LFE2-35E-6F484I - 32K LUT ECP2 FPGA | Lattice Semiconductor
部品番号: LFE2-35E-6F484I ✓ 生産中LFE2-35E-6F484I 概要
An FPGA is a programmable semiconductor in which the logic, interconnect, and digital signal-processing resources are configured after manufacture. ECP2 devices belong to the broader field-programmable logic hierarchy, combining configurable LUT-based logic, embedded memory, programmable I/O, and dedicated DSP resources in one device. This combination allows designers to implement parallel digital logic, control functions, interface logic, and fixed-point processing without changing the physical PCB when design requirements evolve.
The LFE2-35E-6F484I provides 32,000 logic elements, corresponding to 4,000 LUTs, together with 339,968 RAM bits and 331 user I/O. The -6 speed designation identifies the device speed grade, while the final letter in the part number identifies the package and temperature-related ordering information. Its 484-ball package supports dense PCB routing for systems requiring substantial I/O, including industrial control, communications, instrumentation, embedded processing, and general-purpose programmable logic.
The device also includes DSP capability, making it suitable for fixed-point filtering, signal conditioning, and control-loop implementations where parallel logic and dedicated arithmetic resources are useful. Its 1.2 V-class supply requirement places it in modern low-voltage digital systems, while the 331 user I/O provide substantial connectivity for external memories, sensors, converters, transceivers, and industrial interfaces.
When designing a board around the LFE2-35E-6F484I, follow the manufacturer’s BGA layout, power-supply, decoupling, and programming guidelines. Pay particular attention to the required core voltage tolerance, signal-transition requirements, thermal conditions, and the configuration interface used during programming. The large BGA footprint also benefits from careful layer planning and controlled escape routing for high-speed and high-fan-out connections.
This page consolidates the device’s electrical, packaging, and application information, identifies a confirmed same-family alternative, and provides practical selection and layout guidance for engineers evaluating the LFE2-35E-6F484I for a new FPGA design.
ドロップイン代替品: LFE2-35E-6F484I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: LFE2-35E-6F484I （同一形状・フットプリント） — 相違点: Core Supply Voltage, Device Type, Package, Speed Grade.
LFE2-35E-6FN484I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LFE2-35E-6F484I 最大定格＆電気的特性
| Device Type | ECP2 Field Programmable Gate Array (FPGA) IC |
| Logic Elements | 32,000 |
| Look-Up Tables | 4,000 LUTs |
| Total RAM | 339,968 bits |
| User I/O | 331 |
| DSP Resources | Present |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Nominal Supply Voltage | 1.2 V |
| Speed Grade | -6 |
| Junction Temperature Range | -40 °C to 100 °C |
| パッケージ | 484-pin FBGA |
| ピン数 | 484 pins |
| 実装タイプ | Surface Mount |
| Technology | 90 nm |
| Programmable Architecture | LUT-based FPGA with embedded RAM and DSP |
| Manufacturer | Lattice Semiconductor Corporation |
| ライフサイクル状態 | Active |
LFE2-35E-6F484I 484-pin fbga ピン配置ガイド
LFE2-35E-6F484I (484-pin fbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: LFE2-35E-6F484I.
詳細は データシート をご参照ください。
主な用途
LFE2-35E-6F484I の用途: 6 件s: Industrial Control Systems, Communications Interface Consolidation, Data Acquisition and Instrumentation, Fixed-Point Signal Processing, Embedded Sensor and Condition Monitoring, Programmable Logic Consolidation.
Industrial Control Systems
The LFE2-35E-6F484I suits industrial controllers that coordinate sensors, actuators, communication links, and real-time decision logic. Its 32,000 logic elements provide substantial configurable control capacity, while 331 user I/O allow direct connection to digital inputs, outputs, counters, and industrial interface devices. The 1.14 V to 1.26 V core range supports compact low-voltage digital platforms. The -40 °C to 100 °C junction specification aligns with many industrial environments. Designers should reserve clean power planes, controlled clock distribution, and defined external standards so the FPGA remains reliable under electrical noise and temperature variation.
おすすめ
Communications Interface Consolidation
The LFE2-35E-6F484I can consolidate protocol conversion, framing, filtering, and interface control into one programmable device. Its 4,000 LUTs and 339,968 RAM bits are useful for parallel-to-serial conversion, packet buffering, and state machines, while 331 user I/O support multiple data buses. DSP resources can accelerate fixed-point signal processing within a communication path. The architecture is particularly useful when protocols or line rates evolve after hardware layout is fixed. Board planning must reserve appropriate level shifters, clocking components, termination, and isolation where required by the external communication standard.
おすすめ
Data Acquisition and Instrumentation
The LFE2-35E-6F484I is appropriate for instrumentation that must coordinate sampling, timing, data packing, and control logic. The 339,968 RAM bits can support acquisition buffers and working storage, while the programmable I/O can interface with sensors, converters, counters, and display or communications subsystems. Its DSP capability provides a path to fixed-point filtering and signal conditioning without requiring a separate accelerator in every design. The 484-pin package offers high connectivity but requires careful layer allocation so analog-sensitive and digital-routing areas remain separated.
おすすめ
Fixed-Point Signal Processing
The LFE2-35E-6F484I combines configurable LUT logic, embedded RAM, and DSP resources for fixed-point filtering, demodulation, waveform generation, and conditioning. The parallel nature of FPGA logic makes it useful when the design must process samples on fixed intervals or implement multiple arithmetic paths concurrently. Its 4,000 LUTs and 339,968 RAM bits support moderate-sized pipelines and data storage. Implementation quality depends on clocking, pipeline latency, and resource mapping, so use the manufacturer’s DSP construction guidance and validate timing with the final constraints and board configuration.
おすすめ
Embedded Sensor and Condition Monitoring
The LFE2-35E-6F484I can combine sensor conditioning, filtering, event detection, and control output in a single programmable platform. Its 331 user I/O provide broad connectivity to digital sensors, switches, status indicators, and actuators, while DSP resources support arithmetic on sensor data. This flexibility is useful when new measurement modes must be added without changing the controller board. Because industrial sensors can introduce transients and ground offsets, the design should include suitable protection, isolation, filtering, and grounding rather than relying on the FPGA alone for signal conditioning.
おすすめ
Programmable Logic Consolidation
The LFE2-35E-6F484I is useful when several fixed-function logic blocks can be replaced by one configurable device. The 32,000 logic elements can implement control, sequencing, counters, protocol state machines, and data-format conversion, while 339,968 RAM bits add embedded storage. Consolidating these functions can reduce board area and simplify updates because the bitstream can change after deployment. The tradeoff is the complexity of configuration, timing closure, and in-field programming. Maintain a controlled bitstream release process and verify unused I/O states, startup behavior, and recovery requirements before production deployment.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: LFE2-35E-6F484I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | LFE2-35E-6FN484I |
|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor |
| Package | 484-pin FBGA | 484-pin FBGA |
| Family | ECP2 | ECP2 |
| Logic Elements | 32,000 | 32,000 |
| Look-Up Tables | 4,000 LUTs | 4,000 LUTs |
| Total RAM | 339,968 bits | 339,968 bits |
| User I/O | 331 | 331 |
| Speed Grade | -6 | -6 |
| DSP Capability | Yes | Yes |
主な差別化要因
- High I/O density in a single ECP2 device （vs LFE2-35E-6FN484I)
- Balanced programmable logic and DSP capability （vs LFE2-35E-6FN484I)
- Industrial junction-temperature capability （vs LFE2-35E-6FN484I)
設計ノート
Design the 484-ball FBGA layout from the manufacturer’s land pattern and assembly guidance. Reserve individual layers for BGA escape routing, power distribution, and high-speed signals, and route sensitive interfaces away from switching nodes and inductors. The large pin count increases routing congestion, so complete signal-integrity and assembly-rule checks before release.
Maintain the LFE2-35E-6F484I core supply within 1.14 V to 1.26 V across voltage tolerance, temperature, and transient conditions. Separate the digital core supply from noisy analog or switching-supply sections where practical, place local bulk and bypass capacitance at the supply-entry points, and follow the manufacturer’s recommended power and ground-plane topology.
Do not approve a replacement based only on the visible package, LUT count, and I/O count. Check the complete ordering table, electrical limits, temperature suffix, configuration interface, and every BGA ball assignment. In particular, verify that the JEDEC-compatible ball map and user I/O positions match the original design before treating LFE2-35E-6FN484I as a substitution.
Use a continuous, low-impedance ground structure beneath and between signal layers, and provide symmetric clock distribution to minimize skew across the FPGA. Keep configuration and JTAG access paths away from high-voltage isolation gaps and noisy interfaces. Because this device combines 331 user I/O with a large BGA, perform complete escape-routing analysis before fixing component placement.
Estimated thermal planning must use the actual ECP2 core dissipation, package thermal data, board copper area, airflow, and maximum ambient temperature; these inputs are not established by the distributor listing. Place the device where the PCB can spread heat effectively, monitor temperature in the worst-case operating mode, and avoid placing it immediately beside a high-loss switching component without an explicit thermal review.
コンプライアンス情報
The verified technical listings do not state component-level RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is not applicable because the ECP2 FPGA is not presented as an automotive-qualified device in the verified data.
