IW612HN-A1CK - Wi-Fi 6 + BT 5.4 + 802.15.4 Tri-Radio IC | NXP
部品番号: IW612HN-A1CK ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $9.85 | $9.85 |
| 10 | $8.95 | $89.50 |
| 100 | $7.98 | $798.00 |
| 500 | $7.15 | $3,575.00 |
| 1,000 | $6.52 | $6,520.00 |
IW612HN-A1CK 概要
A tri-radio connectivity IC combines multiple wireless protocols on one silicon die: the Wi-Fi radio handles high-throughput data transfer on 2.4 GHz and 5 GHz bands, the Bluetooth radio covers classic Bluetooth and BLE for device pairing and mobile interaction, and the 802.15.4 radio provides Thread and Zigbee mesh networking for IoT device ecosystems. Within the system hierarchy, the IW612 sits at the physical/MAC layer of a connectivity stack, paired with a host MCU or applications processor over SDIO and SPI interfaces, reducing bill-of-materials count versus discrete single-protocol chips.
Key features include concurrent operation of all three radios, 1x1 dual-band Wi-Fi 6 for improved throughput and lower latency in congested networks, Bluetooth LE 5.4 for the latest long-range and extended-advertising features, and native 802.15.4 support for Thread and Zigbee. This integration yields substantially lower system cost and reduced PCB area compared to a Wi-Fi chip plus a separate 802.15.4/BLE combo device.
Typical applications include smart home hubs and end nodes, smart appliances, smart energy products, industrial automation equipment, and IoT gateways that must bridge Wi-Fi backhaul with Thread/Zigbee mesh networks.
A key design consideration is the exposed-pad VFQFN package: the thermal and ground pad must be soldered to a well-grounded PCB land pattern with a via array for RF performance and heat dissipation.
This page synthesizes distributor availability data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: IW612HN-A1CK — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: IW612HN-A1CK （同一形状・フットプリント） — 相違点: Bluetooth Version, Frequency Bands, Wi-Fi Standard.
クイック比較ツール — 並列比較する代替部品を選択:
IW612HN/A1IK
✅ ドロップイン📋 参考代替品（カタログ未掲載）
IW612HN
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →IW412
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
IW612HN-A1CK 仕様
| Product Type | Tri-radio wireless connectivity single-chip |
| Wi-Fi Standard | Wi-Fi 6 (802.11ax), 1x1 dual-band |
| Frequency Bands | 2.4 GHz and 5 GHz |
| Bluetooth Version | Bluetooth/Bluetooth Low Energy 5.4 |
| 802.15.4 Support | Yes (Thread, Zigbee) |
| Protocols | 802.15.4, Bluetooth, Wi-Fi 802.11ax |
| パッケージ | 116-VFQFN Dual Rows, Exposed Pad |
| ピン数 | 116 |
| 実装タイプ | Surface Mount |
| Device Type | RF Transceiver |
| Applications | Smart home, smart appliances, smart energy, industrial automation, gateways |
| Packaging Type | Tray |
IW612HN-A1CK 116-vfqfn dual rows, exposed pad ピン配置ガイド
IW612HN-A1CK (116-vfqfn dual rows, exposed pad パッケージ) のピン配置。 ピン番号、機能、接続図はメーカーのデータシートで定義されています。正確なフットプリントとはんだ付けのガイドラインについては、データシートを参照してください。
詳細なピン配置データはありません: IW612HN-A1CK.
詳細は データシート をご参照ください。
主な用途
IW612HN-A1CK の用途: 6 件s: Smart Home Hubs and Gateways, Industrial Automation, Smart Appliances, Smart Energy, IoT Wireless Gateways, Smart Devices and Accessories.
Smart Home Hubs and Gateways
The IW612HN/A1CK is purpose-built for smart home hubs that must simultaneously bridge Wi-Fi 6 backhaul to the cloud and Thread/Zigbee mesh networks for battery-powered end devices. The 1x1 dual-band Wi-Fi 6 radio on 2.4/5 GHz delivers improved throughput and latency in congested home networks, while the 802.15.4 radio natively runs Thread and Zigbee protocols without a second IC. Bluetooth LE 5.4 supports smartphone-based commissioning. According to NXP, this tri-radio integration yields substantially lower system cost and PCB area than a Wi-Fi chip plus a separate 802.15.4/BLE combo device, and all three radios can operate concurrently.
おすすめ
Industrial Automation
Industrial automation equipment increasingly requires both robust mesh sensor networking and high-bandwidth connectivity to factory IT infrastructure. The IW612HN/A1CK serves both roles from one 116-VFQFN chip: 802.15.4/Thread handles low-power deterministic sensor loops, while dual-band Wi-Fi 6 provides resilient 2.4/5 GHz uplink with OFDMA that performs well in RF-noisy factory floors. NXP lists industrial automation as a primary target application, and the industrial temperature ordering variant supports harsh-environment deployments. Integrating three radios on one die reduces board space inside dense control panels and cuts qualification effort to a single wireless module design.
おすすめ
Smart Appliances
Smart refrigerators, laundry machines, and HVAC equipment need Wi-Fi for cloud control apps plus Thread or Zigbee integration into whole-home automation ecosystems. The IW612HN/A1CK covers both with a single chip: the 1x1 Wi-Fi 6 radio is sufficient for appliance telemetry and OTA firmware updates, while the 802.15.4 radio lets the appliance join Matter-over-Thread networks that are becoming standard in smart homes. Bluetooth LE 5.4 enables near-field setup without typing Wi-Fi credentials. NXP explicitly names smart appliances as a target market, citing substantially low system cost from the enhanced integration.
おすすめ
Smart Energy
Smart energy infrastructure - energy management gateways, solar inverters, home battery monitors - benefits from the IW612HN/A1CK's protocol mix. Zigbee and Thread over 802.15.4 are the dominant mesh protocols for smart-meter and home-energy-display ecosystems, while Wi-Fi 6 on 2.4/5 GHz reports consumption data to utility clouds. NXP identifies smart energy as a key application for the IW612. The single-chip tri-radio approach reduces the bill of materials in cost-sensitive energy products, and dual-band Wi-Fi 6 helps maintain connectivity as 2.4 GHz congestion grows in multi-dwelling installations. BLE 5.4 supports installer commissioning apps.
おすすめ
IoT Wireless Gateways
IoT gateways aggregate downstream low-power mesh networks and translate them to high-bandwidth backhaul - exactly the concurrent multi-protocol workload the IW612HN/A1CK was designed for. The 802.15.4 radio runs border-router-grade Thread or Zigbee networks with dozens of end devices, the 1x1 dual-band Wi-Fi 6 radio provides client or AP-mode backhaul, and Bluetooth LE 5.4 handles local provisioning and diagnostics. NXP's IW612 product page lists gateways explicitly. Integrating three radios on one die in the 116-VFQFN package substantially reduces gateway BOM cost versus a Wi-Fi module plus a separate 802.15.4/BLE module.
おすすめ
Smart Devices and Accessories
Connected accessories such as security cameras, smart locks, and voice assistants need seamless user onboarding over Bluetooth LE plus always-on Wi-Fi and, increasingly, Thread membership for Matter ecosystems. The IW612HN/A1CK delivers all three radios concurrently from one chip, with Wi-Fi 6 offering lower latency and better coexistence in crowded RF environments. NXP names smart devices and accessories among its core IW612 applications. For space-constrained accessory PCBs, the high integration reduces component count and antenna-switching complexity, and the exposed-pad VFQFN package supports compact two-layer-adjacent ground references for the RF sections.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: IW612HN-A1CK — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | IW612HN/A1IK | IW612HN | IW412 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Wi-Fi | 2.4/5 GHz dual-band 1x1 Wi-Fi 6 (802.11ax) | 2.4/5 GHz dual-band 1x1 Wi-Fi 6 | 2.4/5 GHz dual-band 1x1 Wi-Fi 6 | 2.4/5 GHz dual-band 1x1 Wi-Fi 6 |
| Bluetooth | Bluetooth/Bluetooth LE 5.4 | Bluetooth/Bluetooth LE 5.4 | Bluetooth/Bluetooth LE 5.4 | Bluetooth/Bluetooth LE 5.4 |
| 802.15.4 (Thread/Zigbee) | Yes | Yes | Yes | No |
| Radio Count | Tri-radio (3) | Tri-radio (3) | Tri-radio (3) | Dual-radio (2) |
| Primary Applications | Smart home, gateways, industrial automation | Same as IW612HN/A1CK | Same as IW612HN/A1CK | Wi-Fi/BLE-only IoT devices |
主な差別化要因
- True tri-radio integration on one die （vs IW412)
- Wi-Fi 6 (802.11ax) vs Wi-Fi 5 predecessors （vs 88W8987)
- Bluetooth LE 5.4 feature set （vs 88W8987)
設計ノート
The 116-VFQFN exposed pad is the primary RF and thermal ground reference. Solder it to a continuous ground plane using a via array (multiple vias within the pad footprint) per the NXP datasheet layout guidelines. Inadequate exposed-pad soldering is the most common cause of poor RF performance and intermittent 802.15.4 range in prototype builds of QFN-packaged connectivity ICs. Inspect solder coverage with X-ray on first-article builds.
Because the IW612 operates three radios concurrently, RF coexistence between Wi-Fi, Bluetooth, and 802.15.4 must be planned: follow the NXP reference design for antenna selection/placement and coexistence signaling toward the host. Verify host driver support (SDIO/SPI firmware binaries from NXP) early in the project - the tri-radio MAC requires the correct NXP-supplied firmware image, and mismatched firmware is a frequent bring-up failure.
Keep the crystal, RF matching network, and decoupling capacitors within a few millimeters of the IW612 pins, referencing a solid ground plane. Route the SDIO/SPI host interface away from antenna feed lines to avoid digital noise coupling into 2.4 GHz/5 GHz receiver paths. Follow NXP's module reference designs (e.g., IW612-based module designs from partners such as Murata, TDK, Fanstel, and Akustis listed by distributors) as layout templates.
コンプライアンス情報
Compliance data not present in captured web data. Obtain RoHS/REACH certificates from the NXP product page at nxp.com/part/IW612HN.