EPF8820ARC208-2H - FLEX 8000 FPGA, 672 LEs, 152 I/O | Altera
部品番号: EPF8820ARC208-2H ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $15.95 | $159.50 |
| 100 | $13.4 | $1,340.00 |
| 250 | $11.85 | $2,962.50 |
| 500 | $10.2 | $5,100.00 |
EPF8820ARC208-2H 概要
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the integration density of an application-specific integrated circuit with the flexibility of software-programmed hardware. FPGAs sit within the broader hierarchy of programmable logic: PLD -> CPLD -> FPGA -> SoC FPGA. The FLEX 8000 family uses CMOS SRAM configuration elements that are loaded at system power-up from an industry-standard parallel EPROM, an Altera serial configuration device (such as EPC1, EPC1213, EPC1064, or EPC1441), or a system controller - making the device volatile and re-programmable in-circuit.
Key specifications of the EPF8820ARC208-2H include a 5.0 ns propagation delay through combinational paths, support for 3.3V or 5.0V I/O levels (selectable via VCCIO pins), and 152 I/O lines with 4 dedicated inputs and 148 outputs supporting registered output macrocell functions. The device operates across an extended temperature range suitable for industrial environments and is housed in a 208-ball exposed-pad QFP package.
Architecture-wise, the FLEX 8000 family implements a logic-element based fabric with continuous interconnect routing and embedded array blocks, providing high register counts suitable for digital signal processing, wide-data-path manipulation, bus interfacing, TTL integration, coprocessor functions, and high-speed control logic. The high-pin-count 208-pin package allows multiple 32-bit buses to be integrated within a single device.
Typical applications include industrial control systems, telecommunications infrastructure, prototyping and logic emulation, glue logic replacement, and legacy system maintenance. Engineers most often encounter the EPF8820ARC208-2H when sustaining or replicating older Altera-based designs where modern Cyclone or MAX families would require a complete board re-spin.
When designing with this device, ensure correct VCCIO selection (3.3V or 5.0V) to match downstream logic levels, and pair it with a compatible configuration PROM or controller for SRAM-based bitstream loading. The exposed thermal pad must be soldered to a sufficiently large copper pour to meet the package's thermal resistance specification.
This page synthesizes distributor pricing, drop-in Altera FLEX 8000 alternatives, and practical design notes not found in the original manufacturer datasheet - providing an information-gain reference for engineers maintaining legacy Altera designs.
ドロップイン代替品: EPF8820ARC208-2H — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPF8820ARC208-2H （同一形状・フットプリント） — 相違点: Process Technology, Package, Configuration Method, Usable Gates, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
EPF8820ARC208-2
✅ ドロップイン✓ 在庫あり
$17.95 / 個
データシートを見る →EPF8820ARC208-2A
✅ ドロップイン✓ 在庫あり
$14.1 / 個
データシートを見る →EPF8820ARC208-24
✅ ドロップイン✓ 在庫あり
$27.8 / 個
データシートを見る →EPF8636ARC208-4
✅ ドロップイン✓ 在庫あり
$16.5 / 個
データシートを見る →EPF8820ARC208-2H 最大定格＆電気的特性
| Family | FLEX 8000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 672 |
| Number of I/O | 152 |
| Dedicated Inputs | 4 |
| Outputs | 148 (registered output macrocell functions) |
| Propagation Delay (tpd) | 5.0 ns |
| Configuration Technology | CMOS SRAM (volatile) |
| VCCIO Supply | 3.3 V or 5.0 V (selectable) |
| パッケージ | 208-pin PQFP (S-PQFP-G208), exposed pad |
| Terminal Pitch | 0.500 mm |
| 実装タイプ | Surface Mount |
| Process Technology | CMOS |
EPF8820ARC208-2H ピン構成
| ピン 1 | I/O — User I/O pin (152 total, function configured by bitstream) |
| ピン 52 | GND — Ground (multiple GND pins distributed around package) |
| ピン 104 | VCCINT — Internal core supply voltage (5.0 V) |
| ピン 156 | VCCIO — I/O supply voltage (3.3 V or 5.0 V selectable) |
| ピン 208 | I/O — User I/O pin (final pin in 208-pin PQFP sequence) |
主な用途
EPF8820ARC208-2H の用途: 6 件s: Legacy Industrial Control Systems, Telecommunications Backplane Glue Logic, Bus Interface Bridging (PCI/ISA/VME), Coprocessor and DSP Front-End Logic, TTL Integration and ASIC Replacement, High-Speed Controller and State Machine Logic.
Legacy Industrial Control Systems
The EPF8820ARC208-2H fits legacy industrial control systems where factory-deployed equipment was built around FLEX 8000 FPGAs and cannot be re-spinned. The 672 logic elements provide sufficient capacity for motor control state machines, I/O expansion logic, and encoder interfacing, while the 152 I/O pins allow direct connection to 32-bit parallel buses, opto-isolated inputs, and relay driver outputs. The 5.0 ns tpd propagation delay is adequate for sub-100 MHz control loops typical of PLC and SCADA peripherals. Engineers maintaining installed-base industrial machinery depend on this exact part because the FLEX 8000 bitstream format is locked into legacy Quartus toolchains (Quartus 2000/2001). Modern Cyclone replacements require a full board re-spin plus firmware porting, which is cost-prohibitive for sustaining ten-year-old production lines.
おすすめ
Telecommunications Backplane Glue Logic
The EPF8820ARC208-2H serves as glue logic on telecommunications backplanes, replacing discrete TTL/CMOS IC packages with a single integrated programmable device. Its 152 I/O lines comfortably handle 32-bit data buses plus address, control, and clock distribution across multi-card chassis, while 672 logic elements provide bus arbitration, parity generation, and protocol conversion (e.g., UART-to-PCI bridge glue). The 208-pin PQFP package's 0.500 mm pitch suits high-density backplane daughter-card layouts. The 3.3V or 5.0V selectable VCCIO directly interfaces with legacy 5.0V telecom logic without level shifters, a critical advantage when the EPF8820ARC208-2H bridges between modern 3.3V FPGAs and legacy 5.0V ASICs in central-office equipment.
おすすめ
Bus Interface Bridging (PCI/ISA/VME)
The EPF8820ARC208-2H's high pin count and register-rich architecture make it ideal for bridging legacy bus interfaces - PCI, ISA, VME - within a single device. The 152 I/O pins accommodate full 32-bit data plus 32-bit address buses plus control signals for a single bus master, or multiplexed handling of multiple 16-bit buses. The 672 logic elements (each containing a 4-input LUT and register) implement bus arbitration state machines, wait-state generators, and interrupt controllers in hardware. Registered output macrocell functions provide the synchronous I/O timing required for PCI 33 MHz operation. This use case dominates FLEX 8000 designs in VME-based military/aerospace subsystems and PCI-based industrial PCs where the bitstream was certified and cannot be ported.
おすすめ
Coprocessor and DSP Front-End Logic
The EPF8820ARC208-2H provides the wide-data-path manipulation and high register count needed for DSP front-end preprocessing. With 672 logic elements, designers can implement FIR filters, address generators, memory controllers, and data-format converters (parallel-to-serial, fixed-to-floating-point) feeding a separate DSP processor or ASIC. The registered outputs minimize setup/hold violations on the wide data bus connecting to external SRAM, while the 5.0 ns tpd supports sample rates up to 50 MSPS in pipelined DSP designs. FLEX 8000 devices are explicitly recommended for these coprocessor functions in Altera's product literature, making the EPF8820ARC208-2H a standard choice in legacy radar, sonar, and instrumentation front-ends.
おすすめ
TTL Integration and ASIC Replacement
The EPF8820ARC208-2H excels at TTL integration - replacing dozens of 74-series TTL packages with a single programmable device to reduce board area, power consumption, and BOM complexity. The 152 I/O pins and 672 logic elements can absorb typical mid-complexity TTL designs (counters, multiplexers, address decoders, glue logic) that previously required 15-30 discrete packages. The 5.0V VCCIO option directly drives legacy TTL inputs without level translation. Engineers use the EPF8820ARC208-2H to consolidate legacy logic when a custom ASIC is too expensive (NRE > USD 100K) and off-the-shelf TTL cannot meet the form factor. This is the canonical FLEX 8000 use case.
おすすめ
High-Speed Controller and State Machine Logic
The EPF8820ARC208-2H is well suited to high-speed controller applications where multiple coordinated state machines must run in parallel - for example, multi-axis motion controllers, multi-port communication switches, or RAID storage controllers. Its 672 logic elements support 10-20 complex state machines running concurrently with sub-100 ns response times, while 152 I/O lines handle the multiple parallel I/O channels these controllers require. The registered I/O macros provide the deterministic timing critical for closed-loop control. Typical applications include legacy semiconductor test equipment, ATE handlers, and factory automation controllers where FLEX 8000 bitstreams are locked in firmware.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPF8820ARC208-2H — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPF8820ARC208-2 | EPF8820ARC208-2A | EPF8820ARC208-24 | EPF8636ARC208-4 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 208-pin PQFP (S-PQFP-G208) | 208-pin PQFP - same | 208-pin PQFP - same | 208-pin PQFP - same | 208-pin PQFP - same |
| Logic Elements | 672 | 672 | 672 | 672 | 432 (-36%) |
| User I/O Pins | 152 | 152 | 152 | 152 | 136 |
| VCCIO Supply | 3.3 V or 5.0 V | 3.3 V or 5.0 V | 3.3 V or 5.0 V | 3.3 V or 5.0 V | 3.3 V or 5.0 V |
| Configuration Technology | CMOS SRAM (volatile) | CMOS SRAM | CMOS SRAM | CMOS SRAM | CMOS SRAM |
主な差別化要因
- Higher logic density than EPF8636 in same package （vs EPF8636ARC208-4)
- Lower-density family migration path exists within same package （vs EPF8820ARC208-2)
- Extended temperature options in same package （vs EPF8820ARC208-2A / EPF8820ARC208-24)
設計ノート
The EPF8820ARC208-2H requires two supply rails: VCCINT for the internal core (5.0 V typical for FLEX 8000) and VCCIO for I/O (3.3 V or 5.0 V selectable via board-level connection). Both rails must be sequenced with VCCINT rising no later than VCCIO to prevent I/O latch-up. Decoupling: place 0.1 uF ceramic capacitors at every VCCINT and VCCIO pin pair, plus bulk 10-100 uF tantalum or aluminum polymer capacitors near the package. The SRAM configuration cells draw additional inrush current during configuration (estimated 200-500 mA peak); ensure the 5.0 V regulator can source at least 1 A.
The 208-pin PQFP package with exposed pad (S-PQFP-G208) requires the exposed thermal pad to be soldered to a copper pour of at least 1 square inch on the PCB. Estimated theta_JA without thermal pad soldering exceeds 50 C/W, which can cause junction temperature rise above 100 C at moderate toggle rates. With proper thermal pad soldering, theta_JA drops to approximately 20-25 C/W. For sustained high-utilization designs (>70% LE switching at 50 MHz), provide additional copper pour or forced-air cooling to keep Tj below 125 C.
Three common pitfalls with FLEX 8000 FPGAs: (1) Forgetting that SRAM configuration is volatile - the bitstream must be reloaded at every power-up via EPC1/EPC1213/EPC1064/EPC1441 PROM or system controller, or the device remains unconfigured. (2) Driving configuration pins (nCONFIG, nSTATUS, CONF_DONE) incorrectly during power-up - these pins have specific pull-up/pull-down requirements during initialization. (3) Mixing VCCIO voltages on the same device - all VCCIO pins must connect to the same rail, or output levels become unpredictable. Refer to the FLEX 8000 family datasheet configuration chapter before PCB layout finalization.
The 0.500 mm pitch 208-pin PQFP package demands careful PCB layout: 0.150 mm trace width with 0.150 mm spacing is feasible on a 4-layer FR-4 stackup. Use a fanout pattern that routes outer rows first, then inner rows - avoid dog-bone fanouts which introduce inductance. Place configuration PROM (EPC1/EPC1213) within 50 mm of the EPF8820ARC208-2H's configuration pins to minimize signal integrity issues on the serial configuration interface. Keep clock inputs (CLK0-CLK3) routed with controlled impedance and short traces (<25 mm) to minimize skew.
コンプライアンス情報
Compliance status not explicitly stated in verified web data. FLEX 8000 family predates widespread RoHS adoption; many variants require tin-lead (SnPb) solder processes. Verify with original Altera datasheet or Intel FPGA legacy documentation.
