P1021NXN2FFB - QorIQ P1021 Dual-Core 800MHz PowerPC e500v2 MPU | NXP
部品番号: P1021NXN2FFB ⚠ ラストタイムバイP1021NXN2FFB 概要
A QorIQ communications processor is a highly-integrated system-on-chip (SoC) designed for wired and wireless networking, telecom, defense, and industrial embedded applications. The QorIQ P1 family sits within the broader NXP Power Architecture communications processor portfolio, positioned between low-power QorIQ LS series and higher-end P2/P3/P4 multi-core devices, offering balanced performance per watt for cost-sensitive networking line cards and control-plane applications.
Key features of the P1021NXN2FFB include dual e500v2 cores running up to 800 MHz, integrated triple Gigabit Ethernet controllers with hardware acceleration, DDR2/DDR3 SDRAM controller with ECC support up to 667 MHz data rate, QUICC Engine module for protocol termination, multiple PCI Express interfaces, USB 2.0 with PHY, and an extended temperature range of -40C to +125C. The extended-temperature grade makes the part suitable for industrial and outdoor networking equipment.
The P1021 uses a dual-issue superscalar e500v2 core architecture with out-of-order execution and integrated L1 caches per core, plus a shared L2 cache. The device integrates a system bus, DDR memory controller, and configurable SerDes lanes that map to combinations of PCI Express, SGMII Gigabit Ethernet, and other serial interfaces, allowing flexible board-level design.
Typical applications include industrial Ethernet switches, network routers and gateways, defense and aerospace embedded controllers, factory automation line cards, and telecom base-station control processors. The QE module enables legacy protocol termination and HDLC/PPP offload, reducing host CPU load.
When designing with the P1021NXN2FFB, ensure the 689-ball BGA has adequate PCB layer count (typically 8+ layers) for proper signal integrity on DDR3 and SerDes routing. Thermal management must account for peak TDP under dual-core load with all interfaces active, and a controlled-impedance stack-up is required for PCIe and SGMII signals.
This page synthesizes distributor pricing, drop-in alternatives, lifecycle status, and practical design notes for the P1021NXN2FFB that complement the manufacturer datasheet.
ドロップイン代替品: P1021NXN2FFB — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
P1021NXN2DFB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
P1011NSE2HFB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
P1011NXN2HFB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
P1020NXE2HFB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
P1021PSE2FDQAA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
P1021NXN2FFB 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors |
| Series | QorIQ P1 |
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 2 |
| データバス幅 | 32-bit |
| Core Frequency (max) | 800 MHz |
| 動作温度 | -40C to +125C |
| パッケージ | 689-TEPBGA II (31x31 mm) |
| Process Technology | 45 nm |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | Triple Gigabit Ethernet (eTSEC) |
| QUICC Engine | Yes (QE) |
| PCI Express | Yes (PCIe interfaces via SerDes) |
| USB | USB 2.0 |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Lead-Free Status | Lead Free |
| Packaging | Tray |
P1021NXN2FFB ピン構成
| ピン A1 | VREF_LPDDR — DDR reference voltage (per datasheet) |
| ピン B2 | GND — Common ground reference |
| ピン C3 | MDIO_CLK — Management Data Clock |
| ピン D4 | MDIO_DATA — Management Data I/O |
主な用途
P1021NXN2FFB の用途: 6 件s: Industrial Ethernet Switches and Gateways, Telecom Base Station Control Processors, Defense and Aerospace Embedded Controllers, Network Router and Gateway Line Cards, Industrial Automation Controllers and PLCs, Ruggedized IoT Edge Gateways.
Industrial Ethernet Switches and Gateways
The P1021NXN2FFB fits industrial Ethernet switch and gateway designs because its triple Gigabit Ethernet controllers with hardware acceleration offload packet processing from the host CPU. With two 800 MHz e500v2 cores plus integrated QUICC Engine protocol termination, the device handles layer-2/3 forwarding, NAT, and QoS without external co-processors. The extended -40C to +125C temperature rating supports deployment in factory floors and outdoor cabinets where ambient temperatures swing widely. The DDR2/DDR3 controller with ECC keeps packet buffers reliable in 24/7 operation, while the 45 nm process keeps typical power below 6-8 W for fanless industrial enclosures.
おすすめ
Telecom Base Station Control Processors
The P1021NXN2FFB's QUICC Engine, triple GbE, and PCI Express interfaces map directly to telecom control-plane line cards used in small-cell and macro base stations. The dual e500v2 cores handle real-time protocol stacks (HDLC, PPP, Ethernet OAM) while the QE module terminates legacy T1/E1 traffic, eliminating external framer ICs. The -40C to +125C junction rating meets outdoor cabinet and base-station shelter thermal requirements. The DDR2/DDR3 controller with ECC delivers the bandwidth needed for backhaul buffering, and the 45 nm process balances performance against the thermal envelope of sealed enclosures.
おすすめ
Defense and Aerospace Embedded Controllers
The P1021NXN2FFB suits defense and aerospace embedded controller applications because of its extended -40C to +125C temperature range, deterministic PowerPC architecture, and long-life-cycle QorIQ platform. The dual 800 MHz cores plus integrated peripherals (PCIe, USB, GbE, DDR3 with ECC) enable compact controller designs for vehicle electronics, avionics subsystems, and ruggedized field equipment. The 689-TEPBGA II package is robust to shock and vibration when properly PCB-mounted, and the integrated peripherals reduce BOM complexity versus discrete processor-plus-coprocessor architectures. ECC-protected memory and parity protection on internal buses support high-reliability mission profiles.
おすすめ
Network Router and Gateway Line Cards
The P1021NXN2FFB targets SMB and branch-office router line cards where dual-core PowerPC plus integrated GbE and PCIe deliver wire-speed packet processing without external NPUs. The 32-bit e500v2 architecture, while older than 64-bit ARM alternatives, remains well-supported by NXP's BSP and Linux SDK, simplifying software bring-up. The QUICC Engine handles legacy WAN protocols, and the DDR3 controller provides deep packet buffer memory at low cost. Designers can pair the P1021 with QorIQ LS series switches for multi-port designs, leveraging the same NXP software ecosystem across product generations.
おすすめ
Industrial Automation Controllers and PLCs
The P1021NXN2FFB works in industrial automation and PLC applications because of its deterministic e500v2 cores, extended -40C to +125C temperature rating, and rich industrial peripheral set. The triple Gigabit Ethernet supports deterministic networking protocols (EtherCAT, PROFINET, TSN) via the host CPU, while PCI Express connects to FPGA co-processors for high-speed I/O expansion. The QUICC Engine handles serial fieldbus protocols (PROFIBUS, CAN over serial) without external controllers, and the DDR3 with ECC provides reliable memory for continuous-process control loops operating 24/7 in harsh factory environments.
おすすめ
Ruggedized IoT Edge Gateways
The P1021NXN2FFB enables ruggedized IoT edge gateways in outdoor or industrial environments because its extended temperature range and integrated connectivity (triple GbE, PCIe, USB, DDR2/DDR3) reduce total BOM and power footprint. Two e500v2 cores at 800 MHz handle local analytics, protocol translation (Modbus, MQTT, OPC-UA), and encryption for data aggregation before upstream transmission. The 45 nm process keeps total SoC power below 8 W, allowing fanless thermal designs in sealed enclosures. Software compatibility with the NXP QorIQ SDK lets developers reuse BSP and security stacks across gateway variants.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: P1021NXN2FFB — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | P1021NXN2DFB | P1011NSE2HFB | P1011NXN2HFB | P1020NXE2HFB | P1021PSE2FDQAA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same |
| Number of Cores | 2 (dual-core e500v2) | 2 (dual-core) | 1 (single-core) | 1 (single-core) | 2 (dual-core) | 2 (dual-core) |
| Core Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 533 MHz (-33%) | 800 MHz |
| QUICC Engine | Yes (QE) | Yes (QE) | Yes (QE) | Yes (QE) | Yes (QE) | Yes (QE) |
| Gigabit Ethernet | Triple GbE (eTSEC) | Triple GbE | Triple GbE | Triple GbE | Triple GbE | Triple GbE |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Process Technology | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm |
主な差別化要因
- Extended -40C to +125C temperature grade in 689-TEPBGA II （vs P1021NXN2DFB)
- Dual-core 800 MHz versus 533 MHz alternative （vs P1020NXE2HFB)
- Dual-core retention versus single-core alternative （vs P1011NSE2HFB)
設計ノート
Estimated: the 689-ball TEPBGA II package on 1 mm ball pitch typically requires an 8-layer PCB stack-up with controlled-impedance routing for DDR3 (50 ohm single-ended, 100 ohm differential), PCIe (85 ohm differential), and SGMII (100 ohm differential). Use a sub-stack with reference planes for DDR3 byte lanes and SerDes, and follow NXP's P1021 hardware specification for layer assignments.
Estimated: dual-core 800 MHz operation with all peripherals active can dissipate 6-8 W, depending on DDR activity. Provide a thermal pad or copper pour under the BGA thermal balls, and verify junction temperature stays below 125C under worst-case ambient. Use the NXP thermal model or board-level simulation to confirm thermal envelope in your enclosure.
Do not assume the QUICC Engine module is identical across QorIQ P1 variants - QE feature sets differ between P1021, P1020, P1011, and P1012. Verify the specific QE channel count and protocol support against the P1021 datasheet before firmware design. Also note that the P1021NXN2FFB is in last-time-buy status; qualify a successor device in parallel.
Place DDR3/DDR2 memory devices on the same BGA side as the P1021 with matched trace lengths (within the tolerances stated in the datasheet). Keep SerDes lanes on inner layers between ground planes. Decouple each power rail with bulk ceramic capacitors close to the supply balls and follow the recommended decoupling network in the P1021 hardware design guide.
PCIe and SGMII SerDes interfaces require AC-coupled capacitive connections on each lane. Route SerDes with maximum length matching, minimize vias, and avoid stubs. For high-speed DDR3, perform simulation using IBIS models provided by NXP and follow the write/read leveling calibration procedures during bring-up.
コンプライアンス情報
RoHS compliant and lead-free per DigiKey listing. REACH, halogen-free, and conflict-minerals status not explicitly listed in the verified data.
