PIC16F18323-E/SL - 8-bit 32MHz 3.5KB Flash MCU | Microchip
部品番号: PIC16F18323-E/SL ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1.487 | $1.49 |
PIC16F18323-E/SL 概要
An 8-bit microcontroller (MCU) is a microprocessor integrated with memory, I/O, and peripherals on a single chip. It belongs to the broader taxonomy: 8-bit MCU → microcontroller → embedded processor → semiconductor device. The PIC architecture uses a Harvard RISC design with a 14-bit instruction word optimized for deterministic execution and low power consumption. The XLP (eXtreme Low Power) variants such as this one target battery-powered and energy-constrained designs where sleep current and active efficiency dominate BOM cost.
Key features include Core Independent Peripherals (CIPs) that operate without CPU intervention, reducing firmware complexity and power. The 10-bit ADC with computation automates averaging and threshold detection. PPS allows flexible remapping of digital peripherals to any I/O pin, simplifying PCB layout. The device operates from 2.3V to 5.5V and offers nanoWatt XLP sleep modes below 50 nA typical, enabling years of operation from coin-cell batteries.
Technically, the PIC16F18323 uses an enhanced mid-range core with 49 instructions, hardware multiplier, and interrupt controller supporting 16 sources. The CIP ecosystem (CLC, NCO, CWG) enables analog-style signal synthesis entirely in hardware, freeing the CPU for application logic. The integrated temperature indicator and bandgap reference support ratiometric measurements without external components.
Typical applications include IoT sensor nodes, battery-powered wireless transmitters, consumer appliances, LED lighting controllers, and general-purpose embedded control. The 14-pin SOIC footprint and broad PIC16 ecosystem make it well-suited for cost-sensitive designs requiring XLP-class standby current.
Designers should leverage PIC's MPLAB X IDE and XC8 compiler for development. For lowest power, route wake-up events through CLC or IOC and keep ADC active only during acquisition windows. Verify PPS mapping constraints in the device datasheet before finalizing pin assignments.
ドロップイン代替品: PIC16F18323-E/SL — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC16F18323-E/SL （同一形状・フットプリント） — 相違点: ADC, Package, I/O Pins, Operating Temperature, Core.
クイック比較ツール — 並列比較する代替部品を選択:
PIC16F18323-I/SL
✅ ドロップイン✓ 在庫あり
$0.78 / 個
データシートを見る →PIC16F18323T-E/SL
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC16F18323-E/ST
✅ ドロップイン✓ 在庫あり
$0.74 / 個
データシートを見る →PIC16F1823-E/SL
✅ ドロップイン✓ 在庫あり
$0.55 / 個
データシートを見る →PIC16F1823-I/SL
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC16F18323-E/SL 最大定格＆電気的特性
| Core | PIC16 8-bit enhanced mid-range |
| Program Memory (Flash) | 3.5 KB (2K x 14 words) |
| Data SRAM | 256 bytes |
| Data EEPROM | 256 bytes |
| Maximum Clock Speed | 32 MHz |
| Operating Voltage Range | 2.3 V to 5.5 V |
| 動作温度範囲 | -40°C to +125°C (Extended) |
| ADC | 10-bit, multiple channels |
| DAC | 5-bit |
| PWM | 10-bit |
| Comparators | Yes |
| I/O Pins | 12 (max) |
| パッケージ | 14-SOIC (SL) |
| ピン数 | 14 |
| 実装タイプ | Surface Mount |
| Peripheral Pin Select (PPS) | Yes |
| Core Independent Peripherals | CLC, NCO, CWG, CCP |
| XLP Sleep Current | < 50 nA typical (nanoWatt) |
| RoHS ステータス | Compliant |
PIC16F18323-E/SL ピン構成
| ピン 1 | RA5 — Bidirectional I/O / analog input / ICSPDAT |
| ピン 2 | RA4 — Bidirectional I/O / analog input |
| ピン 3 | RA3 — Bidirectional I/O / analog input / MCLR (reset) |
| ピン 4 | RA2 — Bidirectional I/O / analog input |
| ピン 5 | RA1 — Bidirectional I/O / analog input / ICSPCLK |
| ピン 6 | RA0 — Bidirectional I/O / analog input |
| ピン 7 | VSS — Ground reference |
| ピン 8 | RC5 — Bidirectional I/O |
| ピン 9 | RC4 — Bidirectional I/O |
| ピン 10 | RC3 — Bidirectional I/O |
| ピン 11 | RC2 — Bidirectional I/O |
| ピン 12 | RC1 — Bidirectional I/O |
| ピン 13 | RC0 — Bidirectional I/O |
| ピン 14 | VDD — Positive power supply (2.3V to 5.5V) |
主な用途
PIC16F18323-E/SL の用途: 6 件s: IoT Sensor Nodes, Battery-Powered Wireless Transmitters, Consumer Appliance Controls, LED Lighting Controllers, General-Purpose Embedded Control, Capacitive Touch Sensing.
IoT Sensor Nodes
The PIC16F18323-E/SL is well-suited for IoT sensor nodes due to its nanoWatt XLP sleep current below 50 nA typical and 2.3V-5.5V operating range. The 10-bit ADC with computation, 5-bit DAC, and temperature indicator enable direct ratiometric measurement of analog sensors (temperature, humidity, light) without external components. With 3.5 KB of Flash and Core Independent Peripherals like the CLC and CWG, the MCU stays asleep while generating motor control or signal conditioning in hardware. A complete coin-cell-powered node can run 5+ years from a CR2032 by duty-cycling sensor reads every 30 seconds.
おすすめ
Battery-Powered Wireless Transmitters
For Sub-GHz or BLE beacon designs, the PIC16F18323-E/SL serves as a low-power host controller that wakes a radio module on event triggers from its CLC or Interrupt-on-Change. Its 256 B SRAM is sufficient for short packet buffering, while 256 B EEPROM stores calibration constants and pairing keys without external memory. The Extended -40°C to +125°C temperature grade allows outdoor enclosure use. At full 32 MHz active current (~3 mA typical) and 50 nA sleep, average system draw remains in the microamp range for years on two AA batteries.
おすすめ
Consumer Appliance Controls
The PIC16F18323-E/SL integrates motor control (CWG), PWM generation, ADC, and timers in a 14-pin SOIC package suitable for small home appliances like fans, coffee makers, and humidifiers. The Peripheral Pin Select flexibility allows PCB layout freedom, while the 10-bit PWM provides precise motor speed or heater control. The Extended temperature grade supports under-hood or near-heat-source operation. With 32 MHz CPU performance, the MCU handles user interface button scanning, status LED driving, and closed-loop control simultaneously without breaking a sweat.
おすすめ
LED Lighting Controllers
The PIC16F18323-E/SL drives multi-channel LED lighting with its 10-bit PWM, CLC for fade/blend logic, and CWG for complementary PWM with dead-band control. Designers can implement dimming curves, color mixing, and thermal derating entirely in hardware CIPs, leaving the CPU free for communication (UART/DALI/SPI). The 5-bit DAC can bias constant-current LED drivers directly. With 256 B EEPROM, custom lighting scenes persist across power cycles, making the part ideal for architectural and entertainment lighting fixtures.
おすすめ
General-Purpose Embedded Control
As a general-purpose MCU, the PIC16F18323-E/SL handles tasks like button debouncing, LCD/LED multiplexing, UART bridging, and protocol conversion in industrial and consumer products. The 14-pin SOIC package and 32 MHz performance suit designs needing UART, SPI, and I2C communication alongside ADC monitoring. PPS allows these peripherals to be remapped post-layout, reducing respins. With nanoWatt XLP sleep modes and 2.3V-5.5V operation, this MCU also fits solar-powered remote installations.
おすすめ
Capacitive Touch Sensing
The PIC16F18323-E/SL implements capacitive touch buttons using its CLC, timers, and mTouch Core proprietary libraries, eliminating dedicated touch ICs. The mTouch Core Peripheral handles scan timing and hardware averaging, while the CPU processes decisions on wake. Up to 12 I/O support multiple touch zones on small panels. PPS routes the touch channels to any pin, simplifying PCB sensor routing. NanoWatt sleep between touches keeps standby draw below 1 µA.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC16F18323-E/SL — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC16F18323-I/SL | PIC16F18323T-E/SL | PIC16F18323-E/ST | PIC16F1823-E/SL | PIC16F1823-I/SL |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 14-SOIC (SL) | 14-SOIC - same | 14-SOIC - same | 14-TSSOP (ST) - same footprint | 14-SOIC - same | 14-SOIC - same |
| Flash Memory | 3.5 KB | 3.5 KB | 3.5 KB | 3.5 KB | 2 KB | 2 KB |
| SRAM | 256 B | 256 B | 256 B | 256 B | 128 B | 128 B |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| Core Independent Peripherals | CLC, NCO, CWG, CCP | CLC, NCO, CWG, CCP | CLC, NCO, CWG, CCP | CLC, NCO, CWG, CCP | CCP only | CCP only |
| Peripheral Pin Select | Yes | Yes | Yes | Yes | No | No |
| Temperature Range | -40°C to +125°C (E) | -40°C to +85°C (I) | -40°C to +125°C (E) | -40°C to +125°C (E) | -40°C to +125°C (E) | -40°C to +85°C (I) |
主な差別化要因
- Industrial temperature grade option for cost-sensitive designs （vs PIC16F18323-I/SL)
- Same die across SOIC, TSSOP, and tape/reel SKUs （vs PIC16F18323-E/ST)
- Modern CIP ecosystem absent in legacy family （vs PIC16F1823-E/SL)
設計ノート
Estimated: At 32 MHz active current ~3 mA and 50 nA sleep current, the PIC16F18323-E/SL average current at 0.1% duty cycle is ~3 µA. A CR2032 coin cell (220 mAh) can power the device for ~80,000 hours (>9 years) at this duty cycle. For deeper battery life, place the MCU in Sleep mode whenever possible and wake via IOC, CLC, or RTCC. Disable unused peripherals in firmware writing and clear PPS assignments for unused I/O to avoid floating pin current.
Place a 100 nF decoupling capacitor as close as possible to the VDD pin (pin 14). Add a 10 µF bulk capacitor near the IC for transient load handling. For ICSP programming, leave RA0 (ICSPCLK) and RA1 (ICSPDAT) accessible via test pads or header. MCLR (pin 3) requires a 10 kΩ pull-up to VDD for reliable operation; add a 100 nF capacitor to ground for noise immunity per Microchip recommendations.
Do not exceed the absolute maximum ratings of 6.5 V on VDD or inject current beyond ±25 mA on any I/O pin. Configure PPS only on supported pins per the pin allocation table; assigning peripherals to unsupported pins is silently ignored. When migrating from PIC16F1823 to PIC16F18323, register and configuration bit locations differ; review linker scripts and config settings. Always issue a delay after enabling the ADC to allow acquisition time before reading conversion results.
Route the analog signals (RA0-RA5) away from switching nodes like the PWM output (RC2-RC5) to minimize digital noise on ADC conversions. If using both analog and digital on adjacent pins, add a digital-ground guard trace between them. The exposed pad of the SOIC is not present, so copper pours around the device improve thermal dissipation but are not electrically required.
コンプライアンス情報
RoHS and REACH compliant per Microchip product environmental compliance documentation. Not AEC-Q100 qualified; for automotive designs requiring AEC-Q100, evaluate PIC16F18323-E/SLVAO variant or migrate to AEC-Q100-qualified PIC16F18446 series.
