MPC8569VTANKGB - PowerQUICC III MPU, 800MHz, e500v2 SoC | NXP
部品番号: MPC8569VTANKGB ✓ 生産中MPC8569VTANKGB 概要
What is a PowerQUICC MPU? A PowerQUICC (pronounced "power-quic") is a family of communications processors that combine a Power Architecture CPU core with integrated networking, DMA, and serial RapidIO/PCI Express peripherals - effectively a System-on-Chip (SoC) for embedded networking. Within the broader taxonomy: e500v2 core -> Power Architecture -> 32-bit RISC microprocessor -> MPU/MPSoC -> semiconductor. PowerQUICC III parts like the MPC8569 are commonly positioned between general-purpose PowerPC microprocessors (e.g., MPC8536) and DSP-laden network processors, optimized for routing, switching, base-station control, and storage area network (SAN) bridging.
Key features highlighted by the verified web data include integrated SRIO (Serial RapidIO), PCIe, GbE (Gigabit Ethernet) MACs, DDR2/DDR3 memory controller with ECC, QUICC Engine (QE) for protocol acceleration, and Security Engine. The 783-FCPBGA 29x29 mm package uses a flip-chip ball grid array suitable for high-speed multi-layer PCB designs and provides adequate thermal dissipation for the typical 5-15W power envelope.
From a technical perspective, the e500v2 core implements Book E instruction set with hypervisor mode, vector/SIMD support, and double-precision FPU. The integrated Memory Controller supports DDR2/DDR3 with ECC at up to 533 MHz (per web data). The QUICC Engine is a separate RISC controller that offloads TDM, HDLC, ATM, and Ethernet bitstream processing, freeing the e500 core for higher-level software stacks such as Linux, VxWorks, or Green Hills INTEGRITY.
Typical applications include edge routers, multi-service switches, base station controllers, industrial network gateways, and storage controllers. The wide operating temperature range (0C to 105C junction, per the NXP datasheet excerpt) supports industrial environments.
When designing with this device, ensure a 6-8 layer PCB with controlled-impedance routing for DDR3, SRIO, and PCIe, plus adequate copper for thermal dissipation. The QUICC Engine firmware (uImage) must be loaded at boot from Flash or host - this is often overlooked by first-time designers and can prevent the device from initializing.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: MPC8569VTANKGB — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8569VTANKGB （同一形状・フットプリント） — 相違点: Core, Mounting Type, Operating Temperature, Package.
MPC8569VJANKGB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8569CVJANKGB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8569EVJANKGB
✅ ドロップイン価格はお問い合わせください
データシートを見る →MPC8569ECVJANKGB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8568EVJANGG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8569VTANKGB 最大定格＆電気的特性
| Architecture | PowerQUICC III, 32-bit Power Architecture e500v2 |
| Core | e500v2 (single core) |
| Maximum Core Frequency | 800 MHz |
| MIPS (estimated Dhrystone) | 2799 MIPS at 1.33 GHz (estimated; lower at 800 MHz) |
| Physical Addressing | 36-bit |
| FPU | Double-precision Floating Point + SPE |
| Memory Controller | DDR2/DDR3 with ECC |
| Integrated Peripherals | SRIO, PCIe, GbE, QE, Security Engine |
| パッケージ | 783-FCPBGA (29x29 mm) |
| 実装タイプ | Surface Mount (flip-chip BGA) |
| 動作温度 | 0C to 105C (junction) |
| Supply Voltages | 1.5V / 1.8V / 2.5V / 3.3V (multi-rail) |
| Process Technology | 0.04 um (90 nm) |
| Series | MPC85xx (PowerQUICC III) |
MPC8569VTANKGB 783-fcpbga (29x29 mm) ピン配置ガイド
MPC8569VTANKGB (783-fcpbga (29x29 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8569VTANKGB.
詳細は データシート をご参照ください。
主な用途
MPC8569VTANKGB の用途: 7 件s: Edge Router and Multi-Service Gateway, Base Station Controller / Wireless Infrastructure, Industrial Network Gateway, Storage Area Network (SAN) Controller, VoIP Media Gateway, Network-Attached Storage (NAS) Controller, Network Printer / Imaging Controller.
Edge Router and Multi-Service Gateway
The MPC8569VTANKGB's integrated SRIO, multi-port GbE, and QUICC Engine make it ideal for edge routers and multi-service gateways. The 800 MHz e500v2 core handles control-plane protocols (OSPF, BGP, MPLS) while the QUICC Engine offloads TDM/HDLC/PPP bitstream processing in legacy telecom interfaces. The integrated Security Engine accelerates IPSec and SRTP for VPN tunnels without burdening the host CPU. With DDR3 ECC memory support up to 533 MHz, the MPC8569 maintains line-rate throughput on multiple Gigabit Ethernet ports while running full routing stacks.
おすすめ
Base Station Controller / Wireless Infrastructure
In wireless base station controllers, the MPC8569VTANKGB's combination of SRIO for baseband module interconnect, GbE for backhaul, and the QUICC Engine for E1/T1 Abis interface make it a natural fit. The 800 MHz e500v2 with SPE accelerates physical-layer DSP algorithms while the integrated peripherals eliminate the need for external bridge chips. DDR3 ECC memory controller ensures reliable operation in extended-temperature outdoor enclosures (0-105C junction). The PowerQUICC III architecture has a long heritage in 3G/4G base station deployments.
おすすめ
Industrial Network Gateway
For industrial network gateways bridging Profibus, Modbus, CAN, and Ethernet networks, the MPC8569VTANKGB offers the QUICC Engine's flexible TDM support plus GbE and PCIe for industrial Ethernet protocols. The 36-bit physical addressing provides headroom for large memory maps in factory-automation controllers. The 783-FCPBGA package suits ruggedized PCB designs with proper thermal management. Linux and VxWorks BSPs from NXP simplify deployment in IEC 61131 industrial control environments.
おすすめ
Storage Area Network (SAN) Controller
The MPC8569VTANKGB's PCIe and SRIO interfaces, combined with DDR3 ECC memory and Security Engine, support iSCSI and Fibre Channel over Ethernet (FCoE) SAN controller designs. The e500v2 core with double-precision FPU accelerates RAID calculations and LUN mapping, while the QUICC Engine handles legacy SCSI/FCP protocol termination. The 800 MHz performance is sufficient for entry-level to mid-range SAN controllers in SMB and enterprise edge deployments.
おすすめ
VoIP Media Gateway
For VoIP media gateways, the MPC8569VTANKGB integrates QUICC Engine support for TDM voice circuits, GbE for SIP trunking, and the SPE for voice codec acceleration (G.711, G.729, echo cancellation). The Security Engine handles SRTP and TLS for secure SIP. With DSP firmware loading through QUICC Engine microcode, designers can support dense voice channel counts per device. The PowerQUICC III platform has established telecom heritage in carrier-grade media gateways.
おすすめ
Network-Attached Storage (NAS) Controller
The MPC8569VTANKGB with its PCIe for SAS/SATA controller attachment, GbE for network connectivity, and DDR3 ECC memory controller provides a robust platform for SMB NAS appliances. The e500v2 core runs optimized file-system stacks (ext4, Btrfs, ZFS) with hardware-accelerated checksumming. The QUICC Engine's spare cycles can manage LED status and hardware monitoring. The 783-FCPBGA package is suitable for compact NAS motherboards with proper 6-8 layer PCB stack-up.
おすすめ
Network Printer / Imaging Controller
In high-performance network printers and multifunction imaging devices, the MPC8569VTANKGB's GbE for network connectivity, PCIe for scanner/imaging pipeline, and SPE for image processing accelerate RIP rendering and page composition. The QUICC Engine can offload fax modem protocol handling. The DDR3 memory controller supports large image buffers for high-DPI page processing. The PowerQUICC III platform is proven in production printer controller designs.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8569VTANKGB — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8569VJANKGB | MPC8569CVJANKGB | MPC8569EVJANKGB | MPC8569ECVJANKGB | MPC8568EVJANGG |
|---|---|---|---|---|---|---|
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | e500v2 | e500v2 | e500v2 | e500v2 | e500v2 | e500v2 |
| Operating Temperature | 0C to 105C | Extended grade | Commercial grade | Extended grade | Commercial grade | Extended grade |
| Serial RapidIO | Yes | Yes | Yes | Yes | Yes | Yes |
| QUICC Engine | Yes | Yes | Yes | Yes | Yes | Yes |
| DDR Memory Support | DDR2/DDR3 ECC | DDR2/DDR3 ECC | DDR2/DDR3 ECC | DDR2/DDR3 ECC | DDR2/DDR3 ECC | DDR2/DDR3 ECC |
主な差別化要因
- Single-die integration of e500v2 core with QE, SRIO, PCIe, and GbE （vs MPC8536CVJAULA)
- DDR3 memory controller support （vs MPC8560VT833LC)
- 36-bit physical addressing （vs MPC8536CVJAULA)
- Double-precision FPU + SPE （vs MPC8560 family)
設計ノート
Estimated: For the 783-FCPBGA 29x29 mm package, use a minimum 6-layer PCB stack-up with continuous GND planes beneath the BGA. Fanout via microvias (4-6 mil laser-drilled) is recommended for BGA escape routing. DDR3 traces require length matching within 25 mils across byte lanes and impedance control to 50 ohms single-ended. SRIO and PCIe SerDes lanes require 100 ohm differential routing with skew under 5 ps. Allocate at least 4 signal layers plus 2 ground/power planes for a robust design.
Estimated: At typical 5-15W power dissipation, design a copper thermal pad pattern beneath the BGA with at least 25 thermal vias (0.3 mm drill, 0.5 mm pitch) connecting to internal GND layers. Consider a small heatsink with thermal resistance under 5 C/W for sealed enclosures without airflow. The 0-105C junction temperature range requires thermal margin accounting for ambient temperature and altitude derating. Verify junction temperature with the NXP thermal model under worst-case load.
The QUICC Engine requires microcode firmware (uImage) to be loaded from Flash or host at boot. Without this firmware, the QE peripherals will not initialize and the device will appear non-functional. Ensure your boot loader (U-Boot or equivalent) loads the QE firmware before activating any TDM/HDLC interfaces. Additionally, the SerDes lanes require careful PLL configuration per the reference manual - invalid lane multiplexing combinations can prevent link-up. Reference the NXP Errata document for known SRIO/PCIe issues.
The MPC8569VTANKGB requires multiple supply rails (1.5V core, 1.8V DDR, 2.5V SerDes, 3.3V I/O) with specific sequencing requirements. Power-on sequencing must be enforced to prevent latch-up - consult the datasheet for the required sequence (typically core first, then I/O). Use low-dropout regulators with enable control tied to a power-good signal. Decoupling: place 0.1 uF ceramic capacitors on every power pin within 5 mm of the BGA, plus bulk capacitors on each rail.
Place the DDR3 memory devices as close to the MPC8569 as possible to minimize trace length and preserve signal integrity. Keep SRIO and PCIe SerDes lanes away from noisy digital signals and protected by ground vias forming a Faraday cage. The QUICC Engine's TDM/HDLC serial lines should be length-matched within their respective groups. Reference the NXP hardware design checklist for the full layout review list before committing to PCB fabrication.
コンプライアンス情報
Compliance flags for RoHS, REACH, lead-free, halogen-free, and conflict minerals were not present in the provided web data excerpts. Consult NXP's official product declaration or PCN documents for current compliance status. AEC-Q100 is not applicable as this is a communications MPU not targeted at automotive.