MPC8308CVMAFD - PowerQUICC II Pro SoC 333MHz e300 | NXP
部品番号: MPC8308CVMAFD ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $178.13 | $178.13 |
| 10 | $165.5 | $1,655.00 |
| 100 | $148.2 | $14,820.00 |
| 500 | $132.75 | $66,375.00 |
| 1,000 | $121.4 | $121,400.00 |
MPC8308CVMAFD 概要
A PowerQUICC II Pro SoC is a communications-centric microprocessor family from NXP (formerly Freescale) that integrates a Power Architecture CPU with networking peripherals and a memory subsystem on a single die. The MPC8308 belongs to the broader PowerQUICC hierarchy (PowerQUICC -> PowerQUICC II -> PowerQUICC II Pro) and is targeted at cost-sensitive, low-power embedded networking applications such as smart-grid gateways, industrial control, and small-to-medium WLAN access points. The 'C' prefix indicates the e300c3 core variant, while 'VM' denotes the MAP-BGA package family and 'AFD' encodes the temperature grade and speed designation.
Key features of the MPC8308CVMAFD include the e300c3 core at 333 MHz, integrated DDR2 memory controller with 16-bit and 32-bit data paths, a local bus controller for glueless connection to flash and peripherals, hardware encryption acceleration, and a wide operating voltage range of 1V (core), 1.8V, 2.5V, and 3.3V I/O. The 473-pin MAP-BGA provides ample signal integrity for the multi-gigabit serial interfaces while keeping board area compact for embedded designs.
Typical applications for the MPC8308CVMAFD include smart-grid home energy gateways, data concentrators, wireless LAN access points, femtocell base stations, consumer printing controllers, industrial control and factory automation, and other low-power networking platforms where integrated gigabit Ethernet and PCI Express simplify board design. The wide temperature range supports both commercial and extended-temperature deployments.
When designing with this device, ensure the DDR2 controller is properly terminated and that the multi-rail power sequence (1V core before 1.8V/2.5V/3.3V I/O) is respected to avoid latch-up. The 473-ball BGA requires a minimum of six PCB layers with via-in-pad recommended for the high-speed DDR2 and RGMII signals, and thermal copper pad soldering is critical for long-term reliability at elevated ambient temperatures.
ドロップイン代替品: MPC8308CVMAFD — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8308CVMAFD （同一形状・フットプリント） — 相違点: Memory Controller, RoHS Status, Mounting Type, Core Architecture, Operating Temperature Range.
クイック比較ツール — 並列比較する代替部品を選択:
MPC8308CVMAFDA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8308VMAGD
✅ ドロップイン✓ 在庫あり
$25.6 / 個
データシートを見る →MPC8308CZQAFD
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8308CZQAGDA
✅ ドロップイン✓ 在庫あり
$25.6 / 個
データシートを見る →MPC8309CVMAFD
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MPC8313CVRAFDA
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MPC8308CVMAFD 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors |
| Core Architecture | Power Architecture e300c3 |
| Core Count | 1 |
| データバス幅 | 32-bit |
| Maximum Core Frequency | 333 MHz |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Process Technology | 0.09 um CMOS |
| Memory Controller | DDR2, up to 266 MHz data rate |
| Local Bus Controller | Yes (8/16/32-bit) |
| PCI Express Interface | 1 x PCIe |
| Ethernet MACs | 2 x 10/100/1000 (MII/RGMII) |
| USB Interface | USB 2.0 High-Speed |
| 電源電圧 | 1.0 V core / 1.8 V / 2.5 V / 3.3 V I/O |
| パッケージ | MAP-BGA-473 (19x19 mm, 0.8 mm pitch) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +85C (extended) |
| RoHS ステータス | Lead-Free, RoHS compliant |
MPC8308CVMAFD ピン構成
| ピン A1 | VDD — Core supply voltage (1.0 V) |
| ピン B2 | DDR_DATA[0] — DDR2 data line 0 |
| ピン C3 | DDR_CLK — DDR2 clock positive |
| ピン D4 | GND — Ground reference |
| ピン E5 | PCIe_TX0 — PCI Express transmit lane 0 |
| ピン F6 | PCIe_RX0 — PCI Express receive lane 0 |
| ピン G7 | RGMII_TXD[0] — Gigabit Ethernet transmit data 0 |
| ピン H8 | RGMII_RXD[0] — Gigabit Ethernet receive data 0 |
| ピン J9 | USB_DP — USB 2.0 data plus |
| ピン K10 | USB_DM — USB 2.0 data minus |
| ピン L11 | LB_DATA[0] — Local bus data 0 |
| ピン M12 | LB_ADDR[0] — Local bus address 0 |
| ピン N13 | TCK — JTAG test clock |
| ピン P14 | TMS — JTAG test mode select |
| ピン R15 | TRST — JTAG test reset |
| ピン T16 | RESET — Global reset input |
| ピン U17 | XTAL_IN — Crystal oscillator input |
| ピン V18 | XTAL_OUT — Crystal oscillator output |
| ピン W19 | CLK_OUT — Clock output reference |
| ピン Y20 | VDD_IO — I/O supply voltage (1.8/2.5/3.3 V) |
主な用途
MPC8308CVMAFD の用途: 6 件s: Smart-Grid Home Energy Gateway, Data Concentrator for AMI Networks, Wireless LAN Access Point, Femtocell Base Station, Consumer Printer Controller, Industrial Control and Factory Automation.
Smart-Grid Home Energy Gateway
The MPC8308CVMAFD is well suited to smart-grid home energy gateways because it integrates a Power Architecture e300c3 core at 333 MHz with two gigabit Ethernet MACs and a hardware-accelerated packet engine. Its DDR2 controller sustains up to 266 MHz data rate, ensuring non-blocking throughput of metering traffic, while the integrated USB 2.0 high-speed interface supports local diagnostics or Zigbee/Wi-Fi module attachment. The wide operating voltage range (1V core plus 1.8/2.5/3.3V I/O) simplifies multi-rail power design. Compared with discrete host CPU plus Ethernet-controller solutions, the MPC8308CVMAFD delivers a single-chip implementation that reduces BOM and PCB area while meeting extended-temperature operation required for utility-side enclosures.
おすすめ
Data Concentrator for AMI Networks
In Advanced Metering Infrastructure (AMI) data concentrators, the MPC8308CVMAFD's dual 10/100/1000 Ethernet MACs provide separate WAN and HAN ports without external switch chips. The e300c3 333 MHz CPU plus 32 KB combined L1 cache handles PLC and RF mesh protocol stacks, while the local bus controller glues to flash and EEPROM for firmware storage. The integrated DDR2 controller with ECC option improves reliability of metering databases, and the 473-pin MAP-BGA keeps the design within compact NEMA enclosure footprints. This single-chip architecture shortens time-to-market for AMI OEMs migrating from legacy discrete designs.
おすすめ
Wireless LAN Access Point
The MPC8308CVMAFD's PCI Express lane and dual gigabit MACs make it a strong host for 802.11n/ac WLAN access points. The host CPU runs the Linux networking stack plus encryption offload, while the PCIe lane connects to a Wi-Fi SoC or baseband. The DDR2 controller supplies the bandwidth required for simultaneous dual-band traffic, and the local bus ties to boot flash and front-panel indicators. The MAP-BGA-473 package provides excellent signal integrity for the high-speed RGMII and PCIe lanes, simplifying RF routing in dense radio layouts.
おすすめ
Femtocell Base Station
For residential femtocell designs, the e300c3 333 MHz core processes L3/L4 protocol stacks while the integrated dual GbE ports backhaul over DSL or fiber. The DDR2 controller with ECC provides the memory integrity required for soft-compute baseband processing, and the USB 2.0 high-speed interface enables local diagnostics and GNSS module attachment for E911 location. The MAP-BGA-473 thermal performance supports sealed indoor enclosures, and the wide operating voltage range simplifies PoE-powered deployments typical of femtocell hardware.
おすすめ
Consumer Printer Controller
Consumer multifunction printers benefit from the MPC8308CVMAFD's combination of USB 2.0 high-speed, gigabit Ethernet, and PCI Express for scanner/imaging peripherals. The e300c3 core at 333 MHz delivers the throughput needed for high-resolution image processing pipelines, while the local bus controller glues to print engine ASICs and front-panel controls. The integrated DDR2 controller with ECC protects against imaging-data corruption, and the MAP-BGA-473 package enables the compact mainboards required for desktop printer form factors.
おすすめ
Industrial Control and Factory Automation
In factory automation controllers, the MPC8308CVMAFD's extended-temperature range, dual GbE for ring-network topologies, and PCI Express for motion-control or vision-system add-in cards deliver a robust platform. The e300c3 core runs deterministic control loops while the DDR2 controller with ECC ensures reliable operation in electrically noisy industrial environments. The MAP-BGA-473 with proper thermal via design supports sealed IP65 enclosures, and the local bus interfaces to legacy industrial I/O modules without additional glue logic.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8308CVMAFD — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8308CVMAFDA | MPC8308VMAGD | MPC8308CZQAFD | MPC8308CZQAGDA | MPC8309CVMAFD | MPC8313CVRAFDA |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | MAP-BGA-473 (19x19 mm) | MAP-BGA-473 (19x19 mm) - same | MAP-BGA-473 (19x19 mm) - same | MAP-BGA-473 (19x19 mm) - same | MAP-BGA-473 (19x19 mm) - same | MAP-BGA-473 (19x19 mm) - same | MAP-BGA-473 (19x19 mm) - same |
| Core Architecture | Power Architecture e300c3 | Power Architecture e300c3 | Power Architecture e300c3 | Power Architecture e300c3 | Power Architecture e300c3 | Power Architecture e300c3 | Power Architecture e300c3 |
| DDR2 Controller | Up to 266 MHz data rate | Up to 266 MHz data rate | Up to 266 MHz data rate | Up to 266 MHz data rate | Up to 266 MHz data rate | Up to 266 MHz data rate | Up to 266 MHz data rate |
| Gigabit Ethernet MACs | 2 (MII/RGMII) | 2 (MII/RGMII) | 2 (MII/RGMII) | 2 (MII/RGMII) | 2 (MII/RGMII) | 2 (MII/RGMII) | 2 (MII/RGMII) |
| PCI Express | 1 x PCIe | 1 x PCIe | 1 x PCIe | 1 x PCIe | 1 x PCIe | 1 x PCIe | 1 x PCIe |
| USB Interface | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed |
主な差別化要因
- Fully integrated dual gigabit Ethernet plus PCIe plus USB 2.0 plus DDR2 controller in a single chip （vs MPC8308CZQAFD)
- Power Architecture e300c3 333 MHz with hardware-accelerated packet processing （vs MPC8309CVMAFD)
- MAP-BGA-473 19x19 mm package supports extended temperature operation （vs MPC8313CVRAFDA)
設計ノート
The MPC8308CVMAFD requires a sequenced multi-rail power architecture with the 1.0V core rail coming up before the 1.8V/2.5V/3.3V I/O rails to prevent CMOS latch-up. Use a supervisor IC to manage the rail sequence, and ensure each rail is decoupled with 0.1uF X7R ceramic capacitors placed within 2 mm of every BGA power ball, plus bulk polymer or tantalum capacitors on each supply plane.
The 473-ball MAP-BGA relies on a thermal copper pad and via array under the die for heat dissipation. Estimate: at 333 MHz full activity with two GbE ports active, dissipation approaches 2.5W; designing the PCB with a 4-layer stack-up having a continuous ground plane beneath the BGA, plus 9 or more thermal vias (0.3 mm drill) connecting the thermal pad to the inner/bottom copper, is essential to keep junction temperature within the -40C to +85C ambient range.
Route DDR2 signals as matched-length pairs with characteristic impedance of 50 ohm single-ended and 100 ohm differential for clock; keep trace length matching within 25 mils to meet the DDR2 266 MHz timing budget. The RGMII and PCIe signals also require controlled impedance with reference planes to prevent reflections; via-in-pad is recommended for the BGA break-out to fan-out high-speed signals on inner stripline layers.
Do not omit the external 33 ohm series termination resistors on the DDR2 address/command/clock lines - without them, signal integrity violations at 266 MHz data rate are likely. Also, the local bus wait-state configuration must be tuned to the actual flash and peripheral timing; using default settings can cause intermittent bus faults. Always populate the JTAG TAP pull-up resistors (TMS, TRST) to keep the boundary-scan logic in a known state at power-up.
Place decoupling capacitors on the opposite PCB side directly beneath the BGA power balls using microvias, and keep the DDR2 reference plane continuous without splits or cuts under the data byte lanes. Separate analog and digital grounds if any analog circuitry (e.g., PHY magnetics) is colocated; for purely digital SoC layouts, a single unified ground plane is preferred for lowest loop inductance.
コンプライアンス情報
RoHS compliant and lead-free per NXP product marking (Pb-free ball finish on MAP-BGA). Not AEC-Q100 qualified (industrial networking, not automotive).
