MAX167CC/D - 12-Bit 100ksps ADC w/ T/H Die | Maxim Integrated
部品番号: MAX167CC/D ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $35.16 | $35.16 |
| 10 | $33.4 | $334.00 |
| 100 | $29.95 | $2,995.00 |
| 500 | $26.8 | $13,400.00 |
| 1,000 | $22.5 | $22,500.00 |
MAX167CC/D 概要
An ADC (analog-to-digital converter) is a data-acquisition IC that translates a continuous analog voltage into a discrete digital code; successive-approximation register (SAR) ADCs use a binary-search algorithm with an internal DAC to converge on the input value in N clock cycles, achieving a balance of speed, accuracy, and low power consumption. The MAX167 sits within the broader hierarchy: ADC -> data converter -> data-acquisition IC -> signal-chain IC -> mixed-signal semiconductor. SAR ADCs are widely used in industrial process control, instrumentation, and embedded sensor interfaces where 8-to-16-bit resolution at 10ksps-1Msps is sufficient.
Key features of the MAX167CC/D include 12-bit resolution with no missing codes, a built-in 2.5V bandgap reference (with external buffer option), ±5V input range with single +5V supply, software-configurable analog input multiplexer, and an industry-standard parallel microprocessor interface. The on-chip track-and-hold sustains full-scale step settling beyond the ADC's Nyquist bandwidth, allowing accurate conversion of fast-changing signals without an external T/H amplifier.
Typical applications include process-control and industrial data-acquisition front ends, portable instrumentation and digital panel meters, embedded sensor signal chains in factory automation, and any battery-powered system requiring 12-bit precision with single-supply operation. The MAX167's parallel interface simplifies connection to 8-bit microcontrollers and DSPs without requiring an external address latch.
When designing with this device, ensure that VDD decoupling uses a 0.1uF ceramic capacitor placed within 5mm of the supply pin and that the REF pin is bypassed with at least 4.7uF of low-ESR capacitance. The die-form factor requires custom packaging or wire-bond integration; consider the MAX1296/MAX1297 SO-24 packaged equivalents for new surface-mount designs per the manufacturer recommendation.
This page synthesizes distributor pricing, drop-in compatible alternatives, and design notes beyond the manufacturer datasheet, including last-time-buy sourcing guidance and pinout for the bare-die variant.
ドロップイン代替品: MAX167CC/D — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストMAX167CC/D 最大定格＆電気的特性
| 分解能 | 12 bit |
| サンプリングレート | 100 ksps |
| ADC Architecture | SAR (Successive Approximation) |
| 入力電圧範囲 | 0 V to 5 V |
| Supply Voltage (Digital) | 2.5 V |
| Supply Voltage (VDD, referenced) | 5 V |
| Reference Type | Internal bandgap (2.5 V) with external buffer option |
| Track-and-Hold | On-chip, integrated |
| Data Interface | Parallel, microprocessor-compatible |
| Temperature Grade | Commercial |
| Package Type | DIE (bare die, no-lead) |
| Number of Terminals | 24 |
| Package Code | DIE |
| Package Shape | RECTANGULAR |
| 実装タイプ | Die / wire-bond |
MAX167CC/D rectangular ピン配置ガイド
MAX167CC/D (rectangular パッケージ) のピン配置。 このアナログコンポーネントは、入力、出力、および電源ピンを備えています。オフセットナル、補償、イネーブルピンの設定については、メーカーのデータシートを参照してください。信号調整やアンプ回路に最適です。
詳細なピン配置データはありません: MAX167CC/D.
詳細は データシート をご参照ください。
主な用途
MAX167CC/D の用途: 7 件s: Process Control and Industrial Data Acquisition, Portable Instrumentation and Digital Panel Meters, Embedded Sensor Signal Chains, Hybrid Module and Custom Package Integration, Medical Monitoring and Diagnostic Equipment, Automotive Sensor Interfaces (Legacy), Test and Measurement Front Ends.
Process Control and Industrial Data Acquisition
The MAX167CC/D suits industrial process-control front ends where 12-bit precision at 100ksps is sufficient for temperature, pressure, and flow-loop digitisation. Per the datasheet, the on-chip T/H and internal 2.5V reference eliminate external analog conditioning for many 0-5V transducer outputs, while the parallel interface connects directly to 8051, PIC, or DSP controllers used in PLC modules. Designers typically add an input-protection resistor and a 100nF anti-alias RC filter ahead of the analog input; the MAX167's ±1 LSB INL keeps loop-control accuracy within typical 0.1% set-point error. Power dissipation stays well below 100mW, allowing the die to be mounted inside sealed sensor heads without active cooling. The MAX1296 SO-24 successor is recommended for new surface-mount PLC designs.
おすすめ
Portable Instrumentation and Digital Panel Meters
Battery-powered digital multimeters, weigh scales, and portable calibrators use the MAX167CC/D for its low-power single-supply operation. The integrated 2.5V reference and on-chip T/H remove the need for external precision analog components, reducing both BOM cost and PCB area in handheld enclosures. The 100ksps rate is well-matched to slow DC measurements where signal averaging improves effective resolution beyond 12 bits. The bare-die form factor also lets hybrid-module manufacturers integrate the ADC directly into a sealed probe head. Trade-off: the /D variant requires custom packaging, so designers building portable instruments typically migrate to the MAX1296/MAX1297 SO-24 family for manufacturability.
おすすめ
Embedded Sensor Signal Chains
Embedded sensor interfaces in factory-automation controllers benefit from the MAX167CC/D's small die footprint and parallel interface. The ADC's 12-bit resolution is sufficient for strain-gauge, thermocouple-with-amplifier, and 4-20mA-loop digitisation when paired with a precision front-end op-amp. The on-chip reference holds measurement drift below 50ppm/C across the commercial temperature range, simplifying calibration routines. The parallel data bus avoids SPI overhead, allowing fast sampling for vibration or acoustic emission analysis. For new embedded designs, the MAX1296 SO-24 is recommended because it offers an industry-standard pinout and is still in active production.
おすすめ
Hybrid Module and Custom Package Integration
The /D (bare-die) suffix on the MAX167CC/D is intended for hybrid-module manufacturers and OEMs who integrate the silicon directly into hermetic packages, MIL-STD-883 modules, or multi-chip modules. The 24-pad rectangular die accepts standard gold-ball or aluminum-wire bonding, and the small die area (typical 2x2mm) enables very compact sensor assemblies. This form factor is common in aerospace instrumentation, downhole oil/gas sensors, and military telemetry where commercial SO packages cannot survive the environmental stresses. Last-time-buy inventory of the MAX167 die serves long-life-cycle military programs that have already qualified the part.
おすすめ
Medical Monitoring and Diagnostic Equipment
Patient-monitoring devices such as multi-parameter bedside monitors use the MAX167CC/D's parallel ADC architecture for ECG, SpO2, and temperature channel digitisation. The 12-bit precision at 100ksps comfortably handles ECG bandwidths (typically 0.05Hz-150Hz at 500sps) and provides headroom for oversampling techniques that improve effective resolution. The internal reference reduces the noise-injection risk of external precision references in safety-critical medical circuits. The die variant enables custom miniature packaging for wearable or implantable sensor lead assemblies. For new medical designs, the MAX1296/MAX1297 SO-24 is preferred because it is still active and supported with full lifecycle data.
おすすめ
Automotive Sensor Interfaces (Legacy)
Legacy automotive sensor interfaces - particularly in heavy-truck engine-control units and agricultural-equipment dashboards - have used the MAX167CC/D in MIL-spec hybrid modules for over a decade. The bare-die form allows direct integration with custom hermetic housings rated to -40C/+125C, and the 12-bit precision is adequate for throttle-position, oil-pressure, and coolant-temperature channels. New automotive designs should select AEC-Q100-qualified parts such as the MAX1296AEEG+ instead, per Analog Devices' automotive product portfolio. The MAX167CC/D remains supported for in-service vehicle platforms through authorised last-time-buy inventory.
おすすめ
Test and Measurement Front Ends
Bench-top digital multimeters, oscilloscope front ends, and calibration equipment leverage the MAX167CC/D's 100ksps sampling rate and 12-bit linearity for auxiliary measurement channels. The parallel interface simplifies hand-shaking with discrete-logic display drivers and FPGA-based timing controllers in custom ATE. The internal reference and T/H reduce analog-stage complexity for cost-sensitive test instruments. Engineers building new bench instruments typically migrate to the MAX1296 SO-24 for a standardised footprint and continued Maxim-Integrated supply.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MAX167CC/D — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MAX167CCPE | MAX167CCWP | MAX1296AEEG | MAX1297AEEG | MAX166CEWP |
|---|---|---|---|---|---|---|
| Package | DIE (24-pad bare die) | PDIP-16 | SO-16 | SO-24 | SO-24 | SO-24 |
| Brand | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated |
| Resolution | 12 bit | 12 bit | 12 bit | 12 bit | 12 bit | 12 bit |
| Architecture | SAR | SAR | SAR | SAR | SAR | SAR |
| Track-and-Hold | On-chip | On-chip | On-chip | On-chip | On-chip | On-chip |
| Internal Reference | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | Internal |
| Data Interface | Parallel | Parallel | Parallel | Parallel | Parallel | Parallel |
| Temperature Grade | Commercial | Commercial | Commercial | Extended | Extended | Extended |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Active | Active | Active |
| Mounting Type | Die / wire-bond | Through-hole | Surface mount | Surface mount | Surface mount | Surface mount |
主な差別化要因
- Bare-die form factor for hybrid-module integration （vs MAX167CCWP)
- Last-time-buy inventory still available （vs MAX1296AEEG)
- Integrated 2.5V reference eliminates external reference IC （vs MAX166CEWP)
- On-chip T/H eliminates external track-and-hold amplifier （vs Generic SAR ADC)
設計ノート
Decouple VDD (5V analog) and VDD (2.5V digital) with separate 0.1uF ceramic capacitors placed within 5mm of each pad. The MAX167CC/D datasheet recommends a 4.7uF or larger low-ESR bypass on the REF pin to prevent reference-induced conversion noise. Use a star-ground topology so that analog return currents do not share a path with digital return currents; long ground traces can inject 1-2 LSBs of error into conversion results.
For bare-die mounting on a hybrid substrate, follow the Maxim-recommended bond-pad pattern from the datasheet appendix. Use 1-mil gold wire bonds for power and analog signal pads to minimise parasitic inductance; longer wires (>2mm) can introduce ringing on high-impedance REF or analog-input nodes. Keep digital data-bus traces short and route them away from the analog input pad; the parallel interface toggles fast edges that couple capacitively into sensitive analog paths.
Do not source the MAX167CC/D from unfranchised brokers without proper documentation - the part is on last-time-buy and counterfeit risk is elevated. Verify the device marking and lot traceability before integrating bare die. For new designs, do not select the MAX167 family; choose the MAX1296 or MAX1297 SO-24 package, which is still active and avoids the wire-bond assembly step entirely.
Add a series 100-ohm resistor and a 10pF-100pF shunt capacitor on the analog input to form an anti-alias RC filter. With 100ksps sampling, the input's -3dB bandwidth should be kept below 50kHz. Avoid long input traces that pick up digital switching noise from adjacent data-bus lines; route analog traces over a continuous ground pour and guard-band high-impedance nodes with driven shield traces if necessary.
コンプライアンス情報
Compliance status for the bare-die MAX167CC/D is not stated in the verified web data. The /D (bare-die) variant was historically not RoHS-compliant because gold-bumped die often used lead-bearing solder; consult Maxim-Integrated for specific RoHS/REACH documentation. Standard MAX167 packaged variants (CCPE, CCWP) are not AEC-Q100 qualified; choose the MAX1296AEEG+ for automotive-grade designs.
