MPC8271CZQMIBA - PowerQUICC II MPC82xx 266MHz 32-Bit MPU | NXP
部品番号: MPC8271CZQMIBA ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.85 | $6,485.00 |
| 250 | $60.1 | $15,025.00 |
| 500 | $56.4 | $28,200.00 |
MPC8271CZQMIBA 概要
What is a PowerQUICC II processor? PowerQUICC II is NXP's (formerly Freescale) communications-processor family that combines a PowerPC execution core with on-chip networking peripherals such as fast Ethernet MACs, ATM, HDLC, and TDM interfaces. The MPC8271 is part of the MPC82xx sub-family, sitting in the hierarchy: PowerQUICC II -> MPC82xx -> MPC8271; its core lineage is PowerPC G2_LE -> PowerPC 603e -> PowerPC family -> embedded 32-bit RISC microprocessor. It targets cost-sensitive networking equipment where hardware offload of packet processing is more economical than a general-purpose CPU.
Key features include a 16-Kbyte instruction cache and 16-Kbyte data cache, a 32-bit PCI interface, a 32-bit local bus, and multiple serial communications controllers for T1/E1, UTOPIA, and Fast Ethernet. The integrated CPM (Communications Processor Module) handles low-level protocol tasks, freeing the core to run the application stack. Memory management is supported through a memory controller that connects to SDRAM, ROM/Flash, and peripherals with configurable chip selects. The -40C to +105C extended-temperature operation supports industrial and telecom environments where commercial-grade parts are inadequate.
The MPC8271 architecture uses a dual-engine approach: the G2_LE core runs the operating system and control plane, while the CPM engine handles DMA-driven serial protocol processing. This division enables wire-speed handling of multi-channel TDM streams without loading the host core. The 516-PBGA package provides the routing density required for the wide parallel buses and high-pin-count serial interfaces, and the 27x27 mm body is compatible with standard high-density PCB assembly processes.
Typical applications include small-to-medium enterprise routers, integrated access devices, DSLAM line cards, industrial control gateways, and embedded networking where PCI-v2 support and extended-temperature operation are required. The device is well suited to legacy migration designs that need an upgrade path from earlier MPC860 designs while preserving software investment. The integrated CPM and PCI-v2 interfaces allow the part to bridge legacy telecom infrastructure with newer embedded control buses.
When designing with this part, allocate sufficient PCB area for the 516-PBGA footprint and plan thermal management for industrial-grade operation. Designers should consult the NXP reference manual and errata list to validate timing closure on the local-bus and PCI-v2 interfaces for their specific board layout, and verify boot ROM and reset sequencing against the latest NXP documentation.
ドロップイン代替品: MPC8271CZQMIBA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8271CZQMIBA （同一形状・フットプリント） — 相違点: Core Architecture, PCI Interface, Package, Mounting Type, Communications Processor Module.
クイック比較ツール — 並列比較する代替部品を選択:
MPC8271VRMIBA
✅ ドロップイン✓ 在庫あり
$53.4 / 個
データシートを見る →MPC8271ZQMIBA
✅ ドロップイン✓ 在庫あり
$12.85 / 個
データシートを見る →MPC8280CVVUPEA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8275CVRMIBA
✅ ドロップイン✓ 在庫あり
$140.2 / 個
データシートを見る →MPC8271CZQTMFX
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8271CZQMIBA 最大定格＆電気的特性
| Core Architecture | PowerPC G2_LE (MPC82xx family) |
| Number of Cores | 1 |
| データバス幅 | 32-Bit |
| 最大クロック周波数 | 266 MHz |
| 動作温度範囲 | -40C to +105C (industrial extended) |
| Instruction Cache | 16 Kbyte |
| Data Cache | 16 Kbyte |
| パッケージ / ケース | 516-PBGA (27x27 mm) |
| 実装タイプ | Surface Mount |
| PCI Interface | 32-bit PCI 2.2 compliant |
| Local Bus | 32-bit (up to 66 MHz) |
| Communications Processor Module | Yes (CPM with FCC, MCC, SCC, SMC) |
| Serial Interfaces | Fast Ethernet MAC, ATM, HDLC, TDM/UART |
| Memory Controller | SDRAM, ROM/Flash, glueless up to 16 chip selects |
MPC8271CZQMIBA 516-pbga (27x27 mm) ピン配置ガイド
MPC8271CZQMIBA (516-pbga (27x27 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8271CZQMIBA.
詳細は データシート をご参照ください。
主な用途
MPC8271CZQMIBA の用途: 6 件s: Small-to-Medium Enterprise Routers, Integrated Access Devices and DSLAM Line Cards, Industrial Ethernet Gateways, Embedded Telecom Control Plane, Legacy MPC860 Migration Designs, Automotive and Heavy-Equipment Telematics Gateways.
Small-to-Medium Enterprise Routers
The MPC8271CZQMIBA's 266 MHz PowerPC G2_LE core combined with the integrated CPM offload engine makes it well suited to small-to-medium enterprise router designs. The CPM's multi-channel serial controllers handle Fast Ethernet, T1/E1 and TDM framing without loading the host core, allowing wire-speed packet forwarding on integrated access devices. The 32-bit PCI 2.2 interface lets designers connect crypto accelerators, additional Ethernet MACs, or DSL PHY devices via the standard PCI bus. The 516-PBGA package's high pin count exposes the wide memory and PCI buses required for multi-WAN router designs, while the -40C to +105C industrial temperature range supports deployment in unconditioned telecom closets.
おすすめ
Integrated Access Devices and DSLAM Line Cards
In integrated access devices and DSLAM line-card applications the MPC8271CZQMIBA provides the protocol-processing density needed to terminate multiple T1/E1 spans alongside a 10/100 Ethernet uplink. The CPM's FCC and SCC channels handle ATM SAR, HDLC, and TDM framing concurrently, while the G2_LE core runs the management plane and routing stack. The on-chip memory controller gluelessly interfaces to SDRAM and Flash, simplifying line-card BOMs. Engineers pairing the part with a DSL or PON PHY benefit from the PCI 2.2 bus, which gives the PHY a standard attachment point. The extended temperature grade (-40C to +105C) supports outdoor-cabinet and central-office deployments with constrained cooling.
おすすめ
Industrial Ethernet Gateways
For industrial Ethernet gateway and protocol-conversion products the MPC8271CZQMIBA delivers a deterministic 266 MHz execution core paired with deterministic serial-protocol engines. The CPM can bridge industrial protocols (Modbus, Profibus, HDLC-framed serial) to TCP/IP Ethernet traffic without a soft stack on the host core, keeping latency predictable for SCADA and process-control loops. The wide local bus supports glueless connection to industrial Flash and battery-backed SRAM for event logging. Its -40C to +105C operating range covers factory-floor cabinets and outdoor installations where commercial-grade parts would fail. The PCI 2.2 interface lets designers add fieldbus cards such as CAN or additional Ethernet ports for protocol-bridging scenarios.
おすすめ
Embedded Telecom Control Plane
The MPC8271CZQMIBA is well matched to embedded telecom control-plane applications such as base-station controllers, transmission equipment, and central-office supervisory cards. The G2_LE core runs control-plane protocols (SS7, OSPF, IS-IS, MPLS) while the CPM handles the lower-layer TDM and Ethernet bearers, achieving hardware-assisted protocol separation. The PCI 2.2 bus gives designers a standard path for adding T1/E1 framer cards or ATM SAR co-processors when channel density grows beyond the on-chip peripherals. Memory-controller glueless SDRAM/Flash support reduces BOM for cost-sensitive central-office equipment. Industrial extended temperature supports outdoor-cabinet and uncontrolled-ventilation deployments in carrier networks.
おすすめ
Legacy MPC860 Migration Designs
Engineers maintaining or migrating legacy MPC860 designs can use the MPC8271CZQMIBA as a drop-in upgrade path that preserves software investment while adding PCI 2.2, faster core clocks, and a richer CPM feature set. The PowerPC G2_LE core retains the user-mode instruction set of the MPC860's PowerPC 603e core, allowing existing firmware and OS ports to run with minimal modification. Memory-map and interrupt-controller changes are documented in NXP migration notes for predictable porting. The 516-PBGA 27x27 mm package differs from older MPC860 packages, so board rework is required, but the new footprint is well supported by reference designs. The CPM's added Ethernet and ATM channels modernise connectivity without rewriting protocol stacks.
おすすめ
Automotive and Heavy-Equipment Telematics Gateways
The MPC8271CZQMIBA's -40C to +105C industrial extended temperature range and on-chip protocol-processing density make it a candidate for heavy-equipment, agricultural, and rail telematics gateways that aggregate CAN/J1939, GPS, and cellular/Ethernet bearers. The CPM's serial controllers can terminate multiple CAN-style UART/HDLC links alongside Ethernet traffic, while the G2_LE core runs the telematics application stack and over-the-air update logic. PCI 2.2 gives the design a clean attachment point for cellular modems or Wi-Fi co-processors. The 516-PBGA package, however, requires careful PCB layout and vibration analysis for vehicle mounting, and engineers should validate against AEC-Q100 requirements for any safety-relevant subsystem. For purely commercial telematics the part is a robust fit.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8271CZQMIBA — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8271VRMIBA | MPC8271ZQMIBA | MPC8280CVVUPEA | MPC8275CVRMIBA | MPC8271CZQTMFX |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-PBGA (27x27) | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same |
| Core Architecture | PowerPC G2_LE | PowerPC G2_LE - same | PowerPC G2_LE - same | PowerPC G2_LE - same family | PowerPC G2_LE - same family | PowerPC G2_LE - same |
| PCI Interface | 32-bit PCI 2.2 | 32-bit PCI 2.2 - same | 32-bit PCI 2.2 - same | 32-bit PCI 2.2 - same | 32-bit PCI 2.2 - same | 32-bit PCI 2.2 - same |
| Communications Processor Module | Yes (CPM with FCC/MCC/SCC/SMC) | Yes - same | Yes - same | Yes - same family | Yes - same family | Yes - same |
| Lifecycle Status | Obsolete | Obsolete / last time buy | Obsolete / last time buy | Obsolete / last time buy | Obsolete / last time buy | Obsolete / last time buy |
主な差別化要因
- 266 MHz PowerPC G2_LE core with industrial extended temperature range （vs MPC8280CVVUPEA)
- Same-family drop-in variants for second-source flexibility （vs MPC8271VRMIBA)
- Integrated CPM with multi-channel serial protocol offload （vs MPC8275CVRMIBA)
- Glueless SDRAM and Flash memory controller with up to 16 chip selects （vs MPC8271CZQTMFX)
設計ノート
The 516-PBGA (27x27 mm) package requires careful thermal management at the -40C to +105C industrial-extended temperature range. Designers should follow the NXP thermal-application note to calculate theta-JA based on the actual PCB copper area and layer count under the package. Forced airflow is typically required in enclosed telecom cabinets to keep junction temperature within the derating curve. Thermal vias under the die-attach pad are strongly recommended for heat extraction into inner copper planes.
The 516-pin PBGA uses a 1.0 mm ball pitch with full-array routing, requiring a multilayer PCB (typically 6-8 layers) to escape the BGA and route the wide parallel buses (local bus, memory bus, PCI). Controlled-impedance routing for PCI 2.2 (90 ohm differential for the CLK target) and the memory bus is essential for timing closure. Place decoupling capacitors as close as possible to each power pin, and follow the NXP reference design for stackup and via-in-pad recommendations. A solid ground plane beneath the BGA improves signal integrity for the high-speed buses.
When migrating from MPC860 designs, engineers often overlook that the MPC8271's reset and configuration word procedure differs from older PowerQUICC parts. Always consult the MPC8271 reference manual boot chapter and the latest errata list before locking in the boot ROM contents. Also verify PCI 2.2 IDSEL pin mapping because the 516-PBGA ballout places IDSEL on a different ball than some legacy MPC860 packages. Skipping the errata review is the most common source of post-silicon debug effort on this part.
Route the PCI bus traces with matched lengths to within +/- 150 mil on the CLK-to-valid timing budget and keep the CLK signal 90 ohm differential impedance controlled. Isolate the CPM serial-communication pins from the analog PLL supply pins to avoid coupling noise into the system clock. Use a stitching via fence around the BGA perimeter to contain high-speed signal radiation. The local-bus and memory-bus should be length-matched to within the timing-window specified in the reference manual to avoid setup/hold violations at 66 MHz and above.
コンプライアンス情報
RoHS and REACH status could not be confirmed from the retrieved distributor listings for the MPC8271CZQMIBA; engineers should request a compliance letter directly from NXP or authorized distributors (Rochester Electronics, Heisener). The part is not AEC-Q100 qualified - it targets industrial and telecom markets, not automotive safety. Lead-free and halogen-free status is lot-dependent and should be verified by date code.