LFD2NX-40-8BG256I - Certus-NX 39K LC 192 I/O FPGA | Lattice
部品番号: LFD2NX-40-8BG256I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $52 | $52.00 |
| 10 | $48.5 | $485.00 |
| 100 | $43.75 | $4,375.00 |
| 500 | $39 | $19,500.00 |
| 1,000 | $35.5 | $35,500.00 |
LFD2NX-40-8BG256I 概要
A Field Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be rewired after manufacturing to implement arbitrary digital circuits. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) alongside CPLDs, and they are widely used for glue logic, interface conversion, signal conditioning, and parallel processing tasks. Certus-NX occupies the low-power, small-form-factor node of modern FPGA offerings, optimized for energy-efficient designs that still require moderate logic density.
Key features of the LFD2NX-40-8BG256I include high-speed transceivers, selectable Low Power vs High Performance modes enabled by programmable back-bias on the FD-SOI process, and AES-256 bitstream encryption with ECDSA authentication for design security. The 256-ball LFBGA package at 0.8mm ball pitch supports compact board integration while exposing 192 user I/O, sufficient for bridging multiple high-speed serial interfaces, sensor aggregation, or industrial control planes.
The Nexus platform architecture combines LUT-based logic fabric with hardened I/O and SERDES blocks. FD-SOI (Fully Depleted Silicon-On-Insulator) process technology enables dynamic back-bias control, letting the user trade off static leakage against switching performance on demand. Hardened SERDES, PLLs, and memory controllers reduce soft-logic overhead and improve timing closure versus older 40nm nodes.
Typical applications include 5G fronthaul, industrial sensor aggregation, machine vision camera interfaces, and edge-AI inference pre-processing. Choose this part when you need Certus-NX's power efficiency in a dense 256-ball BGA for compact embedded or industrial modules.
A primary design consideration: verify signal integrity on the high-speed serial lanes and follow Lattice's recommended decoupling network. The LFBGA package requires careful stack-up planning to meet impedance targets.
This page synthesizes distributor pricing, package-compatible drop-in alternatives from the Lattice Certus-NX family, and practical design notes not found on a single manufacturer page.
ドロップイン代替品: LFD2NX-40-8BG256I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
LFD2NX-40-9BG256I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LFD2NX-40-8BG256C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LFD2NX-40-8BG256I
✅ ドロップイン✓ 在庫あり
$35.5 / 個
データシートを見る →LFD2NX-40-8BG256I 最大定格＆電気的特性
| Family | Certus-NX |
| Series | LFD2NX-40 |
| Logic Cells | 39,000 |
| System Gates | 1,548,288 |
| User I/O Count | 192 |
| パッケージ | 256-LFBGA (CABGA-256) |
| Ball Pitch | 0.8 mm |
| Supply Voltage (Min) | 1 V |
| Supply Voltage (Max) | 1 V |
| Process Technology | 28nm FD-SOI |
| Operating Frequency (Max) | 325.2 MHz |
| Temperature Grade | Industrial |
| 実装タイプ | Surface Mount |
| Power Modes | User-selectable Low Power vs High Performance (FD-SOI back-bias) |
| Design Security | ECDSA bitstream authentication + AES-256 encryption |
| RoHS ステータス | Compliant |
LFD2NX-40-8BG256I 256-lfbga (cabga-256) ピン配置ガイド
LFD2NX-40-8BG256I (256-lfbga (cabga-256) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: LFD2NX-40-8BG256I.
詳細は データシート をご参照ください。
主な用途
LFD2NX-40-8BG256I の用途: 6 件s: 5G Fronthaul Aggregation, Industrial Sensor Aggregation, Machine Vision Camera Interface, Edge-AI Inference Pre-Processing, Automotive Infotainment Bridging, Server / Datacenter Interconnect.
5G Fronthaul Aggregation
The LFD2NX-40-8BG256I is a strong fit for 5G fronthaul and small-cell baseband pre-processing. With 39K logic cells, 192 user I/O, and the low-power Nexus FD-SOI fabric, it can aggregate multiple high-speed serial links from radio units while dissipating less power than larger FPGAs. AES-256 + ECDSA bitstream authentication protects the network operator's IP. Engineers typically place it between the PHY and the baseband SoC, using hardened PCIe or SLVS links for low-latency fronthaul transport.
おすすめ
Industrial Sensor Aggregation
In industrial IoT gateways, the LFD2NX-40-8BG256I aggregates data from multiple sensors over SPI, I2C, UART, and GPIO parallel Ethernet interfaces. The 192 available user I/O comfortably handle dozens of sensor inputs while the industrial temperature grade supports -40C to +100C operation. The user-selectable Low Power mode (enabled by FD-SOI back-bias) reduces idle dissipation between sensor polling windows, extending battery life in remote installations.
おすすめ
Machine Vision Camera Interface
The LFD2NX-40-8BG256I's high-speed transceivers and 192 user I/O make it suitable for machine vision interfaces, including SLIP, SLVS, or MIPI CSI-2 bridges. Its compact 256-ball LFBGA package (0.8mm pitch) fits on camera PCBs that route 2.5 Gbps+ per lane. The hardened SERDES blocks reduce soft-logic overhead, simplifying timing closure on multi-lane sensor aggregation designs for industrial inspection.
おすすめ
Edge-AI Inference Pre-Processing
For edge inference pre-processing, the LFD2NX-40-8BG256I handles input preprocessing, quantization, and tensor reshaping before passing data to a dedicated NPU or GPU. The 39K logic cells fit small ML pre-processing pipelines, and the 1.0V low-power FD-SOI fabric keeps total system power budget modest. AES-256 bitstream encryption protects proprietary model preprocessing IP in deployed edge devices.
おすすめ
Automotive Infotainment Bridging
The LFD2NX-40-8BG256I bridges multiple high-speed automotive protocols (CAN-FD, automotive Ethernet, SLVS display links). The industrial temperature grade handles cabin electronics environments, while 192 user I/O comfortably hosts multiple display and camera interfaces simultaneously. Designers should verify AEC-Q100 qualification status with Lattice before deploying in safety-critical automotive applications.
おすすめ
Server / Datacenter Interconnect
In server and datacenter interconnect cards, the LFD2NX-40-8BG256I performs protocol bridging, retiming, and aggregation across multiple backplane lanes. The hardened SERDES and PLLs on the Nexus platform simplify multi-lane timing closure, while the low-power FD-SOI fabric reduces card-level thermal load. The compact 256-ball LFBGA enables dense designs in mezzanine or OCP card form factors.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: LFD2NX-40-8BG256I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | LFD2NX-40-9BG256I | LFD2NX-40-8BG256C |
|---|---|---|---|
| Package | 256-LFBGA (0.8mm pitch) | 256-LFBGA - same | 256-LFBGA - same |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Family | Certus-NX (LFD2NX-40) | Certus-NX (LFD2NX-40) | Certus-NX (LFD2NX-40) |
| Logic Cells | 39,000 | 39,000 | 39,000 |
| User I/O | 192 | 192 | 192 |
| Supply Voltage | 1.0 V | 1.0 V | 0.95 V - 1.05 V |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) |
| Process / Platform | 28nm FD-SOI Nexus | 28nm FD-SOI Nexus | 28nm FD-SOI Nexus |
| Bitstream Security | AES-256 + ECDSA | AES-256 + ECDSA | AES-256 + ECDSA |
主な差別化要因
- Lowest-power Certus-NX family member with industrial temperature grade （vs LFD2NX-40-8BG256C)
- Standard speed/permutation grade within the LFD2NX-40 family （vs LFD2NX-40-9BG256I)
- FD-SOI programmable back-bias for dynamic power/performance trade-off （vs Older 40nm Lattice FPGAs)
設計ノート
The LFD2NX-40-8BG256I runs on a 1.0V core rail. Use a low-noise LDO (such as TPS7A4701) or a high-efficiency buck regulator upstream; FD-SOI's dynamic bias control only modulates internal transistor back-bias, not the external supply. Decouple the core rail with 10uF + 0.1uF ceramics placed within 5mm of each BGA ball group, following the Lattice reference design decoupling schematic. Estimated: total quiescent current is in the tens of mA range; consult the Certus-NX datasheet power calculator for design-specific figures.
The 256-ball LFBGA package has a theta_JA near 20-25 C/W with a properly designed 4-layer PCB and thermal vias under the central ball grid. Without thermal vias or copper pour, theta_JA can exceed 40 C/W; the FPGA may throttle under heavy traffic. Estimated: at 1W dissipation in still air, junction temperature climbs ~25C above ambient with a 6-layer stack-up and a thermal-via array - adequate for industrial environments.
Route high-speed SERDES lanes on the top layer with reference ground on layer 2, maintaining 100-ohm differential impedance. Keep SERDES pairs length-matched within 5 mils. The 0.8mm ball pitch requires 6-mil trace/space design rules on the breakout region; consider via-in-pad or microvia stack-ups to escape the central ball grid without violating density rules.
Do not skip configuration mode selection - the LFD2NX-40-8BG256I requires JTAG or SPI flash configuration at power-up. Ensure the boot mode pins are pulled to the correct state through 10K resistors before VCC ramps. Do not apply input signals to user I/O before the CONFIG_DONE pin asserts HIGH; this can cause latch-up via the long FET domain.
コンプライアンス情報
RoHS and REACH compliant per Lattice product page. Industrial temperature grade; AEC-Q100 not claimed in current public documentation - verify with Lattice for safety-critical automotive use.
