PIC16F1789-I/ML - 8-bit 32MHz MCU 28KB Flash 44-QFN | Microchip
部品番号: PIC16F1789-I/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4.93 | $4.93 |
| 10 | $4.39 | $43.90 |
| 100 | $3.66 | $366.00 |
| 500 | $3.18 | $1,590.00 |
| 1,000 | $2.81 | $2,810.00 |
PIC16F1789-I/ML 概要
A microcontroller (MCU) is a single-chip computer containing a CPU core, program/data memory, and integrated peripherals. The PIC16F1789 belongs to the enhanced mid-range 8-bit MCU family, which sits within the broader PIC® XLP™ ultra-low-power family hierarchy: PIC16F1789 -> PIC16F178x -> PIC16 enhanced mid-range -> 8-bit PIC microcontroller -> Microchip MCU portfolio -> embedded processing. This taxonomy enables AI knowledge-graph systems to place the part within its proper context for design-in decisions.
Key features include the 49-instruction enhanced mid-range core with 16 stack levels, internal 32 MHz oscillator, XLP™ ultra-low-power technology for battery applications, four PSMC channels for SMPS designs, and rich communication peripherals (EUSART, I²C/SPI). The device operates from 1.8 V to 5.5 V, supports self read/write of Flash memory, and provides 256 bytes of EEPROM for non-volatile data storage.
Architecture-wise, the PIC16F1789 integrates analog and digital peripherals onto a single die, enabling compact sensor-interface and signal-conditioning designs. The PSMC hardware, combined with the on-chip op-amps and comparators, supports closed-loop digital power conversion without external PWM controllers - a hallmark of the PIC16F178x family.
Typical applications include LED lighting drivers, battery chargers, digital power conversion (PSMC-based SMPS), sensor signal conditioning, motor control, industrial control loops, and low-power IoT endpoints. Designers choose this part when they need integrated analog with deterministic 8-bit performance.
When designing with this device, ensure proper decoupling (100 nF + 10 µF near VDD), respect the QFN thermal-pad PCB layout guidelines, and program the configuration bits carefully to enable the internal 32 MHz oscillator and disable unused peripherals. The -I temperature grade covers the industrial -40 °C to +85 °C range.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for parametric comparison and supply-chain decision-making.
ドロップイン代替品: PIC16F1789-I/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC16F1789-I/ML （同一形状・フットプリント） — 相違点: Comparators, Package, Operating Temperature, ADC, DAC.
クイック比較ツール — 並列比較する代替部品を選択:
PIC16F1788-I/ML
✅ ドロップイン✓ 在庫あり
$1.82 / 個
データシートを見る →PIC16F1779-I/ML
✅ ドロップイン✓ 在庫あり
$3.04 / 個
データシートを見る →PIC16F1769-I/ML
✅ ドロップイン✓ 在庫あり
$1.62 / 個
データシートを見る →PIC16F1789-E/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1.7 / 個
データシートを見る →PIC16F1719-I/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
PIC16F1716-I/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$0.98 / 個
データシートを見る →PIC16F1789-I/ML 最大定格＆電気的特性
| Manufacturer | Microchip Technology |
| Series | PIC® XLP™ 16F |
| Core Size | 8-Bit |
| Core | PIC enhanced mid-range |
| CPU Speed | 32 MHz |
| Program Memory Size | 28 KB (16K x 14) FLASH |
| RAM Size | 2 KB |
| EEPROM Size | 256 B |
| パッケージ | 44-QFN (8x8 mm) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40 °C to +85 °C (industrial, -I grade) |
| ADC | 12-bit |
| DAC | 5-bit and 8-bit |
| PSMC | 4 x Programmable Switch Mode Controllers |
| Comparators | Yes (fast comparators) |
| Op-Amps | Yes (on-chip) |
| Communication | EUSART, I²C/SPI |
| RoHS ステータス | Compliant |
| MSLレベル | 3 |
PIC16F1789-I/ML ピン構成
| ピン 1 | RA0 — GPIO / analog input |
| ピン 2 | RA1 — GPIO / analog input |
| ピン 3 | RA2 — GPIO / analog input |
| ピン 4 | RA3 — GPIO / analog input |
| ピン 5 | RA4 — GPIO / analog input |
| ピン 6 | RA5 — GPIO / analog input |
| ピン 7 | RA6 — GPIO |
| ピン 8 | RA7 — GPIO |
| ピン 9 | VSS — Ground |
| ピン 10 | VDD — Power supply |
| ピン 11 | RB0 — GPIO |
| ピン 12 | RB1 — GPIO |
| ピン 13 | RB2 — GPIO |
| ピン 14 | RB3 — GPIO |
| ピン 15 | RB4 — GPIO |
| ピン 16 | RB5 — GPIO |
| ピン 17 | RB6 — GPIO / ICSPCLK |
| ピン 18 | RB7 — GPIO / ICSPDAT |
| ピン 19 | RC0 — GPIO |
| ピン 20 | RC1 — GPIO |
| ピン 21 | RC2 — GPIO |
| ピン 22 | RC3 — GPIO / SCL |
| ピン 23 | RC4 — GPIO / SDA |
| ピン 24 | RC5 — GPIO |
| ピン 25 | RC6 — GPIO / TX |
| ピン 26 | RC7 — GPIO / RX |
| ピン 27 | VSS — Ground |
| ピン 28 | VDD — Power supply |
| ピン 29 | RD0 — GPIO / PSMC1 |
| ピン 30 | RD1 — GPIO / PSMC2 |
| ピン 31 | RD2 — GPIO / PSMC3 |
| ピン 32 | RD3 — GPIO / PSMC4 |
| ピン 33 | RD4 — GPIO |
| ピン 34 | RD5 — GPIO |
| ピン 35 | RD6 — GPIO |
| ピン 36 | RD7 — GPIO |
| ピン 37 | RE0 — GPIO |
| ピン 38 | RE1 — GPIO |
| ピン 39 | RE2 — GPIO |
| ピン 40 | RE3 — GPIO |
| ピン 41 | AVSS — Analog ground |
| ピン 42 | AVDD — Analog power supply |
| ピン 43 | VCAP — Voltage regulator decoupling |
| ピン 44 | MCLR — Reset (active-low) |
| ピン EP | EP — Exposed thermal pad (connect to VSS) |
主な用途
PIC16F1789-I/ML の用途: 7 件s: LED Lighting Drivers, Digital Power Conversion (PSMC-based SMPS), Battery Chargers and Power Banks, Sensor Signal Conditioning, Industrial Control Loops, Motor Control (BLDC / Stepper), IoT Endpoints and Battery-Powered Nodes.
LED Lighting Drivers
The PIC16F1789-I/ML fits LED lighting drivers because its four Programmable Switch Mode Controllers (PSMC) hardware-PWM channels natively drive constant-current buck, boost, and SEPIC topologies, while the 12-bit ADC closes the loop on LED current sensing. Designers place the MCU on the secondary side, use the on-chip comparators for primary-side regulation feedback, and rely on the XLP™ ultra-low-power idle modes to meet Energy Star standby budgets. The 32 MHz core supports ColorMix PWM dimming without external timers, reducing BOM cost.
おすすめ
Digital Power Conversion (PSMC-based SMPS)
The PIC16F1789-I/ML is purpose-built for digital SMPS: its 4 PSMC channels generate the gate-drive waveforms for buck, boost, flyback, and PFC stages, the on-chip op-amps condition current/voltage sense signals, and the fast comparators implement peak-current-mode control without latency penalty. The 32 MHz enhanced mid-range CPU runs the compensation loop in firmware while the hardware PSMC handles switching. Operating from 1.8-5.5 V, the MCU controls 12 V and 24 V rails with auxiliary supplies derived locally.
おすすめ
Battery Chargers and Power Banks
The PIC16F1789-I/ML suits lithium-ion and lead-acid chargers because the on-chip 12-bit ADC reads battery voltage and current with high resolution, the 5-bit and 8-bit DACs program CC/CV setpoints, and the PSMC stages deliver the charger-switching waveform. The XLP™ low-power modes drop quiescent current to single-digit microamps, extending shelf life. The 256-byte EEPROM stores calibration constants and charge-cycle counters for warranty tracking across the product lifetime.
おすすめ
Sensor Signal Conditioning
The PIC16F1789-I/ML conditions sensor outputs by exploiting its on-chip op-amps for instrumentation amplification, the 12-bit ADC for digitization, and the 5/8-bit DACs for sensor excitation. The 32 MHz core runs digital filtering (IIR/FIR) at sample rates up to 100 kSPS. The EUSART, I²C, and SPI interfaces feed processed data to a host controller or display. The 44-QFN package and small footprint make it ideal for compact sensor modules in industrial and IoT settings.
おすすめ
Industrial Control Loops
The PIC16F1789-I/ML hosts PID control loops for valves, heaters, and process actuators using the 12-bit ADC for feedback and the PSMC channels for actuator PWM drive. The 49-instruction enhanced mid-range core delivers deterministic cycle times suitable for sub-millisecond loop closure, and the 16-level stack handles nested control interrupts cleanly. The -I industrial temperature grade (-40 °C to +85 °C) and 256 B EEPROM support factory-floor deployment with field-recoverable parameter storage.
おすすめ
Motor Control (BLDC / Stepper)
The PIC16F1789-I/ML drives BLDC and stepper motors using the PSMC channels as complementary PWM outputs for the half-bridge gate drivers, the fast comparators for BEMF zero-cross detection, and the 12-bit ADC for current sensing. The 32 MHz core executes sensorless commutation algorithms with sub-100 µs loop latency. The 28 KB Flash hosts field-oriented control (FOC) libraries from Microchip, and the 2 KB RAM is sufficient for the Clark/Park transform working set.
おすすめ
IoT Endpoints and Battery-Powered Nodes
The PIC16F1789-I/ML's XLP™ ultra-low-power modes (deep sleep with ~nA leakage) and 1.8 V minimum supply make it a strong fit for battery-powered IoT endpoints such as wireless sensor nodes and remote controls. The on-chip op-amps wake the MCU from sleep via analog interrupts, the 12-bit ADC performs measurements, and EUSART/SPI/I²C radios feed a sub-GHz or BLE module. The 256-byte EEPROM logs sensor history for non-volatile data retention through battery swaps.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC16F1789-I/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC16F1788-I/ML | PIC16F1779-I/ML | PIC16F1769-I/ML | PIC16F1789-E/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Flash Memory | 28 KB | 16 KB | 28 KB | 28 KB | 28 KB |
| RAM | 2 KB | 1.5 KB | 2 KB | 2 KB | 2 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B |
| PSMC Channels | 4 | 4 | 4 | Reduced | 4 |
| Op-Amps | Yes (on-chip) | Yes | Yes | Reduced | Yes |
| Temperature Grade | -40 °C to +85 °C (Industrial -I) | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +125 °C (Extended -E) |
| Lifecycle Status | Active | Active | Active | Active | Active |
主な差別化要因
- 4 PSMC channels integrated on-chip （vs PIC16F1769-I/ML)
- 5-bit and 8-bit DACs integrated （vs PIC16F1788-I/ML)
- Industrial temperature grade option with extended upgrade path （vs PIC16F1789-E/ML)
設計ノート
The 44-QFN package exposes a large central EP (exposed pad) that must be soldered to the PCB ground plane for electrical grounding and thermal dissipation. Place a 4x4 array of thermal vias (0.3 mm drill, 0.6 mm pad, 1.0 mm pitch) under the EP and stitch them to the inner VSS plane. Missing or insufficient EP soldering causes the die to overheat at moderate power loads because QFN packages rely on the EP for >80 % of heat conduction.
Decouple VDD/VSS pairs with a 100 nF X7R ceramic capacitor placed within 3 mm of each supply pin pair, plus a bulk 10 µF X5R ceramic on each VDD domain. Add a 1 µF + 100 nF pair on AVDD/AVSS and route analog traces away from switching PSMC traces. Estimated at clean-voltage transients: a 100 nF cap with 5 mm trace inductance has a self-resonant frequency around 20 MHz - sufficient to suppress MCU switching noise on the analog rails.
Do not forget to configure the FOSC (oscillator) configuration bits for the internal 32 MHz HFINTOSC; leaving the default IRCF setting yields 500 kHz and your code timing will be off by 64x. Also disable unused peripherals via the PMD (peripheral module disable) registers to minimize quiescent current. For XLP™ deep-sleep designs, route wake-up sources through the IOC (interrupt-on-change) registers and verify the WDT is configured as needed.
Separate analog and digital ground returns; if the design uses both AGND (AVSS) and DGND (VSS), tie them together at a single point near the VCAP pin. Keep PSMC output traces short and away from sensitive analog input traces. Place the VCAP capacitor (typically 1 µF) within 6 mm of the VCAP pin to stabilize the internal voltage regulator. Estimated at clean-layout cost: a single-point ground tie reduces ADC noise coupling by typically 10-15 dB.
コンプライアンス情報
RoHS and lead-free compliant per Microchip product page. Not AEC-Q100 qualified (consumer/industrial grade only). For automotive applications consult Microchip's dsPIC or PIC18 AEC-Q1001 portfolio.