LXES03TBB1-141 - 0.05pF ESD/TVS Diode 2-CSP | Murata
部品番号: LXES03TBB1-141 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0.06 | $0.06 |
| 10 | $0.05 | $0.50 |
| 100 | $0.04 | $4.00 |
| 1,000 | $0.03 | $30.00 |
| 5,000 | $0.02 | $100.00 |
| 10,000 | $0.0152 | $152.00 |
LXES03TBB1-141 概要
A TVS (transient voltage suppressor) diode is a semiconductor clamp designed to protect sensitive downstream electronics by diverting voltage transients - electrostatic discharge (ESD), cable discharge events, and surge pulses - away from the protected IC. It belongs to the broader category of surge protectors, which also includes varistors (MOVs), gas discharge tubes, and TVS diode arrays. In modern compact PCB designs, silicon TVS diodes are preferred over MOVs because they offer faster response (<1 ns), predictable clamping, low leakage, and reflow-compatible SMD packages that integrate cleanly into high-density layouts.
The LXES03TBB1-141 is engineered to meet IEC 61000-4-2 Level 4 ESD immunity, handling +/-8 kV contact discharge and up to +/-25 kV air discharge per Murata's published T-series data. Its 0.05-0.45 pF capacitance range makes it ideally suited for RF signal lines, USB 2.0 high-speed data, HDMI, antenna feeds, and other interfaces where capacitance loading would degrade signal integrity. The bidirectional construction permits placement across signal pairs regardless of polarity. Reverse leakage is minimized to keep quiescent drain on battery-fed systems negligible.
Architecturally, the part uses a silicon avalanche junction optimized for low capacitance rather than high surge handling. Compared to larger TVS arrays in SOT-23 packages, the LXES03TBB1-141 sacrifices conventional pad performance by trading peak current capacity for sub-pF capacitance in a sub-millimeter outline - an excellent fit when the threat model is human-body ESD rather than lightning-induced surges. Recommended applications include smartphone RF/antenna lines, wearables, USB Type-C high-speed lines, IoT radios, and HDMI/MIPI interfaces in consumer electronics.
When designing with this device, place it as close as physically possible to the connector entry point and use a solid ground reference on the inner PCB layers. A 0.1 uF decoupling capacitor at the protected IC is recommended to absorb residual transients. The 2-CSP package requires careful stencil design and reflow profiling because of its small land pattern; do not use wave soldering.
This page synthesizes distributor pricing, drop-in alternatives from the same Murata T-series family, and practical design notes not found in the manufacturer's short-form datasheet - giving engineers the data needed for both first-time design and second-source decisions.
ドロップイン代替品: LXES03TBB1-141 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: LXES03TBB1-141 （同一形状・フットプリント） — 相違点: Device Type, Recommended Applications.
クイック比較ツール — 並列比較する代替部品を選択:
LXES03TBA1-141
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LXES03TBB1-140
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LXES03TBB1-141 最大定格＆電気的特性
| Manufacturer | Murata Manufacturing |
| Product Series | T Series (Silicon ESD Protection) |
| Device Type | Bidirectional TVS / ESD Protection Diode |
| Number of Channels | 1 ch |
| パッケージ / ケース | 2-CSP (0.60 x 0.30 mm) |
| 実装タイプ | Surface Mount |
| Capacitance (Typical) | 0.45 pF |
| Reverse Stand-Off Voltage (VRWM) | 5.5 V |
| Breakdown Voltage (VBR min) | 7.0 V |
| Peak Pulse Power (8/20 us, Ppp) | 125 W |
| ESD Contact Discharge (IEC 61000-4-2) | +/-8 kV |
| ESD Air Discharge (IEC 61000-4-2) | +/-15 kV to +/-25 kV (model dependent) |
| Length | 0.60 mm +/-0.05 mm |
| Width | 0.30 mm +/-0.05 mm |
| RoHS ステータス | Compliant |
| Recommended Applications | Consumer, Industrial, Mobile, RF signal line protection |
LXES03TBB1-141 ピン構成
| ピン 1 | Signal Line (Bidirectional) — Protected signal line pad - connects to the data/RF line being clamped. Bidirectional, so polarity does not matter. |
| ピン 2 | GND — Ground reference pad - connect to system ground plane directly beneath the package for low-inductance discharge path. |
主な用途
LXES03TBB1-141 の用途: 6 件s: Smartphone RF Antenna Line Protection, USB Type-C High-Speed Data Line Protection, HDMI / MIPI Display Interface Protection, Wearable and Hearable Device ESD Protection, IoT Sensor Module and Antenna Protection, Automotive Infotainment and Camera Link Protection.
Smartphone RF Antenna Line Protection
The LXES03TBB1-141 protects RF antenna signal lines on 4G/5G smartphones, Wi-Fi 6/6E radios, and GNSS receivers. With 0.45 pF typical capacitance the part adds minimal loading to 50-ohm antenna feeds, preserving return loss and radiated efficiency on bands up to 6 GHz. Its IEC 61000-4-2 Level 4 immunity handles real-world ESD events from human-body contact and charged-cable discharge at the antenna port. Placed within 1 mm of the antenna feed-through, it clamps fast transients to safe levels before they reach the front-end module, while its 2-CSP 0.60 x 0.30 mm outline fits in the tight keep-out zone beneath the antenna.
おすすめ
USB Type-C High-Speed Data Line Protection
USB Type-C, USB 3.x and USB 3.2 Gen 2 high-speed data lines are highly sensitive to ESD events at the connector. The LXES03TBB1-141's sub-picofarad capacitance preserves signal-integrity margins on SBU, D+/D-, and high-speed TX/RX pairs, where extra loading would close the eye diagram. Its 5.5 V reverse stand-off voltage is comfortably above the 5 V VBUS level, and the bidirectional construction means it works regardless of polarity. The 125 W peak pulse power (8/20 us) and IEC 61000-4-2 Level 4 rating handle cable-discharge events that occur when users hot-plug chargers or peripherals into the Type-C receptacle.
おすすめ
HDMI / MIPI Display Interface Protection
HDMI 2.0/2.1 and MIPI DSI/CSI-2 high-speed display and camera interfaces operate at multi-gigabit data rates where even a few picofarads of loading causes ISI and eye-height degradation. The LXES03TBB1-141 protects each TMDS or MIPI lane with only 0.45 pF loading, keeping the channel-loss budget intact while providing IEC 61000-4-2 Level 4 ESD immunity at the connector entry. Designers place one LXES03TBB1-141 per differential pair as close to the HDMI/MIPI receptacle as possible. The 0.60 x 0.30 mm 2-CSP footprint enables dense placement under the connector shield.
おすすめ
Wearable and Hearable Device ESD Protection
True wireless earbuds, smartwatches, and AR/VR headsets expose their signal lines to frequent human-body contact. The LXES03TBB1-141's compact 2-CSP outline lets engineers place ESD protection inside ultra-small enclosures where SOT-23 packages cannot fit. With 0.45 pF capacitance it preserves Bluetooth audio quality on RF lines, microphone bias integrity, and touch/proximity sensor accuracy. IEC 61000-4-2 Level 4 immunity handles the constant ESD stress from clothing, skin, and metal-frame contact common in wearable use, and the 5.5 V stand-off protects safely above typical 3.7 V Li-ion rails.
おすすめ
IoT Sensor Module and Antenna Protection
Industrial IoT sensor modules, smart-home hubs, and asset-tracking devices often mount antennas or sensors in exposed locations where ESD events are frequent. The LXES03TBB1-141 protects sub-GHz LoRa, Wi-Fi, BLE 5.x, and proprietary sub-GHz radio lines with sub-pF capacitance, preserving radiated efficiency and receive sensitivity. Its 5.5 V reverse stand-off suits 3.3 V and 5 V sensor rails. The miniature 0.60 x 0.30 mm 2-CSP outline integrates easily into compact sensor PCBs, and IEC 61000-4-2 Level 4 immunity covers factory floor and outdoor installation ESD events.
おすすめ
Automotive Infotainment and Camera Link Protection
LXES03TBB1-141 variants qualified for automotive infotainment systems protect LVDS, FPD-Link, and automotive Ethernet signal lines where ESD events occur frequently during assembly and in-vehicle use. The 0.45 pF capacitance preserves multi-gigabit signal integrity on GMSL/FPD-Link III camera paths, and the 5.5 V stand-off is appropriate for 3.3 V and 5 V automotive rails. Designers place the part at the connector pin and use a solid ground reference on inner layers. [DATA_NEEDED: confirm automotive-grade part number suffix and AEC-Q100 qualification status - the standard LXES03TBB1-141 consumer variant may require a separate automotive-grade sibling.]
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: LXES03TBB1-141 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | LXES03TBA1-141 | LXES03TBB1-140 |
|---|---|---|---|
| Brand | Murata Manufacturing | Murata Manufacturing | Murata Manufacturing |
| Package | 2-CSP (0.60 x 0.30 mm) | 2-CSP (0.60 x 0.30 mm) - same | 2-CSP (0.60 x 0.30 mm) - same |
| Channels | 1 | 1 | 1 |
| Capacitance (Typical) | 0.45 pF | 0.45 pF | 0.45 pF |
| Reverse Stand-Off Voltage | 5.5 V | 5.5 V | 5.5 V |
| Breakdown Voltage (VBR min) | 7.0 V | 7.0 V | 7.0 V |
| Peak Pulse Power (8/20 us) | 125 W | 125 W | 125 W |
| ESD Air Discharge (IEC 61000-4-2) | +/-15 kV (Level 4) | +/-15 kV | +/-15 kV |
| Approx. Unit Price (USD, 1k qty) | 0.04 | 0.04 (similar) | 0.04 (similar) |
主な差別化要因
- Sub-picofarad capacitance in a 2-CSP outline （vs SOT-23 multi-channel TVS arrays (e.g., USBLC6-2SC6))
- Compact 0.60 x 0.30 mm land pattern （vs SOT-23-6 multi-channel TVS arrays)
- Bidirectional operation without polarity marking （vs Unidirectional TVS diodes)
設計ノート
Place the LXES03TBB1-141 as physically close as possible to the connector entry point or antenna feed-through - typically within 1-2 mm. Use a short, wide ground return trace or via array directly from the GND pad to an inner-layer ground plane to minimize parasitic inductance; high inductance degrades clamping performance and lets fast ESD transients overshoot into the protected IC. Keep the protected signal trace short between the TVS pad and the protected IC pin.
The 2-CSP package has a 0.60 x 0.30 mm land pattern that demands a precise solder-paste stencil - typically 0.15 mm aperture with stainless-steel foil for clean paste release. Use SAC305 lead-free solder paste and a reflow profile matching Murata's recommended 245C peak for under 30 seconds. Do not attempt wave soldering; the package is surface-mount-only and not designed for through-hole or selective wave processes.
For USB 3.x, HDMI 2.0/2.1, and MIPI DSI/CSI-2 high-speed lanes, place one LXES03TBB1-141 per differential pair (one per signal line, with both TVS GND pads sharing a common via to ground). The 0.45 pF loading is well within the channel-loss budget for these interfaces, but verify with TDR or eye-diagram simulation at your data rate. For RF antenna lines, place the TVS at the feed point, not at the transceiver, to maximize ESD-prevention benefit before the trace enters the shielded area.
Common pitfalls include using the LXES03TBB1-141 on signal lines with DC bias exceeding 5.5 V (the device begins to conduct above VRWM and will clamp the signal), placing it on low-frequency lines where the 0.45 pF capacitance is not needed (use a cheaper higher-capacitance TVS), and pairing it with insufficient ground via stitching (use at least two vias from the GND pad to inner-layer ground to handle 8/20 us surge currents without inductance-induced overshoot).
コンプライアンス情報
RoHS and REACH compliant per Murata product page. Lead-free reflow-compatible. Halogen-free per Murata T-series datasheet family. AEC-Q100 status not stated for the consumer-grade LXES03TBB1-141 suffix - confirm with Murata if automotive qualification is required.
