PIC16F1783-I/ML - 8-Bit 32MHz MCU 7KB Flash 28-QFN | Microchip
部品番号: PIC16F1783-I/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.56 | $25.60 |
| 100 | $2.27 | $227.00 |
| 500 | $2.04 | $1,020.00 |
| 1,000 | $1.78 | $1,780.00 |
PIC16F1783-I/ML 概要
An 8-bit PIC microcontroller belongs to the RISC (Reduced Instruction Set Computer) family that uses Harvard architecture with separate program and data buses, executing most instructions in a single cycle. Within the broader taxonomy, PIC16F MCUs sit between baseline PIC10/12 and PIC18/dsPIC families, balancing code density, peripheral integration and cost. The 'F' suffix denotes Flash program memory allowing in-circuit reprogramming, while the 'XLP' eXtreme Low Power designation indicates sub-uA sleep currents suitable for battery-powered products.
Key features include a 12-bit differential ADC, two 8-bit DACs, two internal op-amps, three high-speed comparators, a 16-bit PWM module, and communication peripherals (I2C, SPI, EUSART with auto-baud). The XLP design supports sleep currents below 50 nA typical with retention, making the part attractive for energy-harvesting and battery-fed sensor nodes that wake periodically to read sensors and transmit data.
The device is fabricated on a low-power CMOS process and includes an LFINTOSC selectable low-frequency internal oscillator plus HFINTOSC with 1% accuracy across the 1.8-3.6V VDD range. This dual-oscillator approach removes the external crystal in many designs and reduces BOM cost. The integrated op-amps and DACs allow sensor-conditioning signal chains to remain on-chip rather than requiring external analog components.
Typical applications include IoT sensor nodes, portable medical monitoring, LED lighting controllers, low-end motor control, battery chargers and small appliances. The wide peripheral set also supports e-metering and remote-control designs that need a low-power MCU with on-chip analog.
When designing with the PIC16F1783-I/ML, ensure the exposed pad is soldered to a sufficiently large copper pour for thermal dissipation and ground return. Decoupling caps (100 nF plus 1 uF bulk) should be placed within 3 mm of VDD/AVDD pins. Program via the ICSP interface using MPLAB X IDE and a PICkit programmer.
This page consolidates distributor pricing, drop-in alternative candidates and design notes beyond what the standalone datasheet provides, supporting faster component selection and supply-chain decisions.
ドロップイン代替品: PIC16F1783-I/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC16F1783-I/ML （同一形状・フットプリント） — 相違点: Package, ADC, Timers, DAC, Comparators.
クイック比較ツール — 並列比較する代替部品を選択:
PIC16F1782-I/ML
✅ ドロップイン✓ 在庫あり
$1.78 / 個
データシートを見る →PIC16F1788-I/ML
✅ ドロップイン✓ 在庫あり
$1.82 / 個
データシートを見る →PIC16F1786-I/ML
✅ ドロップイン✓ 在庫あり
$1.78 / 個
データシートを見る →PIC16F1716-I/ML
✅ ドロップイン✓ 在庫あり
$0.98 / 個
データシートを見る →PIC16F1776-I/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
PIC16F1768-I/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1.55 / 個
データシートを見る →PIC16F1764-I/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$0.87 / 個
データシートを見る →PIC16F1707-I/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$0.72 / 個
データシートを見る →PIC16F1783-I/ML 最大定格＆電気的特性
| Core Architecture | PIC16 enhanced mid-range 8-bit RISC |
| Program Memory (Flash) | 7 KB (4K x 14 words) |
| Data SRAM | 512 bytes |
| Data EEPROM | 256 bytes |
| Maximum CPU Speed | 32 MHz (200 ns instruction cycle) |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| ADC | 12-bit differential |
| DAC | 8-bit, 2 channels |
| Operational Amplifiers | 2 internal |
| Comparators | 3 high-speed |
| PWM | 16-bit enhanced |
| Communication | I2C, SPI, EUSART (auto-baud) |
| パッケージ | 28-pin QFN (6x6 mm) with exposed pad |
| 実装タイプ | Surface Mount |
| Operating Temperature (Industrial -I) | -40 C to +85 C |
| MSLレベル | 1 |
| RoHS ステータス | Compliant |
PIC16F1783-I/ML ピン構成
| ピン 1 | RE3/MCLR — Digital input / Master Clear reset (active low) |
| ピン 2 | RA0 — PORTA bit 0 / analog input |
| ピン 3 | RA1 — PORTA bit 1 / analog input |
| ピン 4 | RA2 — PORTA bit 2 / analog input / DAC reference |
| ピン 5 | RA3 — PORTA bit 3 / analog input |
| ピン 6 | RA4 — PORTA bit 4 |
| ピン 7 | RA5 — PORTA bit 5 |
| ピン 8 | VSS — Ground reference |
| ピン 9 | RA7 — PORTA bit 7 / oscillator |
| ピン 10 | RA6 — PORTA bit 6 / oscillator |
| ピン 11 | RC0 — PORTC bit 0 |
| ピン 12 | RC1 — PORTC bit 1 |
| ピン 13 | RC2 — PORTC bit 2 |
| ピン 14 | RC3 — PORTC bit 3 / SCL |
| ピン 15 | RC4 — PORTC bit 4 / SDA |
| ピン 16 | RC5 — PORTC bit 5 |
| ピン 17 | RC6 — PORTC bit 6 / TX |
| ピン 18 | RC7 — PORTC bit 7 / RX |
| ピン 19 | VSS — Ground reference |
| ピン 20 | VDD — Positive supply voltage |
| ピン 21 | RB0 — PORTB bit 0 / interrupt-on-change |
| ピン 22 | RB1 — PORTB bit 1 / interrupt-on-change |
| ピン 23 | RB2 — PORTB bit 2 / interrupt-on-change |
| ピン 24 | RB3 — PORTB bit 3 / interrupt-on-change |
| ピン 25 | RB4 — PORTB bit 4 / interrupt-on-change |
| ピン 26 | RB5 — PORTB bit 5 / interrupt-on-change |
| ピン 27 | RB6/ICSPCLK — PORTB bit 6 / ICSP clock |
| ピン 28 | RB7/ICSPDAT — PORTB bit 7 / ICSP data |
主な用途
PIC16F1783-I/ML の用途: 6 件s: IoT Battery Sensor Nodes, Portable Medical Monitoring, LED Lighting Controllers, Low-End BLDC and DC Motor Control, Battery Chargers and Power Banks, Small Appliance Control.
IoT Battery Sensor Nodes
The PIC16F1783-I/ML fits IoT battery sensor nodes by combining sub-uA XLP sleep current with integrated 12-bit ADC, two op-amps, and DACs that form a complete analog front-end without external components. The 32 MHz core handles sensor sampling, basic filtering, and protocol framing for LoRa, BLE, or sub-GHz transceivers via SPI. The on-chip HFINTOSC removes the external crystal, reducing BOM cost for volume-constrained IoT deployments where PCB size, BOM count and battery life are the dominant design constraints. With sleep currents below 50 nA typical, a coin-cell battery can power the node for several years at typical duty cycles.
おすすめ
Portable Medical Monitoring
For portable medical monitoring such as pulse oximeters, glucose meters, and wearable health patches, the PIC16F1783-I/ML provides an on-chip 12-bit differential ADC, two op-amps and 8-bit DACs sufficient to condition photodiode signals and drive LEDs without external analog ICs. Its XLP architecture supports sleep currents below 50 nA typical, extending battery life during idle states between measurements. The 28-pin QFN package has a 6x6 mm footprint suitable for compact wearable PCBs, while MPLAB X IDE and Code Configurator accelerate firmware development and IEC 62304 documentation. This combination enables FDA-grade Class II medical device prototypes that meet tight power budgets and small-form-factor requirements.
おすすめ
LED Lighting Controllers
The PIC16F1783-I/ML drives LED lighting controllers with its 16-bit enhanced PWM module supporting high-resolution dimming and color mixing in RGBW fixtures. The on-chip op-amps and 8-bit DACs enable closed-loop current sensing without external analog components, supporting constant-current topologies required by high-brightness LEDs. The 32 MHz instruction rate and EUSART with auto-baud allow DMX-512, DALI, or wireless protocol interfaces for smart-lighting hubs. With VDD down to 1.8V, the part operates from single-cell Li-ion or two-AA battery stacks in portable accent lighting. The 28-QFN package's small footprint suits space-constrained MR16 bulbs and linear-strip drivers.
おすすめ
Low-End BLDC and DC Motor Control
The PIC16F1783-I/ML delivers BLDC and DC motor control with its 16-bit PWM module supporting complementary outputs with programmable dead-band and hardware fault shutdown. The on-chip op-amps condition shunt-resistor current-sense signals, while the high-speed comparators trip overcurrent protection in microseconds, protecting the half-bridge drivers. At 32 MHz, the core runs sensorless BEMF detection or quadrature decoding for closed-loop speed control in fans, small pumps, and appliance motors. The 28-pin QFN footprint fits compact motor-control PCBs in appliance, robotics, and HVAC blower applications. The integrated peripherals reduce external component count compared to discrete MCU plus op-amp designs.
おすすめ
Battery Chargers and Power Banks
The PIC16F1783-I/ML supports battery chargers and power-bank applications with its 12-bit ADC measuring cell voltage and charge current through on-chip gain stages. The integrated op-amps form CC/CV loop compensation, while the 8-bit DAC sets reference thresholds for charge termination. The XLP architecture's deep-sleep modes minimize quiescent drain when the pack is idle, extending shelf life. The 28-QFN footprint allows compact PCB layouts inside the battery housing, and ICSP programming supports factory calibration of fuel-gauge parameters. Suitable for single-cell Li-ion/LiFePO4 packs, solar trickle chargers, and USB power banks with 1-2 A charge rates.
おすすめ
Small Appliance Control
The PIC16F1783-I/ML drives small appliance control boards in coffee machines, microwaves, washing machines, and air purifiers with its integrated 12-bit ADC reading temperature and humidity sensors. The 16-bit PWM module controls heating elements, fan speeds, and solenoid valves with high resolution, while op-amps buffer sensor signals for accurate closed-loop regulation. The EUSART with auto-baud simplifies Wi-Fi/BLE module integration for app-controlled smart appliances. With industrial -I temperature range (-40 to +85 C) the part operates reliably in hot appliance environments. The 28-pin QFN footprint supports compact PCB layouts typical of consumer appliance electronics.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC16F1783-I/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC16F1782-I/ML | PIC16F1788-I/ML | PIC16F1786-I/ML | PIC16F1716-I/ML |
|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 7 KB | 3.5 KB (-50%) | 28 KB (+300%) | intermediate tier | intermediate tier |
| Data SRAM | 512 bytes | 256 bytes (-50%) | 2 KB (+300%) | intermediate | intermediate |
| Maximum CPU Speed | 32 MHz | 32 MHz - same | 32 MHz - same | 32 MHz - same | 32 MHz - same |
| ADC | 12-bit | 12-bit - same | 12-bit - same | 12-bit - same | 10-bit - lower |
| Internal Op-Amps | 2 | 2 - same | 2 - same | 2 - same | fewer |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V - same | 1.8 V to 3.6 V - same | 1.8 V to 3.6 V - same | 1.8 V to 3.6 V - same |
主な差別化要因
- Integrated analog front-end eliminates external op-amps （vs PIC16F1716-I/ML)
- Higher memory tier within same package （vs PIC16F1782-I/ML)
- Lower memory tier supports cost-sensitive designs （vs PIC16F1788-I/ML)
設計ノート
Place a 100 nF ceramic decoupling capacitor within 3 mm of the VDD pin and a 1 uF bulk capacitor nearby. Add a separate 100 nF on AVDD if the application uses analog peripherals, and place a small ferrite bead between digital and analog supplies to keep switching noise out of the ADC measurements. Use the XLP sleep modes (DOZE, SLEEP with retention) to achieve sub-50 nA quiescent current; wake on RTC or interrupt-on-change to maximize battery life in IoT sensor designs.
The 28-pin QFN (6x6 mm) package relies on the exposed pad for thermal dissipation. Solder the EP to a ground copper pour at least 1 square inch in area to keep the junction temperature within safe limits under maximum CPU load. Without proper EP soldering, the thermal resistance theta_JA exceeds 80 C/W, potentially causing overheating in motor-control or continuous-sampling applications. Use multiple thermal vias under the EP to sink heat into inner ground planes.
Route the ICSP clock and data lines (RB6/RB7) with short traces and avoid running them parallel to noisy switching signals to prevent programming interference. Keep analog traces away from PWM outputs and high-current switching paths to minimize ADC noise coupling. Provide a ground ring around the QFN perimeter and stitch vias every 5-10 mm around the board edge for EMI suppression. For high-frequency oscillator pins (RA6/RA7), place the load capacitors within 2 mm of the pins to minimize stray capacitance.
Do not enable the A/D converter on pins configured as digital outputs, and always allow the acquisition time (TAD) to elapse before initiating a conversion to avoid incorrect readings. When using the internal op-amps, configure the input and feedback network before enabling the amplifier to prevent output saturation. For ICSP programming, ensure the MCLR pull-up resistor is at least 10 kohm to avoid programming conflicts, and avoid capacitive loads greater than 50 pF on RB6/RB7 during in-circuit programming.
コンプライアンス情報
RoHS compliant per Microchip product page. Industrial -I temperature grade (-40 to +85 C). Not AEC-Q100 qualified - choose PIC16F1783-I/ML automotive equivalents (e.g. AEC-Q100 grades) for automotive designs.
