KSZ9031RNXVB-VAO - Gigabit Ethernet RGMII Transceiver AEC-Q100 | Microchip
部品番号: KSZ9031RNXVB-VAO ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $8.9 | $8.90 |
| 10 | $8.01 | $80.10 |
| 100 | $7.12 | $712.00 |
| 500 | $6.38 | $3,190.00 |
| 1,000 | $5.65 | $5,650.00 |
KSZ9031RNXVB-VAO 概要
A Gigabit Ethernet transceiver is a physical-layer device that connects a MAC (Media Access Controller) to the copper medium via twisted-pair magnetics, encoding/decoding 1000BASE-T/100BASE-TX/10BASE-T signaling and providing PCS, PMA, and PHY functions defined by IEEE 802.3 clauses 22-40. The KSZ9031 family belongs to the Ethernet PHY hierarchy (Ethernet transceiver -> physical layer device -> network interface IC) and supports GMII/MII or RGMII MAC-side interfaces depending on sub-variant, sitting between the SoC MAC and the RJ45/Magnetics front-end.
Key features include 3.3V/2.5V/1.8V tolerant MAC-side I/Os, on-chip termination resistors, AEC-Q100 Grade 2 qualification (-40C to +105C), Energy-Efficient Ethernet (EEE) support per IEEE 802.3az, Wake-on-LAN, auto-negotiation with HP Auto-MDIX, and remote/local loopback for diagnostic verification of both analog and digital data paths. The WQFN wettable-flank package enables automated optical inspection (AOI) of solder joints - critical for automotive PCB assembly.
Architecturally, the device integrates a DSP-based baseband processor, a low-noise analog front-end with on-chip LDO regulators, and an RGMII interface block that supports RGMII-ID (internal delay on TX, RX, or both). It interfaces directly to a single 3.3V supply (with internal regulation generating 1.2V core rails), reducing external BOM. Typical power consumption is approximately 450 mW active at 1 Gbps and 80 mW in EEE LPI state.
Typical applications include automotive infotainment Ethernet, ADAS camera links, in-vehicle networking backbones, industrial Ethernet switches, and any design requiring a 1 Gbps RGMII PHY qualified for harsh environments. Compared to consumer-grade KSZ9031RNX (standard QFN-48), the -VAO part uses wettable-flank leads for solder joint inspection.
When designing in, route the 125 MHz RGMII clock and data signals with matched impedance (typically 50 ohm SE) and length-matching to within the RGMII v2.0 spec (typically 50 mil tolerance on the PCB). Use a 25 MHz external crystal or 125 MHz LVCMOS reference; configure strap pins or MDIO registers for desired clock delay mode.
This page synthesizes distributor pricing, drop-in alternatives from the same KSZ9031 family and across brands, and practical PCB layout notes not always summarized in the manufacturer datasheet.
ドロップイン代替品: KSZ9031RNXVB-VAO — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: KSZ9031RNXVB-VAO （同一形状・フットプリント） — 相違点: Package, Cable Type, Product Type, Data Rate, MAC Interface.
クイック比較ツール — 並列比較する代替部品を選択:
KSZ9031RNXUB-VAO
✅ ドロップイン✓ 在庫あり
$6.1 / 個
データシートを見る →KSZ9031RNXVC-VAO
✅ ドロップイン📋 参考代替品（カタログ未掲載）
KSZ9031RNXVB-VAO-TR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
KSZ9031RNXCC
✅ ドロップイン✓ 在庫あり
$4.05 / 個
データシートを見る →KSZ9031RNXIC
✅ ドロップイン✓ 在庫あり
$4.35 / 個
データシートを見る →RTL8211F-CG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
KSZ9031RNXVB-VAO 仕様
| Product Type | Ethernet Transceiver (PHY) |
| データレート | 10/100/1000 Mbps |
| Standards Compliance | IEEE 802.3 10BASE-T, 100BASE-TX, 1000BASE-T |
| MAC-Side Interface | RGMII (Version 2.0 compliant, on-chip delay) |
| 電源電圧 | 3.3 V (single supply; internal LDO for core) |
| MAC I/O Voltage Tolerance | 3.3 V / 2.5 V / 1.8 V |
| パッケージ | 48-pin WQFN (wettable-flank) |
| 動作温度 | -40C to +105C (AEC-Q100 Grade 2) |
| Automotive Qualification | AEC-Q100 qualified (VAO suffix) |
| Energy-Efficient Ethernet | IEEE 802.3az supported |
| Auto-Negotiation | Yes (with HP Auto-MDIX) |
| Wake-on-LAN | Supported |
| Loopback Modes | Remote and local loopback |
| Reference Clock | 25 MHz crystal or 125 MHz LVCMOS reference |
| Typical Active Power | 450 mW at 1 Gbps |
| 実装タイプ | Surface Mount |
| Lead-Free / RoHS | Yes (lead-free) |
KSZ9031RNXVB-VAO 48-pin wqfn (wettable-flank) ピン配置ガイド
KSZ9031RNXVB-VAO (48-pin wqfn (wettable-flank) パッケージ) のピン配置。 ピン番号、機能、接続図はメーカーのデータシートで定義されています。正確なフットプリントとはんだ付けのガイドラインについては、データシートを参照してください。
詳細なピン配置データはありません: KSZ9031RNXVB-VAO.
詳細は データシート をご参照ください。
主な用途
KSZ9031RNXVB-VAO の用途: 6 件s: Automotive Infotainment Ethernet Backbone, ADAS Camera Ethernet Links, Industrial Gigabit Ethernet Switches, In-Vehicle Networking Gateway, Automotive Telematics and V2X Modems, Harsh-Environment IoT Edge Gateways.
Automotive Infotainment Ethernet Backbone
The KSZ9031RNXVB-VAO is engineered for automotive infotainment networks where it serves as the physical-layer interface between the head-unit SoC MAC and the vehicle's Ethernet backbone. Its 1000BASE-T capability supports high-bandwidth audio/video streams and dual-display infotainment traffic, while RGMII v2.0 with on-chip delay eliminates PCB delay lines and reduces layout complexity. AEC-Q100 Grade 2 qualification and -40C to +105C operation handle under-dash thermal stress, and the wettable-flank WQFN package enables automated optical inspection of solder joints on the high-vibration automotive PCB. Typical active power of 450 mW at 1 Gbps is acceptable for head-unit thermal budgets.
おすすめ
ADAS Camera Ethernet Links
In advanced driver-assistance systems (ADAS), the KSZ9031RNXVB-VAO provides the 1 Gbps physical link between surround-view, front-camera, and rear-camera serializers and the central ADAS ECU. Its full-duplex 1000BASE-T operation handles uncompressed 2 MP-8 MP camera payloads, while the RGMII v2.0 interface integrates seamlessly with automotive SoCs such as NXP S32 and Renesas R-Car. AEC-Q100 Grade 2 qualification is essential for under-hood and behind-bumper mounting, where temperatures regularly exceed 85C. The on-chip HP Auto-MDIX eliminates crossover-cable concerns during service.
おすすめ
Industrial Gigabit Ethernet Switches
The KSZ9031RNXVB-VAO serves as the uplink or stacking PHY in industrial managed Ethernet switches, providing a robust 1 Gbps copper port with extended-temperature operation. Its 3.3V/2.5V/1.8V tolerant MAC I/Os simplify interfacing to industrial switch ASICs and FPGAs across multiple voltage domains. Energy-Efficient Ethernet (IEEE 802.3az) reduces power consumption by ~80% during idle periods - critical for fanless industrial enclosures. Wake-on-LAN enables remote management of distributed I/O nodes across factory floors.
おすすめ
In-Vehicle Networking Gateway
The KSZ9031RNXVB-VAO functions as a port PHY on central gateways that bridge automotive Ethernet to CAN, LIN, and FlexRay networks. Its AEC-Q100 Grade 2 qualification and wettable-flank WQFN package meet the reliability and inspectability requirements of central gateway PCBs. RGMII v2.0 with on-chip delay simplifies timing closure against the gateway SoC MAC, while on-chip termination resistors reduce external BOM count. Diagnostic loopback modes support production-line PHY testing without external equipment.
おすすめ
Automotive Telematics and V2X Modems
The KSZ9031RNXVB-VAO provides the wired Ethernet backhaul for telematics control units and V2X (vehicle-to-everything) modems that require a reliable, automotive-qualified PHY. Its extended -40C to +105C operating range covers under-dash and roof-mounted telematics locations, and the wettable-flank package supports high-reliability solder joints required for vibration-prone chassis mounting. RGMII v2.0 interface enables direct connection to cellular modem SoCs without external delay tuning, reducing BOM and PCB area in space-constrained TCU housings.
おすすめ
Harsh-Environment IoT Edge Gateways
The KSZ9031RNXVB-VAO is well suited for ruggedized IoT edge gateways deployed in outdoor enclosures, factory floors, and railway signaling where temperature swings exceed commercial-grade limits. Its AEC-Q100 Grade 2 qualification, -40C to +105C operation, and wettable-flank package provide margin beyond typical industrial -40C to +85C requirements. The integrated HP Auto-MDIX and Energy-Efficient Ethernet features simplify field installation and reduce operational power in remote, solar-powered deployments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: KSZ9031RNXVB-VAO — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | KSZ9031RNXUB-VAO | KSZ9031RNXVC-VAO | KSZ9031RNXCC | KSZ9031RNXIC | RTL8211F-CG |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Realtek |
| Package | 48-pin WQFN (wettable-flank) | 48-pin WQFN (wettable-flank) - same | 48-pin WQFN (wettable-flank) - same | 48-pin QFN - same footprint, no wettable flanks | 48-pin QFN - same footprint | 48-pin QFN - same footprint, no wettable flanks |
| MAC Interface | RGMII v2.0 (on-chip delay) | RGMII v2.0 (on-chip delay) | RGMII v2.0 (on-chip delay) | RGMII v2.0 (on-chip delay) | GMII/MII - NOT RGMII | RGMII (external delay typically required) |
| Automotive Grade (AEC-Q100) | Yes (Grade 2) | Yes (Grade 2) | Yes (Grade 2) | No (commercial) | No (commercial) | Yes (AEC-Q100) |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +85C (AEC-Q100 variant) |
| Wettable-Flank Leads | Yes | Yes | Yes | No | No | No |
| Energy-Efficient Ethernet (IEEE 802.3az) | Yes | Yes | Yes | Yes | Yes | Yes |
| Typical Active Power (1 Gbps) | ~450 mW | ~450 mW | ~430 mW | ~450 mW | ~450 mW | ~400 mW |
| Source | web_data | web_data | web_data | web_data | web_data | web_data |
主な差別化要因
- AEC-Q100 Grade 2 qualification with wettable-flank WQFN package （vs KSZ9031RNXCC)
- Native RGMII v2.0 on-chip TX/RX delay with programming options （vs RTL8211F-CG)
- Newer silicon revision with improved power and EEE performance （vs KSZ9031RNXUB-VAO)
設計ノート
Route the 125 MHz RGMII clock and the four-bit TX/RX data groups with controlled impedance (50 ohm SE typical) and length-match to within the RGMII v2.0 specification (typically 50 mil tolerance). The on-chip delay option of the VB variant can compensate for moderate PCB skew, but excessive mismatch still risks link errors. Keep the MDI differential pairs (TRD0+/- through TRD3+/- as defined in the datasheet) tightly coupled and length-matched to meet 1000BASE-T return-loss requirements.
Place the KSZ9031RNXVB-VAO's decoupling capacitors (typically 0.1 uF and 10 uF bulk) within 100 mil of the 3.3V supply pins. The exposed thermal pad (EP) of the 48-pin WQFN MUST be soldered to a contiguous ground plane with thermal vias (typically 9-13 vias in a 3x3 or 4x4 grid) for heat dissipation and low-inductance ground return. For automotive designs, ensure the wettable flanks are visible at the package edges to support AOI inspection.
Estimate: at 1 Gbps, total link budget must absorb roughly 14 dB insertion loss from PCB traces, connectors, and 100 m of Cat5e cable. Use a center-tap configuration on the Ethernet magnetics with the PHY's integrated biasing; verify magnetics selection meets IEEE 802.3 isolation and return-loss specs. For MDI return-loss compliance above 30 MHz, consider a common-mode choke and ESD protection array (e.g., integrated RJ45 with magnetics) at the connector.
Do NOT substitute the commercial-grade KSZ9031RNX for the -VAO in AEC-Q100 designs - the commercial part lacks automotive qualification and uses a non-wettable QFN. Verify strap-pin configuration (LED, MODE, REF_CLK selection) against the datasheet before PCB layout, because strap pin states are sampled at reset and incorrect settings can prevent link-up. Always source the 25 MHz crystal or 125 MHz reference from a low-jitter, automotive-grade supplier, since reference-clock phase noise directly degrades MDI transmit performance.
Estimate: at 1 Gbps active and 3.3V supply, the KSZ9031RNXVB-VAO draws approximately 136 mA (450 mW / 3.3V). In Energy-Efficient Ethernet (IEEE 802.3az) LPI state, current drops to roughly 25 mA. The internal LDO regulators generate the 1.2V core rail from the 3.3V supply - no external 1.2V rail is required, simplifying power architecture. For power-budget analysis in head-unit designs, include a 20% margin for transient link-up bursts.
コンプライアンス情報
AEC-Q100 Grade 2 automotive qualified per Microchip product page. RoHS and REACH compliant per third-party distributor data (etei.com). Lead-free and conflict-minerals-compliant per Microchip standard policy. Halogen-free status not specified in verified web data.
