MPC8536BVTAULA - PowerQUICC III 1.333GHz MPU 783-FCBGA | NXP
部品番号: MPC8536BVTAULA ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $182.86 | $182.86 |
| 10 | $175.2 | $1,752.00 |
| 100 | $162.5 | $16,250.00 |
| 250 | $155.4 | $38,850.00 |
| 500 | $148.75 | $74,375.00 |
MPC8536BVTAULA 概要
A PowerQUICC III MPU (Microprocessor Unit) is a system-on-chip that combines a Power Architecture CPU core with communications peripherals, making it a member of the broader microprocessor -> embedded processor -> SoC -> semiconductor hierarchy. The MPC8536BVTAULA specifically targets the convergence of control-plane processing and high-speed data-plane I/O for routing, switching, and gateway applications, integrating peripherals that previously required discrete components.
Key features include a 32-bit e500 core with 36-bit physical addressing, 783-FCBGA package, 1.333 GHz core frequency, integrated DDR2/DDR3 memory controller with ECC, dual Gigabit Ethernet controllers with SerDes, dual SATA ports, USB 2.0, dual PCI/PCIe controllers, SDHC, four I2C, DUART, and a security engine (SEC 2.0/3.0). The device supports 0C to 105C extended operating temperature, making it suitable for thermally constrained embedded deployments.
The architecture pairs an e500 core with a high-speed coherency fabric, on-chip L2 cache (typically 256 KB), and a multi-protocol peripheral cluster. The integrated security engine accelerates IPSec and SSL/TLS, and the SerDes lanes can be configured for SGMII, PCI Express, SATA, or Aurora protocols. The result is a single chip that replaces what previously required a CPU plus a multi-ASIC communications backend.
Typical applications include industrial routers and gateways, networked storage controllers (NAS/iSCSI), factory automation controllers, secure VPN concentrators, smart grid / IEC 61850 communication processors, military/aerospace networking, and medical imaging systems. The MPC8536BVTAULA is also commonly designed into long-life-cycle industrial platforms that require ten-year-plus supply continuity.
When designing with this device, allocate ample power and ground for the FCBGA and follow NXP's reference PCB stack-up. A JTAG header for code debug, isolated supplies for analog and SerDes rails, and adequate thermal relief (heatsink or chassis mount) are strongly recommended at full 1.333 GHz operation.
This page synthesizes distributor pricing, drop-in NXP PowerQUICC III alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: MPC8536BVTAULA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8536BVTAULA （同一形状・フットプリント） — 相違点: Core Architecture, Memory Controller, Operating Temperature, Ethernet, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
MPC8536AVTATHA
✅ ドロップイン✓ 在庫あり
$138.5 / 個
データシートを見る →MPC8536CVTAKGA
✅ ドロップイン✓ 在庫あり
$112 / 個
データシートを見る →MPC8536BVJAULA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8536AVTAQGA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8536EVTATHA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8536BVTAULA 最大定格＆電気的特性
| MPN | MPC8536BVTAULA |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | PowerQUICC III MPC85xx |
| Core Architecture | PowerPC e500 (32-bit, scales to 1.5 GHz) |
| Core Frequency | 1.333 GHz |
| Number of Cores | 1 |
| データバス幅 | 32-bit (36-bit physical addressing) |
| Package Type | FCBGA-783 (29 x 29 mm, 1 mm pitch, 2.80 mm height) |
| ピン数 | 783 |
| 実装タイプ | Surface Mount |
| Process Node | 90 nm (0.09 um per datasheets.com) |
| 電源電圧 | 1.0 V core, 1.5 V / 1.8 V / 2.5 V / 3.3 V I/O rails |
| 動作温度 | 0C to +105C (extended) |
| Lead Status | Lead Free |
| Memory Controller | DDR2 / DDR3 with ECC |
| Integrated Peripherals | Gigabit Ethernet, SATA, USB 2.0, PCI/PCIe, SDHC, DUART, I2C, SEC |
| MSLレベル | 3 (per JEDEC J-STD-020 for large FCBGA) |
| RoHS ステータス | Compliant |
MPC8536BVTAULA fcbga-783 (29 x 29 mm, 1 mm pitch, 2.80 mm height) ピン配置ガイド
MPC8536BVTAULA (fcbga-783 (29 x 29 mm, 1 mm pitch, 2.80 mm height) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8536BVTAULA.
詳細は データシート をご参照ください。
主な用途
MPC8536BVTAULA の用途: 6 件s: Industrial Router / Gateway, Network Attached Storage (NAS) Controller, Smart Grid / IEC 61850 Communication Processor, Factory Automation Controller, Secure VPN Concentrator, Medical Imaging / Diagnostic Processor.
Industrial Router / Gateway
The MPC8536BVTAULA's 1.333 GHz e500 core, dual Gigabit Ethernet with SerDes, and integrated security engine make it ideal for industrial routers and protocol gateways. The SoC consolidates the CPU, switch fabric, and crypto accelerator that previously required a CPU plus a multi-ASIC communications backend. Placed on the main board with DDR3 ECC memory and PoE-powered SFP cages, the device delivers wire-speed routing for IPSec and QoS without external ASSPs. Compared to discrete CPU-plus-NPU designs, this single-chip integration reduces BOM cost and PCB area by 40-60 percent.
おすすめ
Network Attached Storage (NAS) Controller
With dual SATA ports, Gigabit Ethernet, and a hardware crypto engine, the MPC8536BVTAULA is well suited to entry-level NAS and iSCSI controllers. Its DDR2/DDR3 controller with ECC supports memory configurations up to 1 GB for filesystem caching. Used as the system-on-chip in a NAS appliance, the device handles SMB/NFS protocol processing and RAID-5 parity offload. The 0C-105C industrial temperature rating allows fanless chassis designs for 24/7 operation. Compared to ARM-based NAS SoCs, the e500 core offers stronger single-thread throughput for sequential read/write workloads.
おすすめ
Smart Grid / IEC 61850 Communication Processor
The MPC8536BVTAULA's deterministic e500 core, dual Gigabit Ethernet with hardware timestamping, and 0C-105C industrial temperature make it ideal for IEC 61850 substation controllers and smart grid merging units. Its SEC engine accelerates TLS and DLMS/COSEM for secure meter data collection. Deployed in protection relay cabinets, the SoC handles GOOSE message processing with sub-millisecond latency. Compared to general-purpose ARM Cortex-A9 SoCs, the e500 architecture offers better real-time interrupt response for protection-grade applications.
おすすめ
Factory Automation Controller
The MPC8536BVTAULA integrates PCI/PCIe, USB 2.0, dual Gigabit Ethernet, and SDHC, which are the core peripherals required for a programmable automation controller (PAC) or PLC with industrial networking. Its Power Architecture e500 core runs deterministic control loops while the SEC engine secures OPC-UA communication. Mounted on a DIN-rail IPC carrier, it can host EtherNet/IP, PROFINET, or Modbus TCP stacks simultaneously. The 783-FCBGA provides the I/O bandwidth needed to aggregate multiple industrial Ethernet channels without external switch ASICs.
おすすめ
Secure VPN Concentrator
The MPC8536BVTAULA's hardware Security Engine (SEC) accelerates IPSec and SSL/TLS, allowing it to terminate hundreds of VPN tunnels per second. Combined with the 1.333 GHz e500 core for control-plane processing, it functions as a small-to-medium enterprise VPN concentrator or SD-WAN edge device. The SerDes lanes can be configured for additional SGMII or PCI Express ports, expanding uplink capacity. Compared to ARM Cortex-A53 designs, the e500's single-threaded performance yields higher packets-per-second for small-packet crypto workloads.
おすすめ
Medical Imaging / Diagnostic Processor
The MPC8536BVTAULA's dual Gigabit Ethernet, USB 2.0, and PCI/PCIe interfaces provide connectivity to ultrasound transducers, image capture boards, and color LCD panels in medical imaging systems. Its e500 core processes DICOM networking stacks and image compression algorithms, while the integrated SEC engine secures PHI data transmission. The 0C-105C temperature range supports fanless embedded medical chassis. Compared to general-purpose x86 SBCs, the PowerQUICC III SoC offers lower power consumption and deterministic latency for real-time image acquisition.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8536BVTAULA — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8536AVTATHA | MPC8536CVTAKGA | MPC8536BVJAULA | MPC8536AVTAQGA | MPC8536EVTATHA |
|---|---|---|---|---|---|---|
| Package | 783-FCBGA (29x29 mm, 1 mm pitch) | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core Architecture | PowerPC e500 (32-bit) | PowerPC e500 (32-bit) | PowerPC e500 (32-bit) | PowerPC e500 (32-bit) | PowerPC e500 (32-bit) | PowerPC e500 (32-bit) |
| Security Engine | SEC (2.0/3.0 variant) | SEC | SEC | SEC | SEC | SEC 3.0 (enhanced) |
| DDR Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
主な差別化要因
- Pin-compatible upgrade path within the MPC8536 family （vs MPC8536AVTATHA)
- Integrated Security Engine (SEC) （vs MPC8536BVJAULA)
- Broad peripheral integration in single SoC （vs Discrete CPU + multi-ASIC communications backend)
設計ノート
The 783-FCBGA (29x29 mm, 1 mm pitch) package requires a high-density PCB: 8-12 layer stack-up, laser-drilled microvias, via-in-pad (VIPPO) for the BGA breakout, and 0.4 mm trace/space per NXP's hardware design guide. Use 1 oz copper on outer layers for power and 0.5 oz on inner layers for signal. Allocate a continuous ground plane directly under the BGA for thermal relief and impedance control.
Estimated: the MPC8536BVTAULA consumes approximately 8-12 W at 1.333 GHz with full peripheral activity. Provide isolated supplies for the 1.0 V core, 1.5/1.8 V DDR, and 2.5/3.3 V I/O rails using switching regulators with 1 percent accuracy. Bulk decoupling: 220 uF polymer + 22 uF ceramic per rail at the source; high-frequency 0.1 uF/1 nF/10 nF ceramics within 5 mm of every power pin. Ferrite beads isolate analog and SerDes rails.
At 1.333 GHz with the integrated peripherals active, attach a heatsink or thermal interface material (TIM) to the FCBGA lid. For fanless industrial enclosures (0C-105C ambient), the FCBGA top-lid thermal resistance (theta_JC) typically allows a 7-9 W continuous dissipation with a 1.5 C/W heatsink. Validate thermals with the NXP-provided thermal model in the design kit; do not exceed the 105C junction limit.
Critical pitfalls: (1) do not route DDR signals across BGA splits - maintain a single contiguous GND/power reference plane under the DDR interface; (2) the SerDes reference clock must be jitter-clean, with the oscillator placed within 25 mm of the device; (3) JTAG pins must be accessible at the board edge for code debug and boundary-scan test; (4) do not share a 32 kHz RTC supply with the 1.0 V core - use a dedicated low-noise LDO.
コンプライアンス情報
Lead-free per datasheets.com listing; RoHS compliant per distributor data. AEC-Q100 not applicable - this is an industrial networking MPU, not an automotive-qualified part. For automotive-grade PowerQUICC III variants, refer to NXP's automotive product finder.
