MK22DN512VDC5 - 50MHz Cortex-M4 512KB MCU | NXP
部品番号: MK22DN512VDC5 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $10.1288 | $10.13 |
| 10 | $10.1288 | $101.29 |
| 100 | $10.1288 | $1,012.88 |
| 500 | $10.1288 | $5,064.40 |
| 1,000 | $10.1288 | $10,128.80 |
| 3,000 | $10.1288 | $30,386.40 |
MK22DN512VDC5 概要
An ARM Cortex-M4 microcontroller combines a 32-bit processor core with embedded flash, SRAM, peripherals, and communication interfaces in one integrated circuit. The Kinetis K20 family is positioned within the broader embedded MCU hierarchy, where deterministic control, low-power operation, and peripheral integration support industrial, consumer, communications, and human-interface designs.
The MK22DN512VDC5 provides connectivity including I2C, IrDA, SPI, UART/USART, USB, and USB OTG. Its listed peripherals include DMA, I2S, LVD, POR, PWM, and WDT, making it suitable for designs that need multiple serial interfaces and embedded signal handling without external protocol controllers. The device also supports 1.8 V, 2.5 V, and 3.3 V operation according to the distributor specification summary.
This Kinetis K20 part is identified as a 50 MHz, 32-bit MCU with 512 KB (512K x 8) flash memory and 56 I/O. Its package is a 121-pin MAPBGA, also described in distributor listings as 121-XFBGA (8x8). The BGA format supports dense routing in space-constrained embedded equipment while requiring careful PCB layout and assembly planning.
Typical application areas include USB-connected embedded controllers, industrial interface modules, sensor and actuator systems, audio or I2S peripheral designs, and general-purpose embedded control platforms. The Cortex-M4 architecture is suitable for control loops, protocol handling, and moderate signal-processing tasks where real-time embedded performance is more important than high-end application-processor capability.
Designers should confirm the complete electrical, timing, pin multiplexing, memory, and thermal details against the NXP datasheet before layout. In particular, BGA routing requires controlled escape geometry, reliable power and ground distribution, and assembly validation. The verified distributor data also describes the part as active, but current inventory, lifecycle notices, and package-specific manufacturing status should be reconfirmed with NXP or an authorized distributor.
ドロップイン代替品: MK22DN512VDC5 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MK22DN512VDC5 （同一形状・フットプリント） — 相違点: Connectivity, Core Processor, Manufacturer, Package, Series.
クイック比較ツール — 並列比較する代替部品を選択:
MK11DN512VMC5
✅ ドロップイン✓ 在庫あり
$7.8 / 個
データシートを見る →MK22DN512VDC5 最大定格＆電気的特性
| Core Processor | ARM Cortex-M4, 32-bit |
| Series | Kinetis K20 |
| 最大クロック周波数 | 50 MHz |
| Flash Memory | 512 KB (512K x 8) |
| Number of I/O | 56 |
| パッケージ | 121-XFBGA (8x8 mm) |
| Core Size | 32-bit |
| Connectivity | I2C, IrDA, SPI, UART/USART, USB, USB OTG |
| Peripherals | DMA, I2S, LVD, POR, PWM, WDT |
| Supply Voltage Options | 1.8 V, 2.5 V, 3.3 V |
| Product Status | Active |
| Manufacturer | NXP USA Inc. |
| Legacy Manufacturer | Freescale Semiconductor, Inc. |
| Package Type | MAPBGA |
| 実装タイプ | Surface Mount |
| Datasheet File Size | 283 KB |
| Datasheet Publication Date | 2020-12-14 |
MK22DN512VDC5 mapbga ピン配置ガイド
MK22DN512VDC5 (mapbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MK22DN512VDC5.
詳細は データシート をご参照ください。
主な用途
MK22DN512VDC5 の用途: 6 件s: USB Embedded Controller, Industrial Interface Module, Sensor and Actuator Control, Audio and I2S Interface, Consumer Connectivity Hub, Low-Power Embedded Control.
USB Embedded Controller
The MK22DN512VDC5 fits USB-connected embedded control because the verified feature list includes USB and USB OTG alongside a 50 MHz ARM Cortex-M4 core and 512 KB flash. It can coordinate USB firmware, control logic, and peripheral traffic without requiring a separate host controller for every product variant. The 121-XFBGA package supports dense routing, but USB power, transceiver, signal-integrity, and firmware requirements must be confirmed against the NXP documentation. USB role, supported speed, and exact pin assignments are not fully specified in the supplied data, so engineers should verify them before committing a board design.
おすすめ
Industrial Interface Module
The MK22DN512VDC5 is suitable for industrial interface modules that need a deterministic 50 MHz Cortex-M4 core and several communication paths. Its verified connectivity includes UART/USART, SPI, I2C, IrDA, USB, and USB OTG, enabling a single MCU to manage sensors, actuators, local storage, or an upstream host. DMA can offload data movement, while PWM, watchdog, LVD, and POR functions support controlled embedded behavior. The listed 56 I/O and 121-XFBGA package provide routing flexibility, but industrial temperature limits, isolation, surge requirements, and grounding must be confirmed separately.
おすすめ
Sensor and Actuator Control
The MK22DN512VDC5 can serve as the central controller in a sensor and actuator platform because it combines a 32-bit Cortex-M4 processor, 512 KB flash, I2C, SPI, UART/USART, DMA, PWM, and watchdog support. A firmware-driven design can acquire data, apply control logic, and generate actuator timing while reducing the component count of a discrete control board. The verified data does not specify the ADC resolution or channel count, so analog sensor designs must confirm those details in the NXP datasheet. Use appropriate signal conditioning and protection even when the communication interface is digital.
おすすめ
Audio and I2S Interface
The MK22DN512VDC5 is applicable to audio-oriented embedded designs because I2S is included in the verified peripheral list alongside DMA, PWM, and multiple serial interfaces. An I2S-capable MCU can manage digital audio data movement, buffering, and control functions in compact consumer or industrial equipment. The supplied information does not confirm codec support, audio-clock limits, sample-rate coverage, or analog audio performance, so those requirements must be checked directly against the NXP documentation. The 121-XFBGA package can simplify dense mixed-signal routing when the board stack-up and assembly process are well controlled.
おすすめ
Consumer Connectivity Hub
The MK22DN512VDC5 can be used in consumer connectivity hubs that combine local control with USB, UART, SPI, or I2C device management. Its 50 MHz Cortex-M4 core provides embedded processing capacity while the listed connectivity supports multiple peripheral classes. USB OTG can be useful in portable products where a device must interact with different host roles, but the exact USB implementation and electrical requirements must be verified. Firmware partitioning, bootloader security, ESD protection, and power-budget analysis remain application-specific engineering tasks not fully covered by the supplied distributor data.
おすすめ
Low-Power Embedded Control
The MK22DN512VDC5 is appropriate for embedded control platforms that need multiple peripheral functions in a single 50 MHz Cortex-M4 MCU. The verified specification includes 1.8 V, 2.5 V, and 3.3 V supply options, while DMA and watchdog support can reduce processing overhead and improve system supervision. Low-power mode details, current consumption, wakeup sources, and brownout behavior are not included in the supplied data and must be confirmed before battery-life calculations. Designers should also account for BGA thermal performance and the power requirements of connected sensors or communications.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MK22DN512VDC5 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MK11DN512VMC5 |
|---|---|---|
| Package | 121-XFBGA (8x8 mm) | 121-pin MAP-BGA |
| Brand | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M4 | ARM Cortex-M4 |
| Flash Memory | 512 KB | 512 KB |
| Core Size | 32-bit | 32-bit |
| Supply Voltage Options | 1.8 V, 2.5 V, 3.3 V | 1.8 V, 2.5 V, 3.3 V |
主な差別化要因
- Verified connectivity breadth for embedded control （vs MK11DN512VMC5)
- Kinetis K20 family positioning （vs MK11DN512VMC5)
- Verified flash and processor configuration （vs MK11DN512VMC5)
設計ノート
Treat the 121-XFBGA (8x8 mm) footprint as a controlled-layout item. Use the official NXP land pattern, ball map, escape-routing guidance, and assembly process requirements rather than deriving geometry from the package size alone. Reserve adequate space for power and ground planes, escape vias, test access, and thermal-via arrays. Confirm whether the chosen PCB stack-up supports the required BGA assembly capability before releasing fabrication data.
Plan the 1.8 V, 2.5 V, or 3.3 V supply rails only after checking the exact device variant, I/O voltage domains, external interface requirements, and maximum current conditions in the NXP documentation. Place decoupling capacitors close to the appropriate supply balls, maintain a low-impedance ground return, and verify startup sequencing for connected USB, serial, and memory devices. The supplied distributor data identifies voltage options but does not provide the complete power-tree ratings.
USB, UART, SPI, and I2C interfaces have different rise-time, impedance, and topology requirements. Preserve short, continuous return paths, control crosstalk between adjacent high-speed nets, and follow the NXP recommended pin multiplexing before assigning functions. USB signals require particular attention to controlled impedance, reference-plane continuity, ESD protection, and connector placement; the supplied data does not specify the required USB speed or transceiver arrangement.
Do not treat the 121 physical balls as 121 usable I/O signals. The verified listing identifies 56 I/O, and the complete pin function, power, ground, reserved, and no-connect assignments must be taken from the NXP datasheet. Also do not assume that a similar 121-BGA Kinetis part is interchangeable: the comparison data identifies K11 and K22 family differences but does not verify ball compatibility, peripheral parity, or firmware-level behavior.
コンプライアンス情報
The supplied data identifies the product as active and the manufacturer as NXP USA Inc., but does not verify RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Obtain current NXP documentation before making a compliance declaration.
