MPC8541EVTAPF - PowerPC e500 MPU 833MHz 783-FCPBGA | NXP
部品番号: MPC8541EVTAPF ✗ 生産終了MPC8541EVTAPF 概要
A microprocessor (MPU) of this class is a single-chip processing subsystem that integrates CPU cores, peripheral controllers, memory interfaces and I/O fabrics on one die, replacing what would otherwise require a discrete processor plus companion chipset. Within the broader taxonomy, the MPC85xx family sits under PowerQUICC communications processors, which themselves are members of the Power Architecture embedded processor lineage from NXP/Freescale. This part is positioned for I/O-intensive designs where multiple high-speed bus interfaces, deterministic interrupt handling, and integrated security are required.
Key headline capabilities include 833 MHz core frequency, 32-bit PowerPC e500 architecture, dual on-chip PCI/PCI-X support eliminating external bridge chips, integrated security engine for IPsec, SSL/TLS and other encryption workloads, and a 783-ball FCBGA (29x29) thermally enhanced package. Combined, these features allow designers to build compact line cards, WAN access equipment, and wireless base-station controllers without a multi-chip northbridge/southbridge arrangement.
Typical applications include multi-service routers, DSLAM line cards, wireless base stations, industrial control gateways, secure networking appliances, and RAID/storage controllers. The integrated security engine and dual PCI interfaces make it especially well-suited for I/O-intensive line cards that aggregate multiple WAN or storage links while still requiring hardware-accelerated crypto.
When designing with this device, allocate the 783-ball FCBGA land pattern and thermal management (the package dissipates noticeable power at 833 MHz), and confirm long-term availability because PowerQUICC III parts have been progressively migrating to newer Layerscape families.
ドロップイン代替品: MPC8541EVTAPF — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8541EVTAPF （同一形状・フットプリント） — 相違点: Mounting Type, Series.
MPC8541EPXAPF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8540VT833LB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8540CVT667JC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8560VT833LB
✅ ドロップイン価格はお問い合わせください
データシートを見る →MPC8541EVTAPF 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC III MPC85xx |
| Core Processor | PowerPC e500 |
| Number of Cores | 1 |
| Core Architecture | 32-Bit |
| Core Frequency | 833 MHz |
| パッケージ | 783-FCPBGA (29x29 mm) |
| 電源電圧 | 2.5 V / 3.3 V |
| On-chip PCI/PCI-X | Dual controllers |
| Memory Controller | DDR SDRAM |
| Local Bus Controller | Yes |
| I2C Controllers | 2 (dual) |
| SPI Controller | Yes |
| Security Engine | Integrated (IPsec/SSL/TLS acceleration) |
| 実装タイプ | Surface Mount |
MPC8541EVTAPF 783-fcpbga (29x29 mm) ピン配置ガイド
MPC8541EVTAPF (783-fcpbga (29x29 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8541EVTAPF.
詳細は データシート をご参照ください。
主な用途
MPC8541EVTAPF の用途: 6 件s: Multi-Service Routers and WAN Access, DSLAM and Access Aggregation Line Cards, Wireless Base Station Controllers, Industrial Networking Gateways, RAID and Storage Controllers, Secure Networking Appliances.
Multi-Service Routers and WAN Access
The MPC8541EVTAPF is engineered for multi-service router line cards where deterministic packet processing, hardware-accelerated encryption, and multiple PCI/PCI-X endpoints are required. With its PowerPC e500 core at 833 MHz, integrated IPsec/SSL/TLS security engine, dual on-chip PCI controllers, and DDR SDRAM controller, it can sustain line-rate encryption on WAN interfaces without external bridge chips. Placed as the central processor on a router line card with DDR memory, a network processor, and PHY/MAC companions, it eliminates the cost and latency of a discrete northbridge/southbridge. Compared to a software-only crypto implementation, the integrated security engine typically delivers 3-10x higher IPsec throughput at the same clock rate.
おすすめ
DSLAM and Access Aggregation Line Cards
In DSLAM line cards and access aggregation equipment, the MPC8541EVTAPF provides the I/O bandwidth and processing headroom required to terminate hundreds of DSL subscribers. Its dual on-chip PCI/PCI-X controllers allow direct connection to multiple DSL PHY framer chips and TDM backplane interfaces, while the local bus controller connects to glue logic and boot flash. The integrated security engine supports per-subscriber IPsec, AAA acceleration, and tunnel termination for L2TP/IPsec aggregation. Designers typically place it between the DSL framer/Merry pair on the backplane and the central switching fabric, achieving deterministic per-subscriber QoS at modest power budgets.
おすすめ
Wireless Base Station Controllers
Wireless base station controllers for 2G/3G BTS equipment require deterministic real-time processing for radio resource management, encryption, and backhaul aggregation. The MPC8541EVTAPF delivers 833 MHz PowerPC e500 performance with integrated IPsec/SSL/TLS hardware acceleration, ideal for Abis/Iub backhaul encryption and BTS MAC scheduling. The 783-FCPBGA package provides the thermal headroom needed for fanless outdoor enclosures, while dual PCI controllers enable direct connection to digital RF ASICs and baseband DSP clusters. Compared to a discrete processor plus chipset, the integrated SoC approach typically reduces PCB area by 30-40% and BOM cost by 15-25%.
おすすめ
Industrial Networking Gateways
Industrial control gateways running real-time operating systems (VxWorks, QNX, Green Hills INTEGRITY) benefit from the MPC8541EVTAPF's deterministic interrupt response, hardware security engine, and rich peripheral set. It is well suited to gate-by-gate protocol conversion between Profinet, EtherNet/IP, Modbus TCP, and backhaul Ethernet or cellular networks. The integrated security engine protects industrial traffic from tampering while the local bus and dual I2C controllers attach to industrial sensors and actuators. This part is typically deployed alongside industrial PHY transceivers and isolated serial interfaces in hardened DIN-rail enclosures.
おすすめ
RAID and Storage Controllers
RAID controllers and external storage subsystems leverage the MPC8541EVTAPF for high-throughput I/O aggregation across multiple SAS/SATA or Fibre Channel ports. Dual on-chip PCI/PCI-X controllers allow attachment to multiple HBA/RAID ASICs, while the integrated security engine handles encrypted storage (SED) management traffic. The local bus connects to flash boot ROM and management peripherals, and DDR SDRAM provides the buffer cache for write-back acceleration. It is commonly placed as the central management CPU behind a dedicated hardware RAID accelerator.
おすすめ
Secure Networking Appliances
The integrated IPsec/SSL/TLS security engine makes the MPC8541EVTAPF a natural choice for VPN concentrators, SSL inspection gateways, and UTM appliances. At 833 MHz the security engine can sustain multiple gigabits of IPsec throughput, replacing what would otherwise require a discrete encryption accelerator. The dual PCI interfaces allow multiple 1G/10G NIC attachments, while the local bus connects to management UARTs and boot devices. Designers typically place it between the NIC complex and the backplane switch, achieving wire-speed encrypted forwarding at moderate power budgets.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8541EVTAPF — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8541EPXAPF | MPC8540VT833LB | MPC8540CVT667JC | MPC8560VT833LB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Frequency | 833 MHz | 833 MHz | 833 MHz | 667 MHz | 833 MHz |
| Integrated Security Engine | Yes (IPsec/SSL/TLS) | Yes | No | No | Yes (enhanced) |
| On-chip PCI Controllers | Dual PCI/PCI-X | Dual PCI/PCI-X | Dual PCI/PCI-X | Dual PCI/PCI-X | Dual PCI/PCI-X |
| Core Architecture | PowerPC e500 32-bit | PowerPC e500 32-bit | PowerPC e500 32-bit | PowerPC e500 32-bit | PowerPC e500 32-bit |
| Series | PowerQUICC III MPC85xx | PowerQUICC III MPC85xx | PowerQUICC III MPC85xx | PowerQUICC III MPC85xx | PowerQUICC III MPC85xx |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Supply Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
主な差別化要因
- Integrated IPsec/SSL/TLS security engine at 833 MHz （vs MPC8540VT833LB)
- Full 833 MHz core frequency with extended temperature grade （vs MPC8540CVT667JC)
- Same-package compatibility with higher-end MPC8560 family （vs MPC8560VT833LB)
設計ノート
The 783-FCPBGA (29x29 mm) package dissipates significant power at 833 MHz. Estimated: at typical I/O-intensive networking workloads, junction power reaches the multi-watt range. Place a minimum of 4-6 thermal vias in a 0.5 mm grid under the die area, and stitch the inner ground planes directly to the FCBGA balls to spread heat. For sealed enclosures, plan a heatsink or forced-air flow; the FCBGA package alone is insufficient for sustained 83xx MHz operation in still air.
Use a high-layer-count PCB (10+ layers minimum) with dedicated power planes for the 2.5 V and 3.3 V rails. Route the DDR SDRAM signals with controlled impedance and matched lengths (typically within 50 ps of the longest segment) on inner stripline layers adjacent to a continuous ground plane. The local bus, PCI/PCI-X, and Ethernet signals should each be isolated on separate layers to avoid crosstalk into DDR.
Do not assume that newer Layerscape boot images will run on this PowerQUICC III part - the boot ROM, DDR controller calibration sequences, and reset vectors differ significantly between PowerQUICC III and QorIQ families. When migrating firmware or boot loaders, re-validate DDR timing parameters, TSEC/EMAC PHY initialization, and PCI-X bus arbitration. The 'V' in MPC8541EVTAPF indicates an extended-temperature variant, so verify the operating temperature range against your enclosure thermal model.
Estimate decoupling: place one 0.1 uF X7R ceramic capacitor and one 10 uF bulk ceramic within 5 mm of each power pin pair on the FCBGA. Use wide power-trace or power-plane stitching between the FCBGA balls and the via field. A 22 uF or 47 uF bulk capacitor near the package feeds transient current during security-engine bursts and DDR read/write cycles.
The dual on-chip PCI/PCI-X interfaces require careful signal integrity work: keep PCI-X segments to <50 mm, maintain 65 ohm impedance, and provide source termination if more than two slots are cascaded. Series-damping resistors (22-33 ohm) are recommended near the driver for PCI-X 133 MHz operation. The Ethernet GMII/RGMII traces should be length-matched within 50 mils and routed over a continuous ground plane to maintain jitter margins.
コンプライアンス情報
RoHS and REACH compliance status was not explicitly stated in the verified web data; lead-free is typical for FCBGA packages from this era. AEC-Q100 is not applicable - this is an industrial/networking MPU, not an automotive-grade device.