M2GL060-FGG484 - 56.5K Logic Cells | Microchip | Industrial
部品番号: M2GL060-FGG484 ✓ 生産中M2GL060-FGG484 概要
An FPGA is a programmable semiconductor whose logic fabric, interconnect network, and peripherals can be configured after fabrication. This makes the FPGA hierarchy broader than a fixed-function logic IC. The M2GL060-FGG484 belongs to the IGLOO 2 low-density FPGA family, where flash configuration memory provides a practical single-chip implementation for moderate logic density. Its 267 I/Os provide substantial board-level connectivity, while the 484-ball FBGA supports dense routing in space-constrained equipment.
The headline implementation advantages are the 56,520 logic elements, 267 user I/Os, and 1.2 V supply requirement. These figures allow complex control paths, parallel data processing, and multiple external interfaces to coexist in one device. The M2GL060-FGG484 is particularly useful when a design needs more flexibility than an application-specific controller but does not justify the power, cost, and complexity of a much larger FPGA. Its surface-mount 484-ball package also supports automated assembly and high-density PCB layouts.
Microchip positions IGLOO 2 devices for general-purpose functions including Gigabit Ethernet or dual PCI Express control planes, bridging, I/O expansion and conversion, image processing, system management, and secure connectivity. Because configuration is stored in flash, the device can support deterministic startup behavior without a separate configuration PROM. Engineers should still account for configuration pins, dedicated programming resources, bank voltage constraints, and the pin requirements of their selected interfaces when planning the PCB.
Typical uses include industrial communication gateways, medical monitoring equipment, defense and aviation subsystems, video-capture interfaces, secure network access equipment, and embedded control systems. The device can consolidate multiple fixed-function logic blocks into one programmable implementation, simplifying board partitioning and allowing firmware or configuration updates during product maintenance. Its low-density positioning makes it well matched to control-plane logic, sensor aggregation, and protocol translation rather than large parallel-compute workloads.
A key design consideration is that the complete BGA pin assignment, bank architecture, and electrical constraints must be taken directly from the manufacturer pin-description guide. Confirm every power, ground, configuration, clock, and user-I/O connection before layout release. High-speed interfaces also require disciplined return-path planning, while the 1.2 V core supply requires a regulator and decoupling network designed for the device's transient requirements.
This page consolidates the manufacturer's device identity, family application guidance, lifecycle status, package information, and verified cross-reference information. It also provides parameter-level comparisons, drop-in migration notes, and practical design guidance for engineers evaluating the M2GL060-FGG484 against same-family speed and temperature-grade options.
ドロップイン代替品: M2GL060-FGG484 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: M2GL060-FGG484 （同一形状・フットプリント） — 相違点: Configuration Memory, Device Family, Device Type, Logic Elements, Package.
M2GL060-FGG484I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
M2GL060-1FG484I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
M2GL060-1FGG484
✅ ドロップイン📋 参考代替品（カタログ未掲載）
M2GL060-1FG484
✅ ドロップイン ⚠️ 仕様未検証価格はお問い合わせください
データシートを見る →M2GL060-1FGG484I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
M2GL060-FGG484 最大定格＆電気的特性
| Device Type | IGLOO 2 low-density flash FPGA |
| Logic Elements | 56,520 LE |
| User I/O Count | 267 I/O |
| 動作電源電圧 | 1.2 V |
| Minimum Operating Temperature | 0 °C |
| Maximum Operating Temperature | +85 °C |
| パッケージ | 484-ball FBGA |
| 実装タイプ | Surface-mount SMT |
| Shipping Format | Tray |
| Configuration Memory | Embedded flash |
| Logic Cell Count | 56,520 LE |
| Package Ball Count | 484 balls |
| Product Series | IGLOO 2 |
| Device Family | M2GL060 |
M2GL060-FGG484 484 balls ピン配置ガイド
M2GL060-FGG484 (484 balls パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: M2GL060-FGG484.
詳細は データシート をご参照ください。
主な用途
M2GL060-FGG484 の用途: 6 件s: Industrial Communication Gateway, Medical Monitoring Equipment, Defense and Aviation Control Logic, Video and Image Processing Interface, Secure Connectivity Equipment, I/O Expansion and Protocol Bridging.
Industrial Communication Gateway
The M2GL060-FGG484 suits industrial gateway logic because its 56,520 logic elements can consolidate protocol conversion, status monitoring, and interface control while 267 I/Os provide extensive board connectivity. The device operates from a 1.2 V core supply and fits a surface-mount 484-ball FBGA. Use it for deterministic control-plane logic around communications processors, not as a replacement for a high-throughput network transceiver.
おすすめ
Medical Monitoring Equipment
The M2GL060-FGG484 can implement sensor acquisition control, alarm logic, data formatting, and communication isolation functions in medical monitoring equipment. Its 267 user I/Os support multiple sensor inputs and control outputs, while 56,520 logic elements provide room for protocol state machines and safety checks. The commercial 0 °C to +85 °C rating suits standard indoor equipment; use the industrial-grade variant when the enclosure environment requires it.
おすすめ
Defense and Aviation Control Logic
The M2GL060-FGG484 is appropriate for embedded control, interface bridging, I/O conversion, and system-management logic in defense and aviation equipment. Its embedded flash configuration supports a self-contained programmable implementation, and the 267 I/Os allow external avionics or test equipment to connect through tightly controlled logic. Qualification requirements for each deployment should be reviewed separately because the standard suffix does not itself establish automotive or aerospace certification.
おすすめ
Video and Image Processing Interface
The M2GL060-FGG484 can handle pixel-data routing, timing control, frame synchronization, and format conversion around an external image sensor. Its 56,520 logic elements are suitable for moderate parallel-processing pipelines, while 267 I/Os support camera data buses, control signals, and synchronization. The 1.2 V core supply simplifies partitioning into modern low-voltage systems, although timing-critical pixel interfaces require careful bank and clock planning.
おすすめ
Secure Connectivity Equipment
The M2GL060-FGG484 is useful in secure connectivity products as a programmable interface and control engine for authentication, key-transfer sequencing, link monitoring, and protocol bridging. Its 56,520 logic elements permit dedicated datapath and control logic to coexist, and 267 I/Os simplify external transceiver and security-controller connections. Use the flash configuration carefully, and ensure programming access and device lifecycle controls align with the product's security architecture.
おすすめ
I/O Expansion and Protocol Bridging
The M2GL060-FGG484 can bridge dissimilar interfaces, translate signal formats, and expand I/O capacity between processors and external peripherals. Its 267 user I/Os provide a substantial connection count, while 56,520 logic elements support parallel conversion pipelines and control state machines. The 484-ball FBGA requires careful escape routing and power distribution, but it enables a compact solution when discrete logic would otherwise consume excessive board area.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: M2GL060-FGG484 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | M2GL060-FGG484I | M2GL060-1FG484I | M2GL060-1FGG484 | M2GL060-1FG484 | M2GL060-1FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA | 484-ball FBGA - same package | 484-ball FBGA - same package | 484-ball FBGA - same package | 484-ball FBGA - same package | 484-ball FBGA - same package |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | Standard grade indicated by FGG484 | Standard grade indicated by FGG484I | 1 speed grade | 1 speed grade | 1 speed grade | 1 speed grade |
主な差別化要因
- Identical logic and I/O capacity across the primary industrial alternative （vs M2GL060-FGG484I)
- Higher speed grade without changing core resource count （vs M2GL060-1FG484I)
- Commercial-temperature option with full logic-resource parity （vs M2GL060-1FGG484)
設計ノート
Assign all 484 BGA balls from the Microchip IGLOO 2 pin-description guide before routing. Separate core, I/O, and auxiliary supply domains according to the recommended planes and decoupling arrangement, then verify that every configuration and clock ball is connected correctly. Place the required bypass capacitors near their associated power balls, and use a solid ground reference to limit return-path discontinuities.
Plan the 484-ball FBGA escape strategy early because dense ball pitch can constrain routing between power, ground, and user I/O. Avoid placing high-speed signals beneath areas with interrupted ground planes, and route clock and sensitive interface paths away from switching nodes. Maintain the package ball-pad and solder-mask geometry required by the mechanical drawing and assembly process.
The M2GL060-FGG484 operates from a 1.2 V supply, so the regulator must support the required static current plus configuration and I/O switching transients. Use the manufacturer's recommended capacitance and ESR limits, and keep the high-current return path continuous through the BGA power grid. Confirm brownout behavior and startup sequencing against the configuration and clock requirements.
Do not select a replacement solely because the family name and package match. Compare speed grade, temperature grade, I/O standards, supported clocking, and timing constraints. When moving from M2GL060-FGG484 to an -1 variant, rerun timing analysis because the faster grade can change internal timing margins and system-level behavior.
コンプライアンス情報
The standard M2GL060-FGG484 is an industrial FPGA rather than an automotive-qualified device. Compliance status and lead-free packaging information must be confirmed from the current manufacturer product documentation or declaration of conformity.
