M2S010-TQG144 - SmartFusion2 SoC FPGA 12K LE 166MHz | Microchip
部品番号: M2S010-TQG144 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $56.4 | $56.40 |
| 10 | $52.15 | $521.50 |
| 100 | $47.8 | $4,780.00 |
| 500 | $42.3 | $21,150.00 |
| 1,000 | $38.9 | $38,900.00 |
M2S010-TQG144 概要
A SmartFusion2 SoC FPGA is a heterogeneous computing device that fuses a hard ARM Cortex-M3 processor core, on-chip SRAM and eNVM, debug peripherals, and a reprogrammable FPGA fabric in one package. This integration removes the inter-chip communication latency of a discrete MCU-plus-FPGA design and simplifies the PCB by collapsing what would otherwise be a multi-chip system onto a single 144-TQFP footprint. M2S010 sits at the low-density end of the SmartFusion2 family, with larger siblings (M2S025, M2S050, M2S060, M2S150) scaling up logic and memory.
Key features of M2S010-TQG144 include 12KLEs / 12084 cells of flash-based FPGA fabric, a 166 MHz ARM Cortex-M3 subsystem, on-chip 512 KB eNVM and 64 KB SRAM, embedded DDR controllers, multiple high-speed serial transceivers, and hardware cryptographic accelerators for AES, SHA, and ECC. The device operates from a 1.2 V core supply and supports industrial temperature grades, with low static and dynamic power consumption enabled by flash-based non-volatile configuration cells.
Typical applications include industrial motor control, secure IoT edge nodes, communications bridging, system management controllers, and PCI Express endpoint designs. The integrated ARM Cortex-M3 allows designers to host control-plane firmware on-chip while the FPGA fabric handles high-bandwidth data-plane logic, data acquisition, or custom peripheral glue logic.
ドロップイン代替品: M2S010-TQG144 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
M2S010-TQG144I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
M2S010T-1TQG144I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
M2S025-TQG144
✅ ドロップイン📋 参考代替品（カタログ未掲載）
M2S050-TQG144
✅ ドロップイン📋 参考代替品（カタログ未掲載）
M2S010-TQG144 最大定格＆電気的特性
| Family | SmartFusion2 |
| FPGA Logic Elements | 12K (12,084 cells) |
| Processor Core | ARM Cortex-M3 |
| Max Processor Frequency | 166 MHz |
| Embedded SRAM | 64 KB |
| Embedded eNVM | 512 KB |
| パッケージ | TQFP-144 (TQG) 20x20 mm |
| Core Voltage | 1.2 V |
| Process Technology | 65 nm flash-based |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Configuration Memory | Flash-based (non-volatile) |
| Cryptographic Accelerator | AES, SHA, ECC (hardware) |
M2S010-TQG144 tqfp-144 (tqg) 20x20 mm ピン配置ガイド
M2S010-TQG144 (tqfp-144 (tqg) 20x20 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: M2S010-TQG144.
詳細は データシート をご参照ください。
主な用途
M2S010-TQG144 の用途: 6 件s: Industrial Motor Control, Secure IoT Edge Gateway, Communications Bridging and Protocol Conversion, System Management Controller, PCI Express Endpoint / Embedded Compute, Avionics and Drone Flight Control.
Industrial Motor Control
The M2S010-TQG144 fits industrial motor-control designs because the FPGA fabric can host deterministic high-speed PWM generators, encoder feedback, and field-oriented control (FOC) loops at sub-microsecond latency, while the ARM Cortex-M3 runs the higher-level motion-control firmware and CAN/RS-485 communications. The 12K logic elements are sufficient for three-phase FOC plus commutation and fault protection. The industrial-grade variant (M2S010-TQG144I) operates from -40C to +85C, suiting factory-floor enclosures. Unlike a discrete MCU-plus-FPGA design, the integrated subsystem removes inter-chip bus latency and shrinks the PCB. Cryptographic accelerators also support secure firmware updates over industrial networks.
おすすめ
Secure IoT Edge Gateway
The M2S010-TQG144 suits secure IoT edge gateways because the ARM Cortex-M3 runs TLS, MQTT, and device-management stacks while the hardware AES, SHA, and ECC accelerators offload encryption without burdening the MCU. The 64 KB SRAM and 512 KB eNVM host full TLS stacks and secure boot firmware. The FPGA fabric can implement custom sensor interfaces (I2C, SPI, UART bridges, GPIO expansion) without additional glue logic. Anti-tamper and secure-boot features protect deployed devices in the field. The low-power flash-based fabric and 1.2 V core supply help meet battery and energy-harvesting budgets at remote sites.
おすすめ
Communications Bridging and Protocol Conversion
The M2S010-TQG144 is ideal for communications bridging because the FPGA fabric can implement custom serial protocols, I2S audio streams, LVDS links, and high-speed parallel buses in parallel with the ARM core running TCP/IP or industrial Ethernet stacks. The 12K logic elements comfortably host a multi-protocol bridge (UART to SPI, SPI to I2C, or GPIO expansion). The integrated Cortex-M3 simplifies board design versus two-chip MCU-plus-FPGA solutions. Hardware AES accelerators accelerate VPN and TLS tunnels for secure field-bus communications. The TQFP-144 footprint supports hand-solderable prototyping.
おすすめ
System Management Controller
The M2S010-TQG144 serves as a system management controller (SMC) because the FPGA fabric can monitor rails, sequence power, arbitrate resets, and aggregate fault signals at hardware speed, while the ARM Cortex-M3 runs higher-level telemetry, host interface, and policy firmware. The hardware cryptographic accelerators and secure boot meet platform-firmware-resilience (PFR) requirements for server and telecom platforms. The 512 KB eNVM stores multiple boot images with rollback protection. The 12K LE fabric easily fits typical SPMI, PMBus, and I2C management buses plus custom telemetry.
おすすめ
PCI Express Endpoint / Embedded Compute
The M2S010-TQG144 can be deployed as a low-density PCIe endpoint or embedded compute node because it integrates transceivers, DDR controllers, and an ARM subsystem in a single 144-pin TQFP. The FPGA fabric implements the PCIe transaction layer plus DMA engines, while the Cortex-M3 handles enumeration, enumeration configuration, and host-side driver requests. DDR controller support lets designers attach external SDRAM for data buffers. The 1.2 V core and deterministic flash boot simplify power-sequencing design for hot-plug and standby power states.
おすすめ
Avionics and Drone Flight Control
The M2S010-TQG144 fits small-UAV flight controllers because the FPGA fabric can host deterministic sensor-fusion datapaths (IMU, barometer, GPS) at low latency, while the ARM Cortex-M3 runs the higher-level control loops, failsafe logic, and telemetry. Hardware cryptographic accelerators support secure command-and-control links required by modern UAV regulations. The industrial-grade variant operates across -40C to +85C, suiting high-altitude and outdoor environments. The non-volatile flash configuration enables instant-on after power brownouts, which is critical for flight safety. The TQFP-144 package supports field-reworkable prototypes.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: M2S010-TQG144 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | M2S010-TQG144I | M2S010T-1TQG144I | M2S025-TQG144 | M2S050-TQG144 |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-144 (TQG) | TQFP-144 (TQG) - same | TQFP-144 (TQG) - same | TQFP-144 (TQG) - same | TQFP-144 (TQG) - same |
| FPGA Logic Elements | 12K LEs | 12K LEs | 12K LEs | 25K LEs | 50K LEs |
| Processor Core | ARM Cortex-M3 @ 166 MHz | ARM Cortex-M3 @ 166 MHz | ARM Cortex-M3 @ 166 MHz | ARM Cortex-M3 @ 166 MHz | ARM Cortex-M3 @ 166 MHz |
| Embedded SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Embedded eNVM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Temperature Grade | Commercial | Industrial -40C to +85C | Industrial -40C to +85C | Commercial | Commercial |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
主な差別化要因
- Lowest-cost path to industrial-grade SoC FPGA （vs M2S010-TQG144 (commercial))
- More than 2x FPGA fabric for headroom （vs M2S010-TQG144)
- Order-of-magnitude fabric growth for ambitious designs （vs M2S010-TQG144)
設計ノート
The M2S010-TQG144 requires a clean 1.2 V core supply capable of delivering transient currents during FPGA configuration and ARM subsystem activity. Estimated: at 166 MHz Cortex-M3 plus typical 12K LE utilization, expect 300-500 mA peak core current. Use an LDO or DC-DC regulator with at least 20% margin (LMZ14203HTZ/NOPB is a proven option). Place 10 uF and 0.1 uF decoupling capacitors within 5 mm of every supply pin to suppress switching noise; the flash fabric is sensitive to rail droop during configuration writes.
Although SmartFusion2 devices are low-power by FPGA standards, sustained high-utilization workloads (e.g. continuous PCIe traffic, motor-control PWM) can push junction temperature past 85 C in a sealed enclosure. Estimated: a 1 W dissipation in a TQFP-144 with theta_JA around 30-35 C/W yields a 30-35 C rise above ambient. Provide at least 4 oz copper or 2 sq-in of copper pour under the exposed thermal pad region. Add a heatsink for designs exceeding 1.5 W sustained dissipation.
Route the JTAG and trace signals (TCK, TMS, TDI, TDO, TRST) with 50 ohm controlled impedance and length-matched within 25 mm to avoid debug failures. The high-speed transceiver lanes (SERDES) require 90 ohm differential impedance with tight length matching (<0.1 mm). Place the 25 MHz reference clock crystal within 10 mm of the dedicated clock pins, with a guard ring of ground vias. The TQFP-144 footprint is hand-solderable but use a reflow profile per IPC J-STD-020 for production.
When using M2S010-TQG144 in motor-control designs, isolate the analog sense-amp paths (INA819IDR or equivalent) from the digital FPGA I/O by at least 3 mm or by using a guard trace tied to analog ground. The FPGA I/O switching transients can couple into current-sense amplifier inputs and create torque ripple. Use RC filters (1 kohm + 100 pF) on each sense input. Synchronize the FPGA-generated PWMs to the ADC sample instant to minimize switching-noise aliasing.
Do not assume the 512 KB eNVM is byte-writable like Flash memory; eNVM on SmartFusion2 has endurance limits around 10K-100K cycles per sector and write operations stall the Cortex-M3 for milliseconds. Use eNVM for boot firmware and constants only, not for high-rate data logging. Do not enable the Cortex-M3 before VDD_CORE and VPP have fully ramped; otherwise the device may latch up. Always sequence power with a supervisor such as LTC2934 or TPS3823.
コンプライアンス情報
RoHS and lead-free per Microchip product page. Not AEC-Q100 qualified (industrial-grade M2S010-TQG144I targets industrial, not automotive). Halogen-free status not stated explicitly in the provided data.
