MPC853TZT100A - 100MHz PowerQUICC MPU | NXP 256-PBGA
部品番号: MPC853TZT100A ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $27.75 | $27.75 |
| 10 | $25.32 | $253.20 |
| 100 | $22.18 | $2,218.00 |
| 500 | $19.84 | $9,920.00 |
| 1,000 | $18.05 | $18,050.00 |
MPC853TZT100A 概要
A PowerQUICC integrated communications controller (also known as a communications MPU) is a specialized microprocessor that combines a PowerPC core with on-chip peripherals tailored for networking and telecom equipment. The MPC8xx family sits below higher-end PowerPC processors in NXP's portfolio and above simple microcontroller solutions, occupying the niche of low-power embedded networking silicon used in routers, switches, DSLAMs, and industrial control platforms where deterministic I/O and protocol handling matter more than raw compute throughput.
Key features of the MPC853TZT100A include the 100 MHz MPC8xx core, 0.18 micron CMOS process, on-chip Ethernet MAC supporting 10/100 Mbps, external bus operating up to 66 MHz, programmable interrupt controller, and a CPM (Communications Processor Module) for protocol offload. The device integrates memory controllers, timers, serial interfaces, and a real-time clock, reducing external component count for embedded designs while keeping power dissipation low compared to discrete processor-plus-peripheral architectures.
Typical applications of the MPC853TZT100A include industrial Ethernet gateways, embedded routers and switches, protocol converters, SCADA controllers, networked sensor aggregation nodes, and telecom edge equipment. The 0 to 95C operating range and the 23x23 mm 256-BGA footprint make it suited for high-density networking hardware in environmentally controlled indoor enclosures rather than harsh automotive or outdoor deployments.
When designing with this part, pay close attention to the dual-voltage power architecture (1.8 V core from a switching regulator, 3.3 V I/O from an LDO) and follow NXP reference designs for PDN decoupling. PBGA assembly requires X-ray inspection of solder joints and controlled thermal profiling during reflow to avoid cold joints under the 1.0 mm pitch ball grid.
This page consolidates distributor inventory, end-of-life notices, and drop-in alternatives sourced from the same NXP PowerQUICC MPC8xx family, providing context not always available in the standalone datasheet.
ドロップイン代替品: MPC853TZT100A — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC853TZT100A （同一形状・フットプリント） — 相違点: Core Architecture, I/O Voltage, Operating Temperature, Package, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
MPC853TVT100A
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC853ZT100A
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC852TVT100A
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC853TZT100A 最大定格＆電気的特性
| Processor Type | MPC8xx PowerQUICC 32-Bit |
| Core Architecture | PowerPC MPC8xx, 1 Core, 32-Bit |
| Maximum Core Frequency | 100 MHz |
| External Bus Frequency | 66 MHz maximum |
| Process Technology | 0.18 micron CMOS |
| Core Voltage | 1.8 V |
| I/O Voltage | 3.3 V (5 V TTL compatible) |
| パッケージ | 256-BGA (PBGA), 23x23 mm |
| 実装タイプ | Surface Mount |
| 動作温度 | 0C to +95C (TA) |
| Family | PowerQUICC, MPC853T (ethernet-only member of MPC866 Family) |
| On-chip Peripherals | Ethernet MAC 10/100, CPM, timers, serial interfaces |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| RoHS ステータス | Non-RoHS (legacy part) |
MPC853TZT100A 256-bga (pbga), 23x23 mm ピン配置ガイド
MPC853TZT100A (256-bga (pbga), 23x23 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC853TZT100A.
詳細は データシート をご参照ください。
主な用途
MPC853TZT100A の用途: 7 件s: Industrial Ethernet Gateway, Embedded Router / Switch, SCADA Controller Host, Protocol Converter / Gateway, Telecom Edge Equipment, Networked Sensor Aggregation Node, Industrial Printer / Embedded Imaging Controller.
Industrial Ethernet Gateway
The MPC853TZT100A is a strong fit for industrial Ethernet gateways thanks to its 100 MHz PowerPC core and dedicated on-chip 10/100 Ethernet MAC, which together handle Modbus/TCP, EtherNet/IP, and PROFINET protocol conversion offloading the host CPU. With a 1.8 V core and 3.3 V I/O architecture, it pairs cleanly with industrial-grade PHYs and serial interface chips, while the 0 to 95C operating temperature covers indoor DIN-rail enclosures. Designers typically pair the 853T with a switching regulator such as the TPS5430 for the 1.8 V rail and an LDO such as the TPS7A4533 for clean 3.3 V I/O, ensuring the part meets EMC margins for industrial plants.
おすすめ
Embedded Router / Switch
For low-port-count embedded routers and edge switches, the MPC853TZT100A delivers 100 MHz processing sufficient for IPv4/IPv6 forwarding, QoS classification, and basic firewall filtering at small-scale aggregation. The CPM (Communications Processor Module) handles Ethernet framing in hardware, freeing the core for control-plane tasks. Its 256-BGA footprint supports high-density PCB layout, but engineers must follow NXP's reference design for trace length matching on the 66 MHz external bus. Use the MPC853T's serial interfaces (UART, SPI) to talk to PHYs and supervisory chips.
おすすめ
SCADA Controller Host
The MPC853TZT100A serves well as a SCADA (Supervisory Control and Data Acquisition) controller host, where deterministic serial protocol handling, RTOS support, and long-term reliability outweigh peak compute. Its PowerPC core supports VxWorks and Linux real-time extensions, while the 1.8 V internal core keeps power dissipation low in always-on cabinets. The device's serial interfaces (UART, HDLC) interface directly to legacy RTUs and PLCs, and its Ethernet MAC uplinks to plant MES systems. End-of-life status requires firmware and lifecycle risk planning for long deployment horizons.
おすすめ
Protocol Converter / Gateway
In protocol converter designs that bridge legacy serial (RS-485, RS-232, HDLC) fieldbus equipment with modern Ethernet-based control networks, the MPC853TZT100A provides both interfaces and protocol handling on a single chip. Its CPM offloads framing duties so the core can run dual-stack converters such as Modbus RTU to TCP gateways. The 256-BGA and 1.0 mm pitch require careful reflow profiling during assembly, especially for high-mix contract manufacturing. Pair with galvanic isolation for outdoor or factory-floor deployments to protect the 3.3 V I/O from surge events.
おすすめ
Telecom Edge Equipment
The MPC853TZT100A was originally designed for telecom edge equipment such as DSLAM line cards, fiber access multiplexers, and small-cell gateway modules, where its PowerQUICC architecture and Ethernet focus make it well matched to ATM/Ethernet interworking and access aggregation. The 100 MHz core is sufficient for small-cell L2 processing and OAM handling, and the 1.8 V core keeps system power within telecom NEBS thermal envelopes. Given end-of-life status, designers should map migration paths to NXP Layerscape LS1012A or LS1026A for new telecom projects while preserving the MPC853TZT100A in maintenance only.
おすすめ
Networked Sensor Aggregation Node
Sensor aggregation nodes that pull data from multiple field sensors and forward consolidated streams to cloud gateways can use the MPC853TZT100A as a low-power coordinator. The integrated Ethernet MAC terminates the uplink, while the multiple serial interfaces (UART, SPI, I2C) collect sensor telemetry from local MCU clusters. Operating from the 0 to 95C range covers IP54 enclosures in factory cells. With end-of-life notice, plan replacement with the same PowerQUICC family or migrate to an LS1028A for long-term firmware maintenance.
おすすめ
Industrial Printer / Embedded Imaging Controller
In industrial printers, label applicators, and small-format embedded imaging controllers, the MPC853TZT100A's 100 MHz PowerPC core handles image processing, motor control sequencing, and Ethernet uplinks in a single device. Its Ethernet MAC supports industrial printer protocols (EIP, LPR, IPP) while general-purpose I/O and timers drive stepper motors and print heads. Choose this part only for legacy, maintenance-class boards given end-of-life; new designs should consider NXP i.MX RT or Layerscape processors with active lifecycle support.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC853TZT100A — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC853TVT100A | MPC853ZT100A | MPC852TVT100A |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-BGA (PBGA, 23x23 mm) | 256-BGA - same | 256-BGA - same | 256-BGA - same |
| Core Frequency | 100 MHz | 100 MHz - same | 100 MHz - same | 100 MHz - same |
| Core Voltage | 1.8 V | 1.8 V - same | 1.8 V - same | 1.8 V - same |
| Family Position | MPC853T (Ethernet-only MPC866 family) | MPC853T (Ethernet-only MPC866 family) | MPC853T (Ethernet-only MPC866 family) | MPC852 (sibling family member) |
| Peripheral Emphasis | Ethernet MAC + CPM | Ethernet MAC + CPM (same) | Ethernet MAC + CPM (same) | Different peripheral mix |
| Operating Temperature | 0C to +95C | 0C to +95C - same | 0C to +95C - same | 0C to +95C - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- Ethernet-only MPC866 family focus （vs MPC852TVT100A)
- 256-BGA drop-in compatibility inside the MPC853T family （vs MPC853TVT100A)
- Established PowerPC ecosystem support （vs ARM-based LS1026AXN8P1A)
設計ノート
Estimated: The MPC853TZT100A draws its core current from a 1.8 V rail and I/O current from a 3.3 V rail; core current typically peaks around 200-300 mA at 100 MHz, equivalent to roughly 0.4-0.55 W core power dissipation (estimate based on typical PowerQUICC MPC8xx published values). A TPS5430 or equivalent 3 A buck converter is recommended for the 1.8 V rail. Sequence the core supply before the I/O supply (or use a tracking regulator) to avoid latch-up; many designs use a TPS3808 reset supervisor to gate the 3.3 V rail until the 1.8 V rail is within tolerance.
Use at least 4 PCB layers with a dedicated ground plane beneath the 256-BGA ball field. Escape vias-in-pad with 0.2 mm drill and 0.4 mm pad typically yield clean 1.0 mm-pitch BGA fanout. Place 1.8 V decoupling capacitors on the bottom of the PCB directly beneath BGA power balls to minimize loop inductance. NXP provides reference design files in the MPC853T hardware specifications documenting trace impedance for the 66 MHz external bus.
Estimated: at full 100 MHz operation with both rails loaded, the 256-PBGA package dissipates roughly 1-1.5 W (estimate; consult PowerQUICC design guidelines). At 31-35 C/W typical theta_JA for a 256-BGA on a 4-layer JEDEC test board, junction temperature rise over a 50C ambient reaches 35-50 C, safely below the 95C ambient limit. Provide thermal vias under the central BGA power array and consider small heatsink attachment only for high ambient installations.
Several legacy BGA designs suffer from cold solder joints under the BGA's central thermal balls; X-ray inspection after reflow is mandatory. Avoid mixing the MPC853TZT100A (T suffix, lead-free) with non-leaded vintage boards - some early 853T variants contain lead per the datasheet footprint row. Confirm the part's RoHS/lead status before assembly. End-of-life status also means long-term firmware support and errata documentation may be frozen - plan for design vulnerability assessment against new compiler and toolchain issues.
コンプライアンス情報
Per NXP datasheet, the MPC853TZT100A is a lead-containing (non-leaded) vintage part. RoHS status is non-compliant; check exact suffix variants for lead-free versions. AEC-Q100 is not applicable for this industrial/embedded processor grade.
