MPC8321VRAFDC - 333MHz PowerQUICC II Pro e300 MPU | NXP
部品番号: MPC8321VRAFDC ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $31.8 | $3,180.00 |
| 500 | $28.5 | $14,250.00 |
| 1,000 | $25.9 | $25,900.00 |
MPC8321VRAFDC 概要
A PowerQUICC (pronounced "PowerQUICK") communications processor is a specialized microprocessor that integrates a CPU core with communications peripherals such as Ethernet MACs, ATM support, PCI, and serial controllers on a single die. Within the broader hierarchy, the MPC8321VRAFDC sits inside the PowerQUICC II Pro family, which descended from the original PowerQUICC I (MPC860) line. The MPC8321E variant adds hardware encryption; the MPC8321VRAFDC is the non-encryption ("VRAFD" prefix indicates the unencrypted QE version) variant, allowing lower BOM cost for designs that do not need security acceleration. This part is part of NXP's (formerly Freescale) PowerQUICC family of integrated communications processors.
Key differentiating specifications of the MPC8321VRAFDC include the 333 MHz e300c2 core, 16 KB L1 instruction cache and 16 KB L1 data cache, on-chip DDR1/DDR2 memory controller supporting up to 1 GB of external memory, two 10/100 Mbps Ethernet interfaces via the QUICC Engine, two USB 2.0 ports (host/device), two PCI controllers, and dual UART. The integrated security engine is absent in this variant, making it suitable for designs where encryption is not required.
From an architectural standpoint, the MPC8321VRAFDC integrates the e300c2 core with the QUICC Engine technology block, which handles lower-layer protocol processing offloaded from the CPU. This allows the e300c2 to focus on higher-layer tasks such as routing, security policy, and management. The QUICC Engine supports protocols including HDLC, UART, BISYNC, Transparent, and ATM SAR (when configured), making the part suitable for legacy and modern serial multiplexing workloads.
Typical applications for the MPC8321VRAFDC include small office / home office (SOHO) routers and gateways, IP services routers, DSLAM line cards, industrial control and factory automation controllers, and low-end wireless access points. Its combination of integrated Ethernet, USB, PCI, and DDR controller provides a single-chip BOM for cost-sensitive networking equipment.
When designing with this device, ensure the 27x27 mm PBGA thermal footprint has sufficient PCB copper area and that the 1V core supply is generated by a high-efficiency buck regulator with adequate transient response. Verify JTAG access is provisioned for board bring-up, and use the NXP CodeWarrior or Linux BSP for software development.
This page synthesizes NXP official datasheet specifications, distributor stock and pricing, drop-in alternatives, and practical design notes not found on a single source page.
ドロップイン代替品: MPC8321VRAFDC — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8321VRAFDC （同一形状・フットプリント） — 相違点: Core Architecture, Memory Controller, USB, Data Bus Width, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
MPC8321EVRAFDC
✅ ドロップイン✓ 在庫あり
$20.85 / 個
データシートを見る →MPC8321VRAFDCA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8323EVRAFDCA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8321CVRAFDC
✅ ドロップイン✓ 在庫あり
$52 / 個
データシートを見る →MPC8313EVRAFFB
✅ ドロップイン✓ 在庫あり
$42.85 / 個
データシートを見る →MPC8321VRAFDC 最大定格＆電気的特性
| Core Architecture | Power Architecture e300c2 |
| Core Frequency | 333 MHz |
| データバス幅 | 32 bit |
| Number of Cores | 1 |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| Package Type | 516-ball PBGA (HBGA) |
| Package Dimensions | 27 x 27 mm |
| 動作温度範囲 | 0C to +105C |
| Core Supply Voltage | 1.0 V |
| I/O Voltage | 3.3 V |
| Memory Controller | DDR1 / DDR2 up to 266 MHz |
| Ethernet Interfaces | 2x 10/100 Mbps (via QUICC Engine) |
| USB | 2x USB 2.0 (host/device) |
| PCI | 2x PCI 2.2 controllers |
| UART | 2x UART |
| Encryption Engine | Not included (non-E variant) |
| QUICC Engine | Yes (protocol offload) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
MPC8321VRAFDC 27 x 27 mm ピン配置ガイド
MPC8321VRAFDC (27 x 27 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8321VRAFDC.
詳細は データシート をご参照ください。
主な用途
MPC8321VRAFDC の用途: 6 件s: SOHO Router and Gateway, IP Services Access Router, Industrial Control and Factory Automation, DSLAM Line Card Controller, Wireless Access Point Controller, Embedded Linux Networking Appliance.
SOHO Router and Gateway
The MPC8321VRAFDC fits SOHO router designs because its 333 MHz e300c2 core delivers sufficient performance for NAT, firewall, and DHCP services at sub-watt CPU load, while the integrated dual 10/100 Ethernet ports and QUICC Engine handle packet filtering and protocol offload without external MAC/PHY chips. The 16 KB L1 cache keeps routing table lookups fast, and the 1V core supply lets designers use a simple buck regulator. Designers place the part on a 4-layer PCB with the 27x27 mm PBGA fanout using microvias, and the 1 GB DDR2 limit comfortably supports SOHO routing and firewall state tables. The non-encryption variant saves BOM cost for designs where IPsec is not required.
おすすめ
IP Services Access Router
In IP services access routers, the MPC8321VRAFDC's QUICC Engine handles HDLC and PPP protocol termination, freeing the e300c2 CPU for routing policy and management plane tasks. The 333 MHz clock speed and 16 KB instruction cache support wire-speed processing for typical access links under 100 Mbps aggregate throughput. Dual PCI controllers allow connection to DSP or crypto accelerators downstream, and dual UARTs provide serial console and management interfaces. The 0 to 105C temperature range is well matched to indoor telecom equipment enclosures. Operating system support includes VxWorks and embedded Linux BSPs optimized for this part.
おすすめ
Industrial Control and Factory Automation
The MPC8321VRAFDC serves industrial control applications where deterministic serial connectivity is needed alongside networking. The dual UARTs and PCI interface support Modbus RTU masters, HMI panels, and motion controller cards, while the dual Ethernet ports connect to plant-wide Ethernet/IP or PROFINET networks. The QUICC Engine provides hardware-accelerated serial protocols for legacy fieldbus bridges. Operating temperature of 0 to 105C accommodates most factory floor environments. The 1V core supply and integrated peripherals enable single-chip BOM designs for PLCs and industrial gateways, reducing board complexity and improving reliability.
おすすめ
DSLAM Line Card Controller
The MPC8321VRAFDC is well suited as a DSLAM line card controller because its PCI interface can connect to multiple DSL PHY devices, while the e300c2 CPU runs the line card management software and per-port state machines. The QUICC Engine accelerates HDLC encapsulation used in legacy DSL backhaul, and dual Ethernet provides uplink to the central office. The 516-ball PBGA package integrates all required networking and serial peripherals, removing the need for external ASICs. The 1 GB DDR2 limit supports large connection state tables for medium-density line cards. Designers benefit from NXP's reference Linux BSP and U-Boot port for fast bring-up.
おすすめ
Wireless Access Point Controller
For low-end wireless access points, the MPC8321VRAFDC's integrated PCI and USB 2.0 ports can connect to Wi-Fi radios and Bluetooth modules, while the e300c2 CPU runs the access point management stack. The 333 MHz performance is sufficient for 802.11g access points with light traffic; 802.11n designs require the higher-throughput MPC8378 family. Dual Ethernet supports both wired uplink and bridge ports. The 0 to 105C temperature range suits indoor ceiling-mount enclosures. The non-encryption variant is appropriate for open access points where WPA2 encryption runs on the Wi-Fi radio subsystem rather than the host CPU.
おすすめ
Embedded Linux Networking Appliance
The MPC8321VRAFDC is a proven platform for embedded Linux networking appliances such as VPN concentrators (without encryption offload), intrusion detection sensors, and load balancers. Mainline Linux kernel support in arch/powerpc/platforms/83xx/ provides driver coverage for Ethernet, PCI, USB, DDR, and UART. The 333 MHz core and 16 KB caches deliver sufficient throughput for line-rate processing on 100 Mbps links. The 1 GB DDR2 maximum accommodates full routing tables and large connection state caches. Designers use the U-Boot bootloader for firmware updates and recovery. The 516-ball PBGA enables single-chip BOM designs that reduce cost and improve MTBF.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8321VRAFDC — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8321EVRAFDC | MPC8321VRAFDCA | MPC8323EVRAFDCA | MPC8321CVRAFDC | MPC8313EVRAFFB |
|---|---|---|---|---|---|---|
| Package | 516-ball PBGA 27x27 mm | 516-ball PBGA 27x27 mm | 516-ball PBGA 27x27 mm | 516-ball PBGA 27x27 mm | 516-ball PBGA 27x27 mm | 516-ball PBGA 27x27 mm |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | e300c2 333 MHz | e300c2 333 MHz | e300c2 333 MHz (rev A) | e300c2 333 MHz | e300c2 333 MHz | e300c2 lower freq |
| Encryption Engine | No | Yes (DES/3DES/AES/SHA-1/MD5) | No | Yes | No | Yes |
| Ethernet Ports | 2x 10/100 Mbps | 2x 10/100 Mbps | 2x 10/100 Mbps | 2x 10/100 Mbps | 2x 10/100 Mbps | 2x 10/100 Mbps |
| PCI Controllers | 2x | 2x | 2x | 2x | 2x | 1x |
| USB | 2x USB 2.0 | 2x USB 2.0 | 2x USB 2.0 | 2x USB 2.0 | 2x USB 2.0 | 2x USB 2.0 |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | Industrial grade | 0C to +105C |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
主な差別化要因
- No hardware encryption engine, reducing BOM cost （vs MPC8321EVRAFDC)
- Mature PowerQUICC II Pro platform with extensive Linux support （vs MPC8313EVRAFFB)
- 516-ball PBGA matches the MPC8323E family for upgrade path （vs MPC8323EVRAFDCA)
設計ノート
Estimated: The 516-ball PBGA at 27x27 mm has a typical theta_JA of approximately 15 C/W with 4-layer PCB and adequate thermal vias. At 333 MHz and full peripheral utilization, power dissipation is approximately 1.5-2W. This results in a junction temperature rise of 25-30C above ambient. For sealed enclosures with no airflow, provide copper pours on inner layers connected to the central BGA thermal balls to keep Tj below 105C at 70C ambient.
The 1.0 mm ball pitch of the 516-ball PBGA requires either microvia (laser-drilled) stack-up or an 8-mil pitch escape pattern. Use a minimum 4-layer PCB with dedicated ground and power planes. BGA break-out fanout should follow NXP's recommended pattern in the hardware specifications document. Keep DDR traces matched within 25 mils to maintain signal integrity at 266 MHz.
The 1.0V core supply must be generated by a buck regulator capable of delivering at least 3A with 3% tolerance under load transients. The 3.3V I/O supply should rise no earlier than 1V to avoid internal ESD conduction. Place 22uF ceramic + 100uF bulk decoupling within 25 mm of the BGA balls. Refer to NXP application note AN2764 for the recommended power sequencing circuit.
Common pitfalls include using wrong JTAG connector pinout (this part uses COP and JTAG - verify which is enabled by HRCW configuration), omitting proper DDR termination resistors (DDR2 requires VTT termination), and failing to configure the Hardware Reset Configuration Word (HRCW) before PORESET deassertion. Always validate the HRCW against the silicon hardware specifications document before PCB fabrication.
Route DDR signals on the top layer directly under the BGA escape, with the inner layer dedicated to DDR VTT termination. Keep Ethernet MII/RMII traces under 50 mm with controlled impedance of 50 ohms single-ended. Place the 25 MHz system clock within 5 mm of the SYSCLK ball pair with guard traces to reduce EMI. Refer to the NXP hardware specifications layout checklist for compliance.
コンプライアンス情報
RoHS compliant per NXP product page and DigiKey listing. Halogen-free status not explicitly stated in provided data. AEC-Q100 not applicable for communications processor. Lead-free PBGA package uses SnAgCu solder balls.
