PIC18LF24K22T-I/ML - 16KB Flash 8-bit MCU, 64MHz, QFN-28
部品番号: PIC18LF24K22T-I/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3.85 | $3.85 |
| 10 | $3.62 | $36.20 |
| 100 | $3.25 | $325.00 |
| 500 | $2.9 | $1,450.00 |
| 1,000 | $2.55 | $2,550.00 |
PIC18LF24K22T-I/ML 概要
A microcontroller is the programmable central processing unit of any embedded system, combining CPU, memory, peripherals and interrupt logic on a single silicon die. Within Microchip's portfolio, the PIC18F K-series sits in the mid-range 8-bit segment above the baseline PIC16 family and below the 16-bit dsPIC and 32-bit PIC32 families. The LF sub-series denotes the low-VDD variant, while the trailing K22 denotes the 16 KB Flash tier of the PIC18F K22 family. The 'T' suffix in this MPN denotes Tape & Reel packaging and 'I/ML' specifies the industrial temperature grade (-40C to +85C) and the 28-pin ML/QFN package.
Key features include: 16 KB Flash (8K x 16), 768 B SRAM, 256 B EEPROM, 25 I/O pins, 12-bit ADC with computation features (ADC2), CTMU charge-time measurement, mTouch capacitive touch support, and nanoWatt XLP power management with multiple idle, sleep and deep-sleep modes. The integrated bootloader removes timer functionality only when the dedicated software bootloader is in use; the part otherwise offers a full suite of timers.
Typical applications include battery-powered IoT sensor nodes, wearable health and fitness electronics, low-power wireless sensor accessories, industrial sensor conditioning, USB-to-UART bridges using the EUSART, and ultra-low-power remote controls. Design consideration: the QFN-28 package requires thermal pad soldering for proper ground connectivity; the exposed pad (EP) must be soldered to the board ground plane to meet the datasheet thermal and electrical specifications.
This page synthesizes distributor pricing, drop-in alternatives within the same QFN-28 footprint, and practical low-power design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: PIC18LF24K22T-I/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC18LF24K22T-I/ML （同一形状・フットプリント） — 相違点: Package, ADC, Core Architecture, I/O Pins, Program Memory (Flash).
クイック比較ツール — 並列比較する代替部品を選択:
PIC18LF24K22-I/ML
✅ ドロップイン✓ 在庫あり
$2.98 / 個
データシートを見る →PIC18LF24K22-I/SO
✅ ドロップイン✓ 在庫あり
$1.75 / 個
データシートを見る →PIC18LF24K22-I/MV
✅ ドロップイン✓ 在庫あり
$1.9 / 個
データシートを見る →PIC18LF24K22-E/SO
✅ ドロップイン✓ 在庫あり
$1.32 / 個
データシートを見る →PIC18LF23K22T-I/ML
✅ ドロップイン✓ 在庫あり
$1.92 / 個
データシートを見る →PIC18LF23K22T-I/SO
✅ ドロップイン✓ 在庫あり
$1.55 / 個
データシートを見る →PIC18F24K22-I/ML
✅ ドロップイン✓ 在庫あり
$2.55 / 個
データシートを見る →PIC18LF24K22T-I/ML 最大定格＆電気的特性
| Family | PIC18 K-series (PIC18F/LF K22) |
| Core | PIC18 8-bit RISC |
| Program Memory (Flash) | 16 KB (8K x 16) |
| Data SRAM | 768 bytes |
| Data EEPROM | 256 bytes |
| Max CPU Frequency | 64 MHz (16 MIPS) |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| I/O Pins | 25 |
| ADC | 12-bit, up to 19 channels, ADC2 with computation |
| Comparators | 2 analog comparators |
| Timers | Four 8/16-bit timers |
| CCP/ECCP Modules | 3 |
| Communication | 2x MSSP (SPI/I2C), 2x EUSART (LIN-capable) |
| パッケージ | 28-QFN (6x6 mm) with Exposed Pad |
| 動作温度 | -40 C to +85 C (Industrial) |
| 実装タイプ | Surface Mount |
| MSLレベル | 3 |
| RoHS ステータス | Compliant |
PIC18LF24K22T-I/ML ピン構成
| ピン 1 | MCLR/RE3 — Master Clear (reset) input or digital input only on RE3 |
| ピン 2 | RA0/AN0 — Digital I/O A:0 / Analog input channel 0 |
| ピン 3 | RA1/AN1 — Digital I/O A:1 / Analog input channel 1 |
| ピン 4 | RA2/AN2 — Digital I/O A:2 / Analog input channel 2 |
| ピン 5 | RA3/AN3 — Digital I/O A:3 / Analog input channel 3 |
| ピン 6 | RA4 — Digital I/O A:4 (no analog) |
| ピン 7 | RA5/AN4 — Digital I/O A:5 / Analog input channel 4 |
| ピン 8 | RE0/AN5 — Digital I/O E:0 / Analog input channel 5 |
| ピン 9 | RE1/AN6 — Digital I/O E:1 / Analog input channel 6 |
| ピン 10 | RE2/AN7 — Digital I/O E:2 / Analog input channel 7 |
| ピン 11 | VDD — Positive supply voltage (1.8 V to 3.6 V) |
| ピン 12 | VSS — Ground reference |
| ピン 13 | RA7/OSC1 — Digital I/O A:7 / Crystal oscillator input |
| ピン 14 | RA6/OSC2 — Digital I/O A:6 / Crystal oscillator output |
| ピン 15 | RC0/SOSCO — Digital I/O C:0 / SOSC oscillator output |
| ピン 16 | RC1/SOSCI — Digital I/O C:1 / SOSC oscillator input |
| ピン 17 | RC2/CCP1 — Digital I/O C:2 / CCP1 PWM output |
| ピン 18 | RC3/SCL — Digital I/O C:3 / I2C clock (MSSP) |
| ピン 19 | RC4/SDA — Digital I/O C:4 / I2C data (MSSP) |
| ピン 20 | RC5/SDO — Digital I/O C:5 / SPI data out (MSSP) |
| ピン 21 | RC6/TX/CK — Digital I/O C:6 / EUSART TX / clock |
| ピン 22 | RC7/RX/DT — Digital I/O C:7 / EUSART RX / data |
| ピン 23 | RD0 — Digital I/O D:0 |
| ピン 24 | RD1 — Digital I/O D:1 |
| ピン 25 | RD2 — Digital I/O D:2 |
| ピン 26 | RD3 — Digital I/O D:3 |
| ピン 27 | RB0/AN8 — Digital I/O B:0 / Analog input channel 8 / interrupt-on-change |
| ピン 28 | EP — Exposed thermal pad - must be soldered to ground plane |
主な用途
PIC18LF24K22T-I/ML の用途: 6 件s: Battery-Powered IoT Sensor Node, Wearable Health Monitor, Industrial Sensor Conditioning, Low-Power Remote Control, USB-to-UART Bridge, Capacitive Touch User Interface.
Battery-Powered IoT Sensor Node
The PIC18LF24K22T-I/ML is well-suited for battery-powered IoT sensor nodes that transmit periodic telemetry over LoRa, BLE or sub-GHz radios. Its 1.8 V to 3.6 V VDD range allows direct connection to a single CR2032 coin cell or 2x AA alkaline cells without a boost converter, while the nanoWatt XLP sleep current below 50 nA typical (per Microchip datasheet DS39984) extends battery life to multiple years. The 12-bit ADC with 19 channels and the integrated CTMU enable direct interface to resistive, capacitive and analog sensors, while the 64 MHz CPU executes the radio stack and sensor-fusion algorithms in real time. Designers commonly pair this MCU with sub-GHz transceivers such as the Microchip MRF89XA or BLE modules like the RN4870 to build wireless sensor endpoints.
おすすめ
Wearable Health Monitor
Wearables for health and fitness monitoring benefit from the PIC18LF24K22T-I/ML's combination of ultra-low-power sleep modes and integrated mTouch capacitive touch sensing. The device can stay in deep sleep with RTCC retention between sensor samples, waking only for sub-millisecond measurement intervals to read optical heart-rate or SpO2 sensors. The 12-bit ADC with computation features (ADC2) provides averaging and threshold detection without CPU intervention, saving additional energy. The 28-QFN (6x6 mm) package footprint fits comfortably inside a wristband form factor while the 1.8 V minimum VDD supports direct operation from small Li-ion or Li-polymer batteries. Designers pair this MCU with optical biosensors such as the MAX30102 to deliver multi-parameter fitness tracking.
おすすめ
Industrial Sensor Conditioning
Industrial 4-20 mA loop-powered transmitters and remote sensor conditioning modules often use the PIC18LF24K22T-I/ML for its 12-bit ADC accuracy and low-power operation. The wide operating voltage from 1.8 V to 3.6 V enables direct power from a 3.3 V LDO fed by a loop-derived supply, while the wide industrial temperature range (-40C to +85C) handles factory floor environments. The two EUSART ports support RS-485 or LIN communication, and the dual MSSP ports handle SPI sensors and I2C peripherals concurrently. This makes the part a versatile choice for pressure, temperature and flow sensor transmitters requiring modest computation and low standby current in line-powered or battery-backed installations.
おすすめ
Low-Power Remote Control
Battery-powered remote controls for consumer electronics, garage doors and industrial cranes benefit from the PIC18LF24K22T-I/ML's mTouch capacitive sensing, ultra-low sleep current, and IR modulation capability via CCP/ECCP. The MCU can remain in deep sleep until a capacitive touch or button press wakes it, then transmit via PWM-driven IR LED or sub-GHz radio. The 1.8 V minimum supply allows coin-cell operation for years without battery replacement. The 28-QFN package keeps the design compact, while the 16 KB Flash easily accommodates RF stack and user-interface firmware. This is a common architecture for low-cost universal remote controls and wireless key fobs.
おすすめ
USB-to-UART Bridge
The PIC18LF24K22T-I/ML implements a USB-to-UART bridge when paired with a USB 2.0 Full-Speed transceiver. The dual EUSART ports support RS-232, RS-485 and LIN interfaces, while the integrated 12-bit ADC and timers provide auxiliary GPIO and PWM for LED status indication. The 64 MHz core delivers ample throughput for UART baud rates up to 1 Mbaud without CPU bottleneck. Its low 1.8 V minimum supply enables bus-powered or self-powered designs with simple LDO regulators. Designers commonly build CDC-ACM virtual COM port bridges using the Microchip USB stack, turning this MCU into a drop-in replacement for commercial bridges.
おすすめ
Capacitive Touch User Interface
The PIC18LF24K22T-I/ML integrates Microchip's mTouch capacitive touch sensing module with the CTMU (Charge Time Measurement Unit), enabling up to 25 touch electrodes without external touch ICs. This makes the part ideal for kitchen appliances, automotive interior controls and IoT devices that need sealed-button interfaces. The 12-bit ADC with computation features supports proximity and slider gestures, while the 16 KB Flash easily accommodates touch firmware libraries. The 28-QFN package minimizes PCB area in space-constrained products and the LF variant's 1.8 V minimum supply supports direct battery connection. The hardware CTMU provides noise-robust touch performance even in high-EMI environments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC18LF24K22T-I/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC18LF24K22-I/ML | PIC18LF23K22T-I/ML | PIC18F24K22-I/ML |
|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) - tape & reel | 28-QFN (6x6 mm) - tray | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 16 KB | 16 KB | 8 KB | 16 KB |
| SRAM | 768 bytes | 768 bytes | 768 bytes | 768 bytes |
| EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Max Frequency | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) |
| VDD Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.4 V to 5.5 V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
主な差別化要因
- Lowest VDD floor in the K22 family （vs PIC18F24K22-I/ML)
- 16 KB Flash tier vs lower-density siblings （vs PIC18LF23K22T-I/ML)
- Tape & reel packaging for high-volume assembly （vs PIC18LF24K22-I/ML)
設計ノート
The 28-QFN (ML) package has an exposed thermal pad (EP, pin 28) that MUST be soldered to the PCB ground plane for proper thermal dissipation, mechanical reliability and electrical ground reference. According to Microchip datasheet DS39984, omitting the EP solder connection can cause thermal runaway, EMI issues and unreliable operation. Use sufficient micro-via stitching (typically 9-12 vias) under the EP for optimal thermal performance.
Estimated: at VDD=3.3 V, CPU=64 MHz, IO load=10 mA, total active current is approximately 8 mA. To extend battery life, use Sleep mode (under 50 nA typical per datasheet DS39984) and only enable peripherals on demand. For applications averaging <1% duty cycle, average current can fall below 100 uA, extending a CR2032 coin cell life beyond five years.
Place a 100 nF decoupling capacitor as close as possible to the VDD pin (pin 11) with a short trace. Add a 10 uF tantalum or electrolytic bulk capacitor on the VSS plane near the MCU. For ADC accuracy, isolate analog VDD from digital VDD with a ferrite bead and add a dedicated 100 nF cap to the AVVDD pin (not present on 28-QFN, use filtered digital VDD).
コンプライアンス情報
Industrial temperature grade only (-40C to +85C). AEC-Q100 automotive variants are not available in this MPN family - choose PIC18F K22 Q1 suffixes for automotive.
