MPC8544EVTAQGA - PowerQUICC III 1GHz MPU, 783-FCBGA | NXP
部品番号: MPC8544EVTAQGA ✗ 生産終了MPC8544EVTAQGA 概要
A PowerQUICC III device is a Power-Architecture system-on-chip (SoC) that combines a high-performance CPU core with embedded communications peripherals. In the system hierarchy it sits at the top of the networking/comms SoC stack - above simple microcontrollers and below full application processors - and is widely deployed in routers, switches, line cards, and industrial-control platforms where deterministic packet throughput and integrated I/O matter more than raw application-processor performance.
Key features include 32-bit PowerPC e500 core with MMU and double-precision FPU, integrated DDR1/DDR2 SDRAM controller with ECC, dual 10/100/1000 Ethernet MACs, dual PCI/PCIe controllers, USB 2.0 host/device, integrated security engine (SEC 2.0) for DES/3DES/AES/SHA, signal-processing engine (SPE), and 0 to 105C extended operating temperature range. Revision 2.1 silicon is supplied in this part.
The architecture combines an e500 core with on-chip L1/L2 caches and a high-bandwidth system bus that feeds dedicated engines for networking, security, and signal processing. By offloading these workloads from the core, the MPC8544E achieves high packet throughput at lower MHz than a general-purpose CPU would require, which is critical for embedded networking designs.
Typical applications include enterprise routers and switches, DSLAM/CMTS line cards, industrial control, networked storage, and secure communications gateways. The integrated SEC and SPE blocks make it attractive for IPsec/VPN and voice-processing equipment.
When designing with this part, pay close attention to power sequencing (1.0V core, 1.8V/2.5V/3.3V I/O), the DDR2 termination topology, and reference clock jitter. Because the FCBGA package uses a 29x29 mm land pattern, PCB footprint reuse across the MPC8544 family is straightforward.
This page synthesizes distributor pricing, drop-in alternatives from the same MPC85xx family, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: MPC8544EVTAQGA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8544EVTAQGA （同一形状・フットプリント） — 相違点: Ethernet, Operating Temperature, Security Engine, Series.
MPC8544EVJAQGA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8544VTAQGA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8544EVTAQG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8544EVJAQG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8569CVJAQLJB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8544EVTAQGA 最大定格＆電気的特性
| Series | PowerQUICC III, MPC85xx |
| Core Processor | PowerPC e500 |
| Number of Cores / Bus Width | 1 Core / 32-Bit |
| Speed | 1.0 GHz |
| Co-Processors / DSP | Signal Processing; SPE, Security; SEC |
| RAM Controllers | DDR, DDR2, SDRAM |
| Graphics Acceleration | No |
| Ethernet | 10/100/1000 Mbps (1 Gbit) |
| PCI / PCIe | Dual PCI / PCI Express |
| USB | USB 2.0 |
| Security Engine | SEC 2.0 (DES/3DES/AES/SHA) |
| 電源電圧 | 1.8 V / 2.5 V / 3.3 V |
| 動作温度 | 0 C to +105 C |
| パッケージ / ケース | 783-FCBGA (29x29 mm) |
| 実装タイプ | Surface Mount |
| Silicon Revision | Rev 2.1 |
| ライフサイクル状態 | Obsolete |
MPC8544EVTAQGA 783-fcbga (29x29 mm) ピン配置ガイド
MPC8544EVTAQGA (783-fcbga (29x29 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8544EVTAQGA.
詳細は データシート をご参照ください。
主な用途
MPC8544EVTAQGA の用途: 6 件s: Enterprise Router / Switch SoC, DSLAM / CMTS Line Card Processor, Industrial Control / Networking Gateway, Networked Storage Controller, Secure VPN / IPsec Appliance, Voice / Media Processing Appliance.
Enterprise Router / Switch SoC
The MPC8544EVTAQGA's 1.0 GHz PowerPC e500 core and dual 1 Gbit Ethernet MACs make it a natural fit for enterprise router and switch control planes. The integrated DDR1/DDR2 controller with ECC provides the high-bandwidth, low-error memory fabric needed for routing-table lookups and forwarding databases, while the SEC 2.0 engine accelerates IPsec tunnel establishment and AES-GCM bulk encryption at line rate. Placed on a line card with two gigabit PHYs and a TDM/PCIe fabric interface, the device can sustain wire-speed forwarding on modest port counts. Compared with a discrete CPU plus external crypto chip, the integrated approach reduces BOM cost, board area, and the latency between the core and security engine. Power sequencing across the 1.0V core, 1.8V DDR2, and 3.3V I/O rails is the main design challenge; designers should follow NXP's reference schematics for the MPC85xx family.
おすすめ
DSLAM / CMTS Line Card Processor
In DSLAM and CMTS line cards the MPC8544EVTAQGA's signal-processing engine (SPE) offloads upstream channel modulation and downstream demodulation math from the main core. The combination of PCI/PCIe for backplane fabric connectivity and the 1 GHz core allows one MPC8544E to manage several subscriber lines while still handling control-plane housekeeping. The SEC 2.0 block provides per-subscriber encryption for secure service delivery without adding an external crypto ASIC. With a 0 to 105 C temperature range, the part tolerates the dense, passively cooled chassis typical of central-office line-card shelves. PCB layout must keep the 783-FCBGA decoupling network tight to suppress simultaneous-switching noise on the DDR2 bus at full throughput.
おすすめ
Industrial Control / Networking Gateway
The MPC8544EVTAQGA is widely deployed in industrial-control and SCADA networking gateways that must bridge fieldbus, Ethernet, and serial links while running control logic locally. Its 1.0 GHz e500 core and integrated peripherals (dual Ethernet, dual PCI/PCIe, USB 2.0 host/device) collapse what would otherwise be a multi-chip solution into a single BGA. The 0 to 105 C temperature range supports factory-floor enclosures without active cooling, and the ECC-protected DDR2 controller prevents single-event upsets in electrically noisy environments. Compared with a generic microcontroller, the MPC8544E provides deterministic throughput for protocol stacks such as Modbus/TCP, EtherNet/IP, and PROFINET. Designers should still verify watchdog-timer and brownout behavior in their BSP.
おすすめ
Networked Storage Controller
In entry-level NAS and iSCSI/SAN controllers the MPC8544EVTAQGA provides enough compute headroom to run a storage stack while driving multiple gigabit Ethernet links. The integrated DDR2 controller with ECC handles RAID parity calculations and metadata caching, while the SEC engine accelerates encrypted-volume operations. The dual PCI/PCIe lanes can host a SAS/SATA controller for disk attachment without a separate bridge chip. Operating at 1 GHz with on-chip caches, the device delivers better performance-per-watt than general-purpose CPUs in this role. Power-budget design should account for the simultaneous DDR2 + Ethernet + PCIe activity, which can push junction temperature close to the 105 C limit in sealed enclosures.
おすすめ
Secure VPN / IPsec Appliance
The SEC 2.0 engine in the MPC8544EVTAQGA accelerates DES/3DES/AES and SHA-1/SHA-256 hashing, making the part a cost-effective SoC for branch-office VPN and IPsec gateways. Combined with the 1 GHz e500 core handling IKE key exchange and routing-table updates, the device can sustain wire-speed AES-256-SHA-1 IPsec tunnels on a single gigabit link. The integrated USB 2.0 host supports 3G/4G modem failover for branch-office WAN diversity. Compared with host-based VPN on a general-purpose CPU, the hardware offload yields 3-5x lower CPU utilization and a smaller thermal envelope. Firmware integration with Linux or VxWorks networking stacks is straightforward thanks to the mature PowerQUICC BSP ecosystem.
おすすめ
Voice / Media Processing Appliance
The MPC8544EVTAQGA's signal-processing engine (SPE) accelerates voice codecs and media transcoding for VoIP gateways, IP-PBX systems, and small media servers. The 1 GHz e500 core runs the control plane and call-signaling stack, while the SPE handles G.711/G.729/SILK transcoding for hundreds of concurrent channels without CPU saturation. Dual gigabit Ethernet plus PCI/PCIe provide flexible LAN/WAN connectivity, and the DDR2 controller with ECC handles large RTP jitter buffers. Compared with a generic ARM SoC, the MPC8544E's deterministic interrupt latency and DSP-class SPE are better suited to real-time media workloads. Developers should size DDR2 bandwidth against worst-case channel count to avoid jitter-buffer underruns.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8544EVTAQGA — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8544EVJAQGA | MPC8544VTAQGA | MPC8544EVTAQG | MPC8544EVJAQG | MPC8569CVJAQLJB |
|---|---|---|---|---|---|---|
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Speed | PowerPC e500 / 1.0 GHz | PowerPC e500 / 1.0 GHz | PowerPC e500 / 1.0 GHz | PowerPC e500 / 1.0 GHz | PowerPC e500 / 1.0 GHz | PowerPC e500 / higher tier |
| SEC Engine | SEC 2.0 (DES/3DES/AES/SHA) | SEC 2.0 | No | SEC 2.0 | SEC 2.0 | SEC 3.x (higher tier) |
| SPE Engine | Yes | Yes | No | Yes | Yes | Yes |
| Operating Temperature | 0 to +105 C | -40 to +105 C (extended) | 0 to +105 C | 0 to +105 C | -40 to +105 C | -40 to +105 C |
| DDR Memory Support | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR2/DDR3 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | NRND / Last time buy |
主な差別化要因
- Integrated SEC 2.0 + SPE engines in same die （vs MPC8544VTAQGA)
- Pin-compatible drop-in to MPC8544EVJAQGA （vs MPC8544EVJAQGA)
- Lower power than higher-tier MPC85xx siblings （vs MPC8569CVJAQLJB)
設計ノート
The MPC8544EVTAQGA requires carefully sequenced power rails: 1.0 V core, then 1.8/2.5/3.3 V I/O, with strict monotonic ramp and per-rail current up to several amps. Use a multi-rail PMBus controller with explicit PowerGood feedback rather than simple LDO sequencing. Estimated worst-case core current at 1.0 GHz with all engines active is in the 3-5 A range; size the 1.0 V regulator with at least 30% margin to avoid thermal foldback.
Despite the 29x29 mm FCBGA exposing a moderate die-to-PCB thermal path, a 1.0 GHz e500 at full Ethernet + SEC + SPE load can dissipate 5-8 W. Place thermal vias directly under the BGA, stitch the inner ground planes to the die pad, and provide a top-side copper heat spreader or small heatsink in sealed enclosures. The 0 to 105 C operating range is the junction limit, so budget at least 15 C margin between measured case temperature and Tj max under worst-case airflow.
Route the DDR2 data/address/control groups as a matched-length bus with impedance-controlled traces (typically 50 ohm single-ended, 100 ohm differential for DQS). Keep DDR2 termination as close to the BGA as possible, and isolate the high-speed Ethernet and PCIe lanes from the DDR2 region with a continuous reference-plane split. The 783-FCBGA land pattern requires microvia or via-in-pad technology; standard through-hole vias will not escape the inner rows cleanly.
Do not assume SEC and SPE are mutually exclusive; both engines share bus bandwidth, so heavy concurrent use can starve the DDR2 controller. Validate clock jitter on the reference clock input - the e500 core and SERDES blocks are sensitive, and a poor jitter source will cause PCIe link-training failures. Finally, ensure boot ROM and reset configuration resistors match the chosen boot source (NOR, NAND, I2C EEPROM) before first power-up to avoid bricked boards.
コンプライアンス情報
Compliance status for the obsolete MPC8544EVTAQGA must be confirmed per lot. The part pre-dates some RoHS transition milestones; always request the manufacturer's certificate of conformance for the specific shipment. AEC-Q100 is not applicable - this is a communications SoC, not an automotive-qualified IC.