FS35R12W1T4-T7 - 1200V 35A EasyPACK 1B IGBT Module | Infineon
部品番号: FS35R12W1T4-T7 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $43.75 | $437.50 |
| 100 | $38.9 | $3,890.00 |
| 500 | $34.6 | $17,300.00 |
| 1,000 | $30.25 | $30,250.00 |
FS35R12W1T4-T7 概要
An IGBT module is a power-semiconductor building block that combines multiple insulated-gate bipolar transistors and freewheeling diodes in a single isolated package, enabling compact three-phase inverter, rectifier, or chopper designs. Within the broader power-electronics taxonomy, the IGBT sits between MOSFETs (faster, lower voltage) and thyristors (higher power, slower), and is the workhorse device for medium-power motor drives, solar inverters, and UPS systems operating from a few kW to over 100 kW.
Key specifications include a collector-emitter voltage rating of 1200 V, a nominal collector current of 35 A (with 65 A pulsed capability per datasheet), a sixpack (three-phase full-bridge) topology, and an integrated brake chopper IGBT/diode pair. The module is part of the EasyPACK 1B family, sharing the same mechanical footprint and pin-out with related EasyPACK devices, which simplifies PCB and heatsink design across product variants.
The TRENCHSTOP IGBT4 chip technology combines a trench gate cell with a field-stop layer, achieving low VCE(sat) and reduced switching losses compared to previous-generation NPT IGBTs. The Emitter Controlled 4 diode co-packaged with each switch reduces reverse-recovery losses and improves EMC. An NTC thermistor embedded in the module substrate allows real-time junction-temperature monitoring for thermal protection.
Typical applications include low-to-medium power industrial motor drives, servo amplifiers, solar string inverters, UPS systems, and welding equipment. The 1200 V class makes it suitable for 400 V / 480 V AC bus systems and 600 V / 800 V DC-link applications. The EasyPACK 1B platform also enables paralleling multiple modules for higher current.
When designing with the FS35R12W1T4-T7, ensure proper thermal management: the module dissipates significant power (over 200 W possible) and requires a thermal interface material, a suitable heatsink, and often forced-air cooling. Gate-driver design must respect the IGBT4 short-circuit ruggedness and provide sufficient negative gate-emitter voltage during turn-off to prevent spurious turn-on caused by the Miller effect.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer datasheet alone, helping engineers evaluate sourcing options and second-source strategies.
ドロップイン代替品: FS35R12W1T4-T7 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: FS35R12W1T4-T7 （同一形状・フットプリント） — 相違点: Integrated NTC, Mounting Type, Topology.
クイック比較ツール — 並列比較する代替部品を選択:
FS35R12W1T4
✅ ドロップイン✓ 在庫あり
$22.8 / 個
データシートを見る →FS35R12W1T7
✅ ドロップイン📋 参考代替品（カタログ未掲載）
FS35R12W1T4B11BOMA1
✅ ドロップイン📋 参考代替品（カタログ未掲載）
FS35R12W1T4_B11
✅ ドロップイン📋 参考代替品（カタログ未掲載）
FS35R12W2T4
✅ ドロップイン📋 参考代替品（カタログ未掲載）
FS35R12W1T4-T7 最大定格＆電気的特性
| トポロジー | Sixpack (three-phase inverter) + brake chopper |
| Collector-Emitter Voltage (Vces) | 1200 V |
| Nominal Collector Current (Ic nom) | 35 A |
| Pulsed Collector Current | 65 A |
| Total Power Dissipation | 225 W |
| IGBT Generation | TRENCHSTOP IGBT4 |
| Diode Generation | Emitter Controlled 4 (EC4) |
| Integrated NTC | Yes (temperature monitoring) |
| Package Family | EasyPACK 1B |
| Contact Technology | Solder (T7 variant) |
| 実装タイプ | Chassis Mount |
| Module Configuration | 6 IGBTs + 6 diodes + brake chopper + NTC |
| RoHS Compliance | Compliant |
| Application Class | Industrial / Motor Drive / Solar |
| Datasheet Source | Infineon manufacturer datasheet |
FS35R12W1T4-T7 easypack 1b ピン配置ガイド
FS35R12W1T4-T7 (easypack 1b パッケージ) のピン配置。 このパワーデバイスは、ゲート、ドレイン、ソース端子を備えています。非極性パッケージの場合、正確なピン1の向きとフットプリントの詳細については、メーカーのデータシートを参照してください。主な用途には、電源設計、モータ駆動、負荷スイッチングがあります。
詳細なピン配置データはありません: FS35R12W1T4-T7.
詳細は データシート をご参照ください。
Forward Bias 安全動作領域 (Vces vs Ic)
主な用途
FS35R12W1T4-T7 の用途: 7 件s: Industrial Motor Drives, Solar String Inverters, Uninterruptible Power Supplies (UPS), Servo Amplifiers, Welding Power Supplies, EV Charging Stations, Induction Heating.
Industrial Motor Drives
The FS35R12W1T4-T7 is purpose-built for 400 V / 480 V three-phase AC motor drives in industrial automation. Its 1200 V Vces rating easily handles 690 V AC rectified bus voltages, while the 35 A nominal current supports motors from 11 kW to 22 kW depending on switching frequency and load profile. The integrated sixpack topology eliminates the need for discrete IGBTs and matching freewheeling diodes, reducing BOM count and assembly time. The on-board NTC thermistor enables real-time thermal monitoring, critical for variable-frequency drives operating near rated current in enclosed cabinets.
おすすめ
Solar String Inverters
In solar string inverter applications, the FS35R12W1T4-T7 handles the DC-to-AC conversion stage with high efficiency thanks to its TRENCHSTOP IGBT4 low-VCE(sat) characteristics. The 1200 V class accommodates typical 1000 V DC maximum input strings with proper margin. Sixpack topology suits three-phase string inverter outputs feeding 400 V AC grids. The brake chopper IGBT and diode pair are useful for dissipating residual energy from the DC bus during grid fault ride-through events, protecting downstream capacitors.
おすすめ
Uninterruptible Power Supplies (UPS)
Online UPS systems use IGBT modules like the FS35R12W1T4-T7 for both the rectifier and inverter stages, providing bidirectional power flow between battery banks and the AC load. The 1200 V rating supports 600-800 V DC battery configurations common in modern lithium-ion UPS installations. Fast switching and low losses from the IGBT4 technology translate directly to higher UPS efficiency, which is critical for reducing operating cost in data-center deployments where every percentage point of efficiency matters.
おすすめ
Servo Amplifiers
High-performance servo drives for CNC machines, robotics, and precision automation rely on IGBT modules like the FS35R12W1T4-T7 to deliver clean, fast current control to brushless servo motors. The module's 35 A rating suits mid-power servo axes (5-15 kW), while the integrated brake chopper handles regenerative braking energy during rapid deceleration of inertial loads. The NTC thermistor feedback enables precise thermal modeling for derating during peak-duty cycles typical in servo applications.
おすすめ
Welding Power Supplies
Inverter-based welding machines use IGBT modules to switch high currents at high frequency, achieving smaller transformer size and better arc control than legacy 50/60 Hz designs. The FS35R12W1T4-T7's 35 A continuous and 65 A pulsed current ratings suit mid-range MIG/TIG welders. The 1200 V rating tolerates the inductive kickback from the welding transformer secondary, while the EC4 diodes minimize reverse-recovery losses that would otherwise heat the module during arc strikes.
おすすめ
EV Charging Stations
Level 3 DC fast chargers for electric vehicles use IGBT modules in the AC-DC and DC-DC power stages. The FS35R12W1T4-T7, with its 1200 V class rating, suits three-phase 400 V AC input rectification and the high-voltage DC bus feeding the vehicle's battery. The EasyPACK 1B form factor is widely accepted in charging station designs for its robust thermal performance and proven field reliability. Module-level monitoring via NTC enables predictive maintenance in commercial charging networks.
おすすめ
Induction Heating
Industrial induction heating systems use IGBT modules at medium switching frequencies (20-100 kHz) to drive resonant tank circuits coupling energy into the work piece. The FS35R12W1T4-T7 supports lower-frequency heating applications such as forging and surface hardening. The integrated brake chopper can dissipate excess tank energy during load impedance changes, while the NTC thermistor provides critical protection against the high thermal stresses inherent to induction heating coils.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: FS35R12W1T4-T7 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | FS35R12W1T4 | FS35R12W1T7 | FS35R12W1T4B11BOMA1 |
|---|---|---|---|---|
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Package | EasyPACK 1B (solder pins) | EasyPACK 1B - same | EasyPACK 1B - same | EasyPACK 1B (PressFIT) |
| Topology | Sixpack + brake chopper | Sixpack + brake chopper | Sixpack + brake chopper | Sixpack + brake chopper |
| Collector-Emitter Voltage (Vces) | 1200 V | 1200 V | 1200 V | 1200 V |
| Nominal Collector Current | 35 A | 35 A | 35 A | 35 A |
| Pulsed Collector Current | 65 A | 65 A | 65 A | 65 A |
| IGBT Chip Generation | TRENCHSTOP IGBT4 | TRENCHSTOP IGBT4 | TRENCHSTOP IGBT7 (newer) | TRENCHSTOP IGBT4 |
| Contact Technology | Solder pins | Solder pins | Solder pins | PressFIT |
| Integrated NTC | Yes | Yes | Yes | Yes |
主な差別化要因
- Integrated sixpack topology with brake chopper （vs Discrete IGBT + diode approach)
- On-board NTC thermistor for direct junction monitoring （vs Modules without integrated NTC)
- EasyPACK 1B family compatibility （vs Vendor-specific proprietary packages)
- TRENCHSTOP IGBT4 + EC4 diode co-optimization （vs Older NPT IGBT + standard diode modules)
設計ノート
Estimated: at full-load operation of 35 A per switch with VCE(sat) of approximately 2.0 V, total conduction loss per switch is ~70 W. With six switches operating simultaneously in a sixpack configuration, total module dissipation approaches 400-500 W during peak loads. Mount the EasyPACK 1B module to a heatsink with thermal compound and ensure forced-air cooling with at least 2 m/s airflow across the baseplate to maintain junction temperature below 125 C. Always design the heatsink for the worst-case continuous operating current, not the nominal rating.
The EasyPACK 1B module is designed for chassis mounting, not direct PCB mounting. The power terminals are screw or solder connections to busbars or PCB power planes. Gate-emitter auxiliary signals should be routed via a small driver PCB or twisted-pair wiring, kept as short as possible to minimize gate-loop inductance. Place the gate-driver IC within 50 mm of the module gate terminals and use a low-impedance Kelvin emitter connection to avoid parasitic turn-on from the Miller effect.
Common pitfalls when designing with the FS35R12W1T4-T7 include: (1) insufficient gate-drive negative voltage during turn-off causing parasitic turn-on at high dV/dt; (2) neglecting DC-link snubber capacitors, leading to overvoltage transients above the 1200 V Vces rating during switching; (3) ignoring the NTC thermistor for thermal protection, which can result in thermal runaway under sustained overload; (4) undersizing the gate resistor, causing excessive ringing and EMI; (5) failing to apply thermal compound properly between module baseplate and heatsink, dramatically reducing heat transfer.
Power loop inductance is critical for IGBT switching performance. Minimize the physical area of the DC-link capacitor-to-module power terminal loop to reduce switching transients. Use laminated busbars with tightly coupled positive and negative conductors rather than discrete cabling. Keep gate-driver and signal wiring orthogonal to power loop current paths to minimize capacitive coupling. Source: Infineon EasyPACK 1B application notes.
コンプライアンス情報
RoHS and REACH compliant per Infineon product page. Not AEC-Q100 qualified (industrial-grade power module, not automotive-qualified). Lead-free soldering compatible. Halogen-free status not explicitly stated in verified web data - set to unknown.
