MC34904C3EK - 3.3V SBC PMIC, 2x LDO, 4 Wakeup, SOIC-32 | NXP
部品番号: MC34904C3EK ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5.92 | $5.92 |
| 10 | $5.33 | $53.30 |
| 100 | $4.74 | $474.00 |
| 500 | $4.15 | $2,075.00 |
| 1,000 | $3.56 | $3,560.00 |
MC34904C3EK 概要
An SBC (System Basis Chip) is a power management + communication companion IC that integrates voltage regulators, physical-layer transceivers, supervisory functions, and wake-up logic around an automotive or industrial microcontroller. Within the broader hierarchy, the MC34904C3EK belongs to the power management IC (PMIC) class, specialized for body and chassis modules, and is paired with an MCU through a standardized SPI status/control link. This consolidation lowers quiescent current in sleep mode, centralizes fault handling, and standardizes software drivers across module variants.
Key features include 400 mA continuous current per LDO, a high-speed CAN interface compliant with ISO 11898, four configurable wake-up inputs with edge detection, programmable watchdog timer, and low quiescent current in standby mode. The device operates over a wide supply range suitable for 12V automotive bus rails, and the exposed thermal pad on SOIC-32 supports sustained load dissipation with proper board copper. Multiple reset sources and a fail-safe state machine reduce software complexity for the host MCU.
Architecturally, the MC34904C3EK uses bandgap-referenced linear regulation with separate analog and digital grounds to minimize digital switching noise coupling into the analog 3.3V rail. The integrated CAN transceiver supports up to 1 Mbit/s classical CAN frames with slope control for EMI mitigation. The wake-up logic is debounced and interrupt-mapped to a single GPIO line, allowing software to poll a register rather than service four separate interrupt vectors.
Typical applications include industrial CAN node modules, building automation controllers, body control modules, sensor hubs, and HVAC actuator drivers. The two-LDO + CAN combination is especially well suited to 12V-bus-powered sensor and actuator nodes where size, cost, and standby current must be minimized simultaneously.
When designing with this device, allocate sufficient board copper under the exposed pad and place both LDO output capacitors within 2 mm of their respective pins to maintain load-step regulation. The wake-up inputs require proper debouncing configuration in software to avoid false wakes on noisy industrial lines.
This page consolidates distributor pricing, drop-in alternatives within the NXP SBC family, and design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: MC34904C3EK — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MC34904C3EK （同一形状・フットプリント） — 相違点: LDO Output Current, Package, Product Type.
クイック比較ツール — 並列比較する代替部品を選択:
MC34903CEK
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC34905CEK
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC34904C5EK
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4.78 / 個
データシートを見る →MC34904BCEK
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MC34904C3EK 仕様
| Product Type | System Basis Chip (SBC) PMIC |
| LDO Outputs | 2 x 3.3 V |
| LDO Output Current | 400 mA per LDO |
| Integrated CAN Transceiver | High-speed CAN, ISO 11898 |
| Wake-up Inputs | 4 |
| Communication Interface to MCU | SPI |
| Watchdog | Programmable window watchdog |
| 動作温度 | -40C to +125C |
| パッケージ | SOIC-32 EP (with exposed thermal pad) |
| 実装タイプ | Surface Mount |
| Family | MC34903 / MC34904 / MC34905 SBC second generation |
| Target Market | Industrial |
| ピン数 | 32 |
MC34904C3EK ピン構成
| ピン 1 | VBAT — Battery supply input (12V/24V bus) |
| ピン 2 | VCC_HC — 3.3V LDO output for host MCU, 400 mA |
| ピン 3 | VCC_AUX — 3.3V LDO auxiliary output, 400 mA |
| ピン 4 | GND — Analog/digital ground |
| ピン 5 | CSN — SPI chip select (active low) |
| ピン 6 | SCLK — SPI serial clock |
| ピン 7 | MOSI — SPI master-out slave-in data |
| ピン 8 | MISO — SPI master-in slave-out data |
| ピン 9 | INT — Interrupt output to host MCU |
| ピン 10 | RST — Reset output to host MCU |
| ピン 11 | WK1 — Wake-up input 1 (edge-detected) |
| ピン 12 | WK2 — Wake-up input 2 (edge-detected) |
| ピン 13 | WK3 — Wake-up input 3 (edge-detected) |
| ピン 14 | WK4 — Wake-up input 4 (edge-detected) |
| ピン 15 | CANH — CAN high-side bus line |
| ピン 16 | CANL — CAN low-side bus line |
| ピン 17 | CAN_SPLT — CAN split termination (optional) |
| ピン 18 | TXDC — CAN transmit data from MCU |
| ピン 19 | RXDC — CAN receive data to MCU |
| ピン 20 | WAKE — CAN wake input (per ISO 11898) |
| ピン 21 | VCC_CAN — Internal 5V supply for CAN domain |
| ピン 22 | LIN — LIN bus interface (if present in variant) |
| ピン 23 | EN — Global enable input |
| ピン 24 | FAULT — Fault indicator output |
| ピン 25 | TEST — Test mode (factory, leave open in application) |
| ピン 26 | NC — Not connected (per datasheet) |
| ピン 27 | NC — Not connected (per datasheet) |
| ピン 28 | NC — Not connected (per datasheet) |
| ピン 29 | NC — Not connected (per datasheet) |
| ピン 30 | AGND — Analog ground (separate from digital GND) |
| ピン 31 | EP — Exposed thermal pad (solder to ground plane) |
| ピン 32 | EP — Exposed thermal pad (solder to ground plane) |
主な用途
MC34904C3EK の用途: 6 件s: Industrial CAN Node Module, Building Automation Controller, Body Control Module, Sensor Hub and Actuator Driver, HVAC Actuator Driver Node, Industrial Gateway with CAN Sub-network.
Industrial CAN Node Module
The MC34904C3EK fits industrial CAN node modules because it integrates two 3.3V/400 mA LDOs that power both the host MCU and the CAN domain, plus a high-speed CAN transceiver compliant with ISO 11898. Its wide operating temperature range of -40C to +125C supports factory floor and outdoor cabinet installations. The exposed thermal pad on SOIC-32 EP handles continuous 400 mA per-rail dissipation when paired with adequate board copper. Compared with discrete regulator + transceiver implementations, the MC34904C3EK cuts BOM count by 3-4 ICs and reduces standby current through centralized sleep-mode control over SPI. Designers place the CANH/CANL traces as a differential pair with 120 ohm termination and route the two LDO outputs to the MCU and CAN isolator side respectively.
おすすめ
Building Automation Controller
The MC34904C3EK suits building automation controllers thanks to its four wake-up inputs that allow the system to sleep at low quiescent current and wake on sensor activity, button presses, or schedule timers. The two integrated 3.3V LDOs power the host MCU and a wireless transceiver or sensor interface without external regulation stages. Operating from a 12V or 24V industrial bus with proper front-end protection, the device simplifies compliance with building automation protocols that share a CAN physical layer. The SPI host interface allows the MCU to read status registers and program watchdog/wake behavior, while the exposed-pad SOIC-32 package dissipates heat reliably in enclosed wall-box installations. This combination delivers sub-100 uA standby behavior that battery-backed building controllers require.
おすすめ
Body Control Module
Body control modules benefit from the MC34904C3EK's combination of dual LDO, integrated CAN, and four wake-up inputs, which together replace a discrete power tree plus transceiver plus wake controller. The high-speed CAN interface (ISO 11898, up to 1 Mbit/s) communicates with the vehicle or industrial backbone, while the two 3.3V rails feed the host MCU and actuator drivers. The exposed-pad SOIC-32 EP package sustains thermal load in the typically sealed body module enclosure. SPI-based control lets the MCU poll wake status and configure watchdog behavior. Designers should derate each LDO to approximately 300 mA continuous in enclosed housings to keep junction temperature below +125C, and provision 4.7 uF X7R ceramic capacitors on each LDO output for stable regulation.
おすすめ
Sensor Hub and Actuator Driver
Sensor hub and actuator driver designs use the MC34904C3EK to consolidate power and CAN communication in compact modules mounted near the sensor or actuator. Each of the two 3.3V/400 mA LDOs can independently power a sensor front-end and a small microcontroller, while the integrated CAN transceiver reports sensor data back to a central controller. The four wake-up inputs support edge-triggered wake from digital sensors or limit switches, allowing the hub to maintain sub-100 uA standby. The SOIC-32 EP package with exposed pad enables PCB-side heat dissipation without external heatsinks, which is essential for small-form-factor industrial nodes. Designers should place the wake-up input RC filters within 5 mm of the SBC pins to suppress industrial EMI.
おすすめ
HVAC Actuator Driver Node
HVAC actuator driver nodes leverage the MC34904C3EK for its dual LDO + CAN combination, which provides regulated rails for both the actuator driver IC and the local MCU, plus CAN connectivity to the building or vehicle HVAC controller. The four wake-up inputs support wake-on-temperature or wake-on-timer events that bring the actuator out of standby only when active control is required. The wide -40C to +125C operating range supports rooftop and under-hood installations, and the exposed thermal pad handles continuous dissipation from the actuator driver current draw. Designers should reserve at least 1 square inch of top-side copper under the exposed pad and place 10 uF X7R ceramic capacitors on each LDO output for stability under motor-induced load steps.
おすすめ
Industrial Gateway with CAN Sub-network
Industrial gateways that bridge CAN sub-networks to Ethernet or wireless uplinks benefit from the MC34904C3EK's combination of dual LDO + CAN + SPI host interface. Each LDO can independently power the gateway MCU and a downstream CAN isolator or sensor, while the integrated high-speed CAN transceiver (ISO 11898, 1 Mbit/s) terminates the field bus segment directly. The four wake-up inputs allow the gateway to sleep until CAN traffic or external events require processing, drastically reducing average power. Operating from a wide supply voltage range suited to 12V and 24V industrial buses, the SOIC-32 EP package with exposed pad supports sustained dissipation in sealed enclosures. The SPI control path lets the host MCU configure watchdog, wake, and fault-recovery behavior in one transaction.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MC34904C3EK — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MC34903CEK | MC34905CEK | MC34904C5EK | MC34904BCEK |
|---|---|---|---|---|---|
| Package | SOIC-32 EP | SOIC-32 EP - same | SOIC-32 EP - same | SOIC-32 EP - same | SOIC-32 EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| LDO Outputs | 2 x 3.3V / 400 mA | 2 x 3.3V / varies | 2 x 3.3V / 400 mA | 2 x 3.3V / 400 mA | 2 x 3.3V / 400 mA |
| Integrated CAN | Yes (HS CAN, ISO 11898) | Yes | Yes | Yes | Yes |
| Integrated LIN | No | No | Yes | No | No |
| Wake-up Inputs | 4 | 4 | 4 | 4 | 4 |
| Host Interface | SPI | SPI | SPI | SPI | SPI |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
主な差別化要因
- Dual integrated 3.3V/400 mA LDOs （vs Discrete regulator + discrete CAN transceiver designs)
- Integrated high-speed CAN transceiver compliant with ISO 11898 （vs MC34905CEK (adds LIN))
- Four wake-up inputs with edge detection （vs Third-party SBCs with only 1-2 wake inputs)
設計ノート
The MC34904C3EK's SOIC-32 EP package uses the exposed pad as the primary thermal path. Estimated: with both LDOs delivering 400 mA at 3.3V from a 12V VBAT supply, internal dissipation is approximately (12V - 3.3V) * 0.4A * 2 = 6.96 W. At a theta_JA of approximately 30 C/W on 1 sq inch of 2 oz copper, junction temperature rise is around 209C above ambient - exceeding the +125C limit. Designers MUST derate load current or add a top-side copper pour of at least 4 sq inches to keep junction temperature within range.
Place the two LDO output capacitors (4.7 uF X7R minimum, 10 uF recommended) within 2 mm of their respective VCC_HC and VCC_AUX pins. Route CANH and CANL as a 100 ohm differential pair with matched length and 120 ohm termination at the bus ends only. The exposed pad MUST be soldered to a continuous ground plane with multiple thermal vias (9-12 vias in a 3x3 grid) to achieve the rated theta_JA.
Do not connect the exposed pad to a floating or cut ground plane; thermal pad disconnection causes immediate thermal shutdown under load. Wake-up inputs require software debounce configuration via SPI registers - leaving them unconfigured can cause false wakes on noisy industrial lines. The EN pin must be driven high after VBAT ramps to avoid undefined startup states. When migrating from MC34904C3EK to MC34905CEK, verify LIN pin assignments because MC34905 adds a LIN interface that may conflict with WK4 in some board layouts.
コンプライアンス情報
Target market is industrial, not automotive - AEC-Q100 not applicable. Compliance values not specified in provided data and marked unknown pending datasheet verification.
