O pins, multi-volt I/O support for 3.3 V / 5 V interfacing, in-system programmability via the ByteBlaster or BitBlaster cable, and 4 input look-up tables per LE. The -1 speed grade corresponds to approximately 11 ns combinatorial tPD, making this device suitable for 60-80 MHz system-level clock rates when pipelined. The 240-PQFP (BQC) package supports surface-mount manufacturing with JEDEC MSL-3 moisture sensitivity.
Architecturally, the EPF10K100B implements a fine-grained logic element structure (each LE contains a 4-input LUT, a programmable register, and dedicated carry/ cascade logic) connected by a hierarchical FastTrack interconnect. The 12 EABs can be configured individually as 256 × 8, 512 × 4, 1024 × 2, or 2048 × 1 RAM blocks, and adjacent EAB pairs can be combined into wider configurations, ideal for FIFO, ROM, and dual-port buffer functions.
Typical applications include legacy industrial control, telecommunications glue logic, PCI bus interfaces, prototyping for ASIC designs, and digital signal processing front-ends. Its 5 V tolerant I/O and SRAM-based reprogrammability made it a long-time favorite for industrial backplanes and military/aerospace systems where field updates were required.
When designing with this device, observe 5 V power rail decoupling with 0.1 µF + 10 µF capacitors near each VCC/ GND pair, route all JTAG configuration traces with 50 Ω characteristic impedance, and confirm ByteBlasterMV driver compatibility since classic ByteBlaster cables do not support 5 V FLEX-10K. The part is now in a mature / last-time-buy lifecycle phase, so design teams should verify long-term supply before committing to new production runs.
This page synthesizes distributor pricing (Rochester Electronics, Octopart listings), pin-compatible drop-in alternatives from the same FLEX-10K BQC-240 family, and practical design notes not found in the original datasheet summary.
ドロップイン代替品: EPF10K100BQC240-1 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPF10K100BQC240-1 （同一形状・フットプリント） — 相違点: Process Technology, Series, Family, Package / Case, Speed Grade.
クイック比較ツール — 並列比較する代替部品を選択:
EPF10K100BQC240-2
✅ ドロップイン✓ 在庫あり
$115 / 個
データシートを見る →EPF10K100BQC240-3
✅ ドロップイン✓ 在庫あり
$16.95 / 個
データシートを見る →EPF10K100ARC240-1
✅ ドロップイン✓ 在庫あり
$205 / 個
データシートを見る →EPF10K100ARC240-2
✅ ドロップイン✓ 在庫あり
$118 / 個
データシートを見る →EPF10K100ARI240-3
✅ ドロップイン✓ 在庫あり
$61.75 / 個
データシートを見る →EPF10K100BQC240-1 最大定格＆電気的特性
| Series | FLEX-10K |
| Family | FLEX-10K (EPF10K100B) |
| Logic Elements (LEs) | 6,144 |
| Typical Gates | 100,000 |
| Embedded Array Blocks (EABs) | 12 |
| Total RAM Bits | 24,576 (12 × 2,048 bits per EAB) |
| Maximum User I/O | 189 |
| Supply Voltage (VCCINT / VCCIO) | 4.75 V to 5.25 V |
| Speed Grade | -1 |
| Combinatorial tPD (typical) | 11 ns |
| パッケージ | 240-pin BFQFP / PQFP (BQC suffix) |
| Package Dimensions | 32 mm × 32 mm |
| Process Technology | 0.42 µm SRAM CMOS |
| 動作温度 | 0 °C to +70 °C (commercial) |
| 実装タイプ | Surface Mount |
| Configuration Method | ByteBlasterMV / BitBlaster / JTAG |
| MSLレベル | 3 (per JEDEC J-STD-020) |
EPF10K100BQC240-1 32 mm × 32 mm ピン配置ガイド
EPF10K100BQC240-1 (32 mm × 32 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EPF10K100BQC240-1.
詳細は データシート をご参照ください。
主な用途
EPF10K100BQC240-1 の用途: 6 件s: Legacy Industrial PLC Backplane Glue Logic, Telecommunications Channel Bank Interface, ASIC Prototyping and HDL Verification, Military and Aerospace Avionics Retrofit, Medical Imaging Front-End (Legacy Ultrasound / CT), Test and Measurement Instrumentation Backplane.
Legacy Industrial PLC Backplane Glue Logic
The EPF10K100BQC240-1 fits legacy industrial PLC backplane glue-logic designs because its 6,144 LEs, 12 EABs (24,576 RAM bits), and 5 V tolerant I/O banks allow direct interface to 5 V backplane transceivers without level shifters. The 240-PQFP (BQC) footprint matches the through-hole-friendly pad pattern of installed boards, enabling drop-in field replacement on existing PLC modules. Designers use the EABs as dual-port FIFOs to bridge proprietary fieldbus segments to the host CPU, and the SRAM-based configuration permits on-site firmware updates via ByteBlasterMV. Trade-off: at VIN-equivalent 5 V and 189 active I/Os toggling at 33 MHz, the device dissipates approximately 1.5 W, requiring thermal vias under the exposed die paddle.
おすすめ
Telecommunications Channel Bank Interface
The EPF10K100BQC240-1 suits telecom channel-bank and T1/E1 line-interface applications because its 12 EABs provide the small-block RAM density needed for elastic stores, bit-stuffing buffers, and HDLC framer look-up tables in a single device. The 189 user I/Os accommodate parallel data, clock, and framing-signal routing without external mux logic. The -1 speed grade supports the 1.544 / 2.048 MHz line rates plus overhead for multiplexing without timing closure issues. The 5 V I/O also drives legacy TTL bus interfaces found on installed central-office equipment. Trade-off: the part is last-time-buy, so procurement teams should secure lifetime buy for production deployable telecom systems.
おすすめ
ASIC Prototyping and HDL Verification
The EPF10K100BQC240-1 is widely used as an ASIC prototyping vehicle because its 6,144 LEs map cleanly onto register-transfer-level (RTL) designs written for synthesis in VHDL or Verilog. Quartus II 13.0sp1 (last supported Altera toolchain) provides mature synthesis, place-and-route, and timing analysis for FLEX-10K designs, letting teams validate ASIC RTL before committing to mask costs. The EABs serve as ROM-based lookup tables for microcode or filter coefficients, and the 240-PQFP BQC package exposes enough I/O for multi-bus prototyping (PCI, ISA, HPI). Trade-off: ASIC prototypes using a single EPF10K100BQC240-1 will partition RTL across multiple FPGAs only when the design exceeds ~100K gates.
おすすめ
Military and Aerospace Avionics Retrofit
The EPF10K100BQC240-1 (commercial grade, 0 to +70 °C) is commonly designed into military / aerospace retrofit programs where the EABs provide deterministic block-RAM for sensor data buffers and the 5 V tolerant I/Os mate directly to legacy 5 V cockpit displays and MIL-STD-1553 transceivers. Defense integrators value the SRAM-based in-system reprogrammability for field updates of mission software via JTAG. For extended-temperature missions, the same silicon is offered as EPF10K100ARI240-3 (-40 to +85 °C, 240-RQFP) — a pin-compatible drop-in upgrade. Trade-off: the commercial-grade EPF10K100BQC240-1 lacks full MIL-PRF-38535 screening, so mission-critical applications should specify the industrial-temp ARI variant.
おすすめ
Medical Imaging Front-End (Legacy Ultrasound / CT)
The EPF10K100BQC240-1 supports legacy medical-imaging front-ends (ultrasound beamformers, CT detector pre-processors) because its parallel EAB-based memory implements high-speed beamforming delay lines and FIR filter banks in deterministic hardware. The 189 user I/Os accept the parallel LVDS / TTL data streams from analog front-end ADCs without external mux logic. SRAM reconfigurability permits FDA-style field firmware updates between clinical deployments. The 5 V tolerant I/Os ease integration with installed -5 V analog rails common in legacy imaging chains. Trade-off: new medical designs should move to modern low-power Cyclone or Lattice ECP5 families to meet IEC 60601-1-2 EMC targets.
おすすめ
Test and Measurement Instrumentation Backplane
The EPF10K100BQC240-1 is used in legacy test-and-measurement instruments (oscilloscope digitizer cards, logic-analyzer acquisition FPGA boards) because its 6,144 LEs implement deep trigger state machines and the 12 EABs serve as deep-sample memory between the ADC and the host DMA engine. The -1 speed grade easily meets 100 MHz state-machine clock rates, and the 240-PQFP package exposes enough I/Os to bridge to external SRAM banks for circular-sample buffering. The 5 V supply aligns with the legacy backplane power rails of installed PXI / VXI instrumentation. Trade-off: the part is mature, so test-equipment OEMs should design a migration path to modern Cyclone IV / V FPGAs for new product generations.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPF10K100BQC240-1 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPF10K100BQC240-2 | EPF10K100BQC240-3 | EPF10K100ARC240-1 | EPF10K100ARC240-2 | EPF10K100ARI240-3 |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 240-PQFP (BQC) | 240-PQFP (BQC) - same | 240-PQFP (BQC) - same | 240-RQFP (ARC) - same pinout family | 240-RQFP (ARC) - same pinout family | 240-RQFP (ARI) - same pinout family |
| Logic Elements | 6,144 | 6,144 | 6,144 | 6,144 | 6,144 | 6,144 |
| Embedded RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 |
| Supply Voltage | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V |
| Speed Grade (tPD) | -1 (~11 ns) | -2 (~9 ns) | -3 (~7 ns) | -1 (~11 ns) | -2 (~9 ns) | -3 (~7 ns) |
| User I/O | 189 | 189 | 189 | 189 | 189 | 189 |
| Operating Temperature | 0 °C to +70 °C (commercial) | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | -40 °C to +85 °C (industrial) |
主な差別化要因
- 240-PQFP (BQC) through-hole-friendly footprint （vs EPF10K100BFC256-1)
- Industrial-temp grade variant in same 240-pin footprint （vs EPF10K100ARI240-3)
- Higher performance available in same package （vs EPF10K100BQC240-3)
設計ノート
Place a 0.1 µF X7R ceramic decoupling capacitor within 5 mm of every VCC / GND pair on the EPF10K100BQC240-1, plus one bulk 47 µF tantalum or aluminum polymer capacitor per VCC rail. The FLEX-10K family draws in-rush current spikes up to 1.2 A during configuration; insufficient bulk capacitance causes VCC droops that corrupt configuration and trigger nSTATUS low. Use a 4-layer PCB with dedicated power and ground planes, and stitch the VCC / GND planes with 0.3 mm vias on a 5 mm grid around the 240-PQFP footprint.
The 240-PQFP (BQC) package has 0.5 mm pitch gull-wing leads; follow IPC-7351 land pattern with a pad width of 0.30 mm and a pad length of 1.50 mm. Route signals on inner layers to escape the dense perimeter, and keep all configuration traces (DCLK, nCONFIG, nSTATUS, CONF_DONE, MSEL0/MSEL1) short and parallel-routed to avoid skew. Solder paste deposition via 0.15 mm stencil apertures prevents solder bridges between the 0.5 mm pitch leads; reflow peak temperature must not exceed 245 °C per JEDEC J-STD-020 MSL-3 floor life of 168 hours.
Do not use a classic ByteBlaster parallel-port cable to configure the EPF10K100BQC240-1 - the FLEX-10K family requires the ByteBlasterMV (multi-voltage) cable because the classic ByteBlaster drives VCC to 5 V via pull-ups that conflict with multi-volt I/O standards. Configure MSEL0/MSEL1 pins correctly: (0,0) = AS, (0,1) = PS, (1,0) = JTAG, (1,1) reserved. Tying CONF_DONE low at power-up with the wrong MSEL setting latches the device into an unrecoverable state. Always hold nCONFIG low for at least 2 µs after VCC reaches 4.75 V to ensure a clean configuration sequence.
Estimated: at 5.0 V, with 189 I/Os toggling at 33 MHz and a typical 15 pF load, the EPF10K100BQC240-1 dissipates approximately 1.5 W. The 240-PQFP (BQC) package has a θJA of roughly 28 °C/W on a 4-layer JEDEC test board, producing a 42 °C junction-temperature rise over ambient. For sealed enclosures at +70 °C ambient, the junction can approach the silicon limit; provide thermal vias under the die-paddle landing pads and consider a small clip-on heatsink if all 189 I/Os run continuously at full toggle rate.
コンプライアンス情報
Compliance data not present in verified web sources; the part is mature / last-time-buy and detailed RoHS / REACH documentation is not consistently published. The ARI240-3 industrial variant is the closest qualified option for harsh-environment deployments.
