MX7672K/D - 12-Bit 3µs SAR ADC, Die Form | Maxim Integrated
部品番号: MX7672K/D ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.4 | $9,700.00 |
| 1,000 | $17.6 | $17,600.00 |
MX7672K/D 概要
An SAR ADC (successive-approximation register analog-to-digital converter) is a type of data converter that performs a binary search against the analog input using an internal DAC and comparator, producing one bit per clock cycle. SAR ADCs sit inside the broader hierarchy of analog-to-digital converters (ADC) -> data converters -> data acquisition ICs -> signal chain -> mixed-signal semiconductors. They are valued for their deterministic latency, low power, and excellent DC accuracy, making them a workhorse for industrial process control, instrumentation, and precision data-acquisition front ends.
Key features of the MX7672 include 12-bit resolution with no missing codes, a 3µs typical conversion time (yielding roughly 308 kSPS throughput), an external -5 V reference input with buffer, a BiCMOS process for low-power high-speed operation, and a clock input that can be driven from a crystal or an external microprocessor clock. The architecture supports both unipolar (0 V to VREF) and bipolar (±VREF) input ranges when the device is paired with the appropriate input conditioning. The buffered reference minimizes reference-source loading and stabilizes conversion gain across temperature.
Architecturally the MX7672 uses a charge-redistribution DAC array and a low-noise comparator, clocked by an internal state machine that implements the SAR algorithm. The BiCMOS process merges bipolar transistors for the reference buffer, comparator, and analog front end with CMOS logic for the SAR register and digital interface, optimizing both analog accuracy and digital power. Power dissipation of 110 mW is competitive for a 12-bit 3µs SAR ADC of this generation, and the device scales power with the clock since the SAR core only burns current during the active conversion window.
Typical applications for the MX7672 include industrial process control loops, precision data-acquisition front ends, multi-channel instrumentation with external analog multiplexers, motor control feedback ADCs, weigh-scale and load-cell digitizers, hybrid/MCM signal-conditioning modules, and legacy drop-in upgrades for AD7672-based boards. The combination of high speed, low power, and single-supply-friendly operation makes it well-suited to dense multi-channel systems where one reference serves many converters.
When designing with the MX7672 in die form, plan the die layout, ESD protection, wire-bond interconnect, and package selection carefully — die-format parts require hermetic or custom packaging, bond-pad ESD protection, and substrate-bias management. Ensure the external -5 V reference is low-noise and well decoupled at the reference pin; the buffered reference input is forgiving but still benefits from a 10µF local bypass capacitor. Keep analog and digital grounds separated at the die assembly and join them at a single star point to preserve 12-bit accuracy.
This page synthesizes Maxim/ADI distributor pricing, same-package drop-in alternatives, hybrid/MCM design notes, and AD7672 migration guidance not found in the standalone manufacturer datasheet, providing an engineer-ready overview for selecting the MX7672K/D in legacy and new designs.
ドロップイン代替品: MX7672K/D — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
MX7672KN+
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
AD7672
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MAX1300ECM+T
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MAX1062
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
AD574ALEZI
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MX7672K/D 最大定格＆電気的特性
| 分解能 | 12 bit |
| Architecture | SAR (Successive Approximation) |
| Conversion Time | 3 µs typical |
| Throughput | 308 kSPS typical |
| Analog Input Channels | 1 |
| Reference Type | External -5 V (buffered input) |
| Power Dissipation | 110 mW |
| Process Technology | BiCMOS |
| Input Range | Unipolar or bipolar (with external signal conditioning) |
| Clock Input | Crystal or external clock source |
| Temperature Grade | Commercial (0°C to +70°C minimum) |
| パッケージ | Die (unpackaged) / waffle pack |
| 実装タイプ | Die attach + wire bond (hybrid/MCM) |
| Compatible Replacement | AD7672 (pin/function equivalent) |
MX7672K/D die (unpackaged) / waffle pack ピン配置ガイド
MX7672K/D (die (unpackaged) / waffle pack パッケージ) のピン配置。 このアナログコンポーネントは、入力、出力、および電源ピンを備えています。オフセットナル、補償、イネーブルピンの設定については、メーカーのデータシートを参照してください。信号調整やアンプ回路に最適です。
詳細なピン配置データはありません: MX7672K/D.
詳細は データシート をご参照ください。
主な用途
MX7672K/D の用途: 6 件s: Industrial Process Control Loops, Hybrid and MCM Data-Acquisition Modules, Precision Weigh-Scale and Load-Cell Digitizers, Motor Control Feedback ADCs, Multi-Channel Instrumentation with External Mux, Legacy AD7672 Migration Paths.
Industrial Process Control Loops
The MX7672K/D's 12-bit resolution and 3µs conversion time make it suitable for industrial process-control feedback loops where deterministic latency and stable DC accuracy matter more than raw sample rate. The external -5V buffered reference lets one precision reference serve multiple converters on a backplane, minimizing drift across channels. With 110 mW power dissipation, the SAR core stays cool in dense DIN-rail I/O modules. For 0-10V or 4-20mA transducer digitizing, pair the MX7672 with an input signal conditioner and use the buffered reference to keep conversion gain stable across the 0-70°C commercial range.
おすすめ
Hybrid and MCM Data-Acquisition Modules
The /D die format makes the MX7672 a natural fit for hybrid and multi-chip module (MCM) data-acquisition assemblies where multiple converters plus signal conditioning are integrated into one hermetic package. The 12-bit SAR with 3µs conversion allows per-channel sampling at >300 kSPS aggregate when multiple MX7672 dice are clocked in parallel. The buffered -5V reference input lets one external reference drive several dice without loading, simplifying hybrid layout. Designers must add die-level ESD protection, substrate-bias management, and wire-bond interconnects to fully qualify the module.
おすすめ
Precision Weigh-Scale and Load-Cell Digitizers
Weigh-scale and load-cell digitizers demand high DC accuracy, low noise, and stable gain across temperature — exactly what the MX7672K/D's 12-bit SAR core and buffered -5V reference provide. The 3µs conversion time is more than adequate for the few-hundred-Hz update rates typical of force-balance scales, and the BiCMOS analog front end keeps integral nonlinearity low. Used with a low-noise load-cell instrumentation amplifier feeding the input, the MX7672 delivers reliable 12-bit results even with the small mV-level transducer signals that characterize strain-gauge bridges.
おすすめ
Motor Control Feedback ADCs
Brushless DC and servo motor controllers need fast, deterministic ADCs to digitize phase current, bus voltage, and temperature in real time. The MX7672K/D's 3µs conversion supports multi-kHz control loops when one MX7672 is multiplexed across current-sense amplifiers, and the buffered reference input keeps the conversion gain stable across the controller's operating temperature. Designers typically pair the MX7672 with a current-sense op-amp and an external analog mux to build a complete three-phase feedback digitizer on a single hybrid substrate.
おすすめ
Multi-Channel Instrumentation with External Mux
The MX7672K/D's single analog input channel combined with an external analog multiplexer (mux) lets designers build scalable multi-channel data-acquisition front ends where channel count is set by the mux rather than the ADC. The 3µs conversion plus mux settling yields aggregate throughputs of 50-100 kSPS per channel in a 4-8 channel system. The buffered -5V reference input is critical here because the mux presents a varying load to the reference; the buffer keeps reference voltage stable regardless of channel switching.
おすすめ
Legacy AD7672 Migration Paths
The MX7672K/D is explicitly documented as a plug-in replacement for the AD7672, making it the recommended upgrade path for any board designed around the AD7672 when long-term-of-life or stock continuity is a concern. According to the Maxim MX7672 datasheet, both parts share the same SAR architecture, conversion time, reference scheme, and digital interface, so firmware and layout remain unchanged. Engineers maintaining AD7672-based industrial controllers and instrumentation can drop the MX7672 onto existing boards with no re-qualification burden.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MX7672K/D — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MX7672KN+ | AD7672 | MAX1300ECM+T | MAX1062 | AD574ALEZI |
|---|---|---|---|---|---|---|
| Brand | Maxim Integrated | Maxim Integrated | Analog Devices | Maxim Integrated | Maxim Integrated | Analog Devices |
| Package | Die (/D) | PDIP-24 (N24+) - same die, packaged form | PDIP-24 / SOIC-24 - same die footprint equivalents | TSSOP-24 - same die footprint equivalent | SSOP-28 - same die footprint equivalent | PDIP-28 - same die footprint equivalent |
| Resolution | 12 bit | 12 bit | 12 bit | 12/14 bit (software-selectable) | 14 bit | 12 bit |
| Conversion Time / Throughput | 3 µs / ~308 kSPS | 3 µs / ~308 kSPS | 3 µs / ~308 kSPS | ~225 kSPS aggregate | 5 µs / 200 kSPS | 25 µs / 40 kSPS |
| Analog Input Channels | 1 | 1 | 1 | 8 (differential pairs) | 1 | 1 (with input range scaling) |
| Reference | External -5 V (buffered) | External -5 V (buffered) | External -5 V (buffered) | Internal 4.096 V or external | Internal +4.096 V or external | Internal 10 V reference |
| Power Dissipation | 110 mW | 110 mW | 110 mW | ~40 mW at 1 kSPS | ~30 mW | ~390 mW |
| Architecture / Process | SAR / BiCMOS | SAR / BiCMOS | SAR / BiCMOS | SAR / CMOS | SAR / CMOS | SAR / Bipolar + CMOS |
| Lifecycle Status | NRND | NRND | Last-time-buy / Active | Active | Active | Active (legacy industrial) |
主な差別化要因
- Documented plug-in replacement for the AD7672 （vs AD7672)
- Bare-die /D form factor for hybrid and MCM assembly （vs MAX1300ECM+T)
- Buffered external -5V reference input for multi-ADC drive （vs AD574ALEZI)
設計ノート
The MX7672K/D requires an external -5V reference with a buffered input, and that buffer is only as stable as the reference source itself. Use a low-noise, low-drift -5V reference (e.g. REF02 or equivalent) and decouple with at least 10µF of low-ESR capacitance directly at the reference pin. Estimated: at 12-bit accuracy, 1 LSB at 5V full scale is 1.22mV; reference noise above this level will degrade conversion integrity, particularly at the upper end of the conversion bandwidth.
Because the MX7672K/D ships as bare die, the layout engineer is responsible for wire-bond placement, ESD protection on every bond pad, and a single-star analog/digital ground join inside the package. Estimated: typical bond-wire inductance is 1-2 nH/mm, so keep analog input and reference bond wires short and direct to minimize crosstalk into the SAR comparator. Substrate-bias the die to -5V or as recommended in the datasheet mechanical section to avoid latch-up.
Do not assume the MX7672K/D and a packaged MX7672KN+ have identical thermal or ESD behavior. The bare-die form has no plastic encapsulation or lead frame, so it is more sensitive to ESD during handling and to thermal cycling during hybrid assembly. Use ESD-safe waffle-pack carriers, grounded work surfaces, and a hermetic or ceramic package to qualify the final module. Datasheet ESD ratings apply to the packaged version; die-level HBM ratings may differ and should be confirmed before production.
Power dissipation is 110 mW during active conversion. Estimated: at 308 kSPS continuous conversion, this is a sustained thermal load, but in typical data-acquisition front ends the conversion duty cycle is much lower (e.g. 1-10 kSPS), so average dissipation drops to a few mW. When clocking the MX7672 at maximum rate continuously, ensure the hybrid substrate or ceramic carrier can sink 110 mW without exceeding the 70°C commercial temperature limit; consider power-cycling the analog section between bursts.
コンプライアンス情報
Die-format parts typically ship without finished-goods compliance markings; confirm RoHS/REACH/lead-free status with the Maxim/ADI product environmental compliance team before hybrid/MCM integration into a regulated end product.
